公开(公告)号：WO2005006361A2

公开(公告)日：2005-01-20

申请号：PCT/US2004/018164

申请日：2004-06-03

Applicant: INTEL CORPORATION

Inventor： HOULE, Sabina ,  DANI, Ashay

IPC: H01G

CPC classification number: B23K1/0016 ,  B23K2201/42 ,  H01L23/3733 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  Y10T428/249933 ,  H01L2224/0401

Abstract: A process of making a multi-layer thermal interface material is depicted. The multi-layer thermal interface material is attached between an integrated heat spreader and a die. Processing of the multi-layer thermal interface material includes stamping or other pressure processing.

Abstract translation: 描述了制造多层热界面材料的方法。 多层热界面材料连接在集成散热器和模具之间。 多层热界面材料的加工包括冲压或其他压力加工。

公开(公告)号：WO2003034489A1

公开(公告)日：2003-04-24

申请号：PCT/US2002/033422

申请日：2002-10-17

Applicant: INTEL CORPORATION

Inventor： RUMER, Christopher ,  KONING, Paul ,  JAYARAMAN, Saikumar ,  DANI, Ashay

IPC: H01L23/42

CPC classification number: H01L24/29 ,  H01L23/3737 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/16152 ,  Y10S428/913 ,  Y10T428/1225 ,  Y10T428/12701 ,  Y10T428/12896 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/258 ,  Y10T428/2982 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31663 ,  Y10T428/31692 ,  H01L2924/00 ,  H01L2924/01022 ,  H01L2924/01034 ,  H01L2924/01083 ,  H01L2224/29099 ,  H01L2924/00014 ,  H01L2924/0503 ,  H01L2924/05032 ,  H01L2924/04642 ,  H01L2924/05432 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: A thermal interface material is described for thermal coupling of an electronic component to a thermally conductive member. The thermal interface material includes a viscoelastic polymer matrix material, fusible solder particles in the matrix material, and filler particles in the matrix material. The solder particles have a melting temperature below a selected temperature (e.g. 157°C for indium) and the filler particles have a melting temperature substantially above the selected temperature (e.g. 961°C for silver). The filler particles keep the thermal interface material intact under adverse thermal and stress conditions.

Abstract translation: 描述了热界面材料用于将电子部件热耦合到导热部件。 热界面材料包括粘弹性聚合物基质材料，基质材料中的易熔焊料颗粒和基质材料中的填料颗粒。 焊料颗粒的熔融温度低于所选择的温度（例如铟的157℃），并且填料颗粒具有基本上高于所选温度的熔融温度（例如银的961℃）。 填料颗粒在不利的热和应力条件下保持热界面材料完好无损。