公开(公告)号：WO03007312A3

公开(公告)日：2003-08-14

申请号：PCT/US0215870

申请日：2002-05-20

Applicant: FRY METALS INC

Inventor： SREERAM ATTIGANAL N ,  LEWIS BRIAN ,  HOZER LESZEK ,  LIBERATORE MICHAEL JAMES ,  MINOGUE GERARD

IPC: B23K35/24 ,  B23K35/14 ,  B23K35/30 ,  B23K35/36 ,  C22C5/02 ,  C22C28/00 ,  H01L23/373 ,  H01L23/42 ,  C22C32/00

CPC classification number: H01L23/42 ,  B23K35/302 ,  B23K35/3066 ,  B23K35/3602 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/433 ,  H01L2224/73253 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01066 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A thermal interface material for use in electronic packaging, the thermal interface material comprises a solder with relatively high heat flow characteristics and a CTE modifying component to reduce or prevent damage due to thermal cycling. The thermal interface material comprises an active solder that contains indium and an intrinsic oxygen getter selected from the group consisting of alkali metals, alkaline-earth metals, refractory metals, rare earth metals and zinc and mixtures and alloys thereof. Lastly, damage due to an electronic package due to thermal cycling stress is reduced by using an insert in a lid of an electronic device package wherein the insert has a coefficient of thermal expansion that is between about that of the lid and about that of a semiconductor substrate.

Abstract translation: 用于电子封装的热界面材料，热界面材料包括具有相对高热流特性的焊料和CTE改性组分，以减少或防止由于热循环引起的损伤。 热界面材料包括含有铟的活性焊料和选自碱金属，碱土金属，难熔金属，稀土金属和锌的本征氧吸气剂及其混合物和合金。 最后，通过在电子设备封装的盖子中使用插入件来减少由于热循环应力而导致的电子封装的损坏，其中插入件的热膨胀系数在盖子的大约和半导体的盖子之间 基质。

公开(公告)号：WO2005007919A3

公开(公告)日：2005-07-21

申请号：PCT/US2004022079

申请日：2004-07-09

Applicant: FRY METALS INC ,  ARORA SANYOGITA ,  MINOGUE GERARD

Inventor： ARORA SANYOGITA ,  MINOGUE GERARD

IPC: B05D7/00 ,  B22F1/00 ,  B23K35/34 ,  B32B5/16 ,  C23C20060101 ,  H05K3/34

CPC classification number: B22F1/0062 ,  B22F1/0059 ,  B22F2998/00 ,  B23K35/34 ,  H05K3/3484 ,  H05K2201/0224 ,  H05K2203/0425 ,  H05K2203/105 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the coating medium thereon with a charge director medium to impart a positive or negative charge thereto and thereby render the particles electrostatically or electrokinetically mobile. Electrostatically and electrokinetically mobile particles for use in an electrostatic or electrokinetic deposition process. The particles include a coating medium and a charge director on particle bodies.

Abstract translation: 制备颗粒以保留电荷的方法，使得颗粒呈静电或电动方式移动。 该方法包括用促进电荷导向剂材料附着的涂覆介质涂覆颗粒，并用电荷导向介质使颗粒与其上的涂覆介质接触，以向其施加正电荷或负电荷，从而使颗粒静电或电动移动 。 用于静电或电动沉积工艺的静电和电动移动颗粒。 颗粒包括涂覆介质和颗粒体上的电荷导向剂。

公开(公告)号：WO2005033352A3

公开(公告)日：2005-07-14

申请号：PCT/US2004022143

申请日：2004-07-09

Applicant: FRY METALS INC ,  LEWIS BRIAN G ,  SINGH BAWA ,  DETIG ROBERT H ,  MINOGUE GERARD ,  EBERLEIN DIETMAR C ,  REILLY KENNETH ,  MARCZI MICHAEL

Inventor： LEWIS BRIAN G ,  SINGH BAWA ,  DETIG ROBERT H ,  MINOGUE GERARD ,  EBERLEIN DIETMAR C ,  REILLY KENNETH ,  MARCZI MICHAEL

IPC: B01J19/08 ,  B05D1/06 ,  B05D1/32 ,  B23K3/06 ,  C23C20060101 ,  H01L21/288 ,  H01L21/48 ,  H01L21/60 ,  H05K3/34

CPC classification number: H05K3/3484 ,  B23K3/0607 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/4853 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03622 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/11005 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/11442 ,  H01L2224/116 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01049 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/12042 ,  H05K3/3478 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0425 ,  H05K2203/0776 ,  H05K2203/09 ,  H05K2203/105 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means. A method for applying metal particles such as solder metal in a pattern to an electronic device substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means.

Abstract translation: 通过电动或静电方式直接或通过使用中间工具将图案中的颗粒施加到基底上的方法。 通过电动或静电方式直接或通过使用中间工具将金属颗粒（例如焊料金属）以图案施加到电子器件基板的方法。