公开(公告)号：WO2002026479A3

公开(公告)日：2002-04-04

申请号：PCT/US2001/030352

申请日：2001-09-26

Applicant: INTEL CORPORATION ,  HOULE, Sabina ,  CHRYSLER, Gregory ,  KONING, Paul

Inventor： HOULE, Sabina ,  CHRYSLER, Gregory ,  KONING, Paul

IPC: B29C70/30

Abstract: A heat spreader (305), comprised of a plurality of carbon fibers oriented in a plurality of directions, with a carbon or metal matrix material dispersed about the fibers, is described. The carbon fibers facilitate the spreading of heat away from the smaller semiconductor device (303) and up to a larger heat removal device, such as a heat sink (306).

公开(公告)号：WO2007140365A2

公开(公告)日：2007-12-06

申请号：PCT/US2007/069882

申请日：2007-05-29

Applicant: INTEL CORPORATION ,  PRAKASH, Anna ,  LEBONHEUR, Vassoudevane ,  LEHMAN, Stephen ,  KONING, Paul

Inventor： PRAKASH, Anna ,  LEBONHEUR, Vassoudevane ,  LEHMAN, Stephen ,  KONING, Paul

IPC: B23K35/36 ,  H05K3/34

CPC classification number: B23K35/3618 ,  H05K3/3489

Abstract: A composition, a method, and a system for a solder flux are disclosed herein. In various embodiments, a solder flux composition may comprise a surfactant and less than about 20% of a carboxylic acid. In some of these embodiments, the solder flux composition may be used in lead-free soldering processes.

Abstract translation: 本文公开了焊剂的组成，方法和系统。 在各种实施方案中，助焊剂组合物可以包含表面活性剂和小于约20％的羧酸。 在这些实施例的一些中，焊剂组合物可用于无铅焊接工艺中。

公开(公告)号：WO2006007281A1

公开(公告)日：2006-01-19

申请号：PCT/US2005/019718

申请日：2005-06-03

Applicant: INTEL CORPORATION (a Delaware corporation) ,  MARTIN, Edward ,  KONING, Paul

Inventor： MARTIN, Edward ,  KONING, Paul

IPC: H01L21/48

CPC classification number: H01L21/4867 ,  H01L23/49866 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/742 ,  H01L2924/01322 ,  H05K3/3484 ,  H05K2203/043 ,  H01L2924/00014

Abstract: Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having characteristic that the deposited solder paste bricks (214) substantially retain their geometric shape upon exposure to UV radiation before solder paste reflow.

Abstract translation: 描述了形成集成电路封装的焊料凸点的方法。 焊膏由具有以下特征的材料形成，其特征在于，在焊膏回流之前，当暴露于UV辐射时，沉积的焊膏砖（214）基本上保持其几何形状。

公开(公告)号：WO2005013362A1

公开(公告)日：2005-02-10

申请号：PCT/US2004/024269

申请日：2004-07-28

Applicant: INTEL CORPORATION ,  MATAYABAS, James ,  KONING, Paul

Inventor： MATAYABAS, James ,  KONING, Paul

IPC: H01L23/373

CPC classification number: C09K5/063 ,  H01L23/3737 ,  H01L23/4275 ,  H01L24/29 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/32245 ,  H01L2224/8385 ,  H01L2924/14 ,  H01L2924/00

Abstract: An embodiment of a phase change TIM of this invention comprises a polyester matrix with melting temperature near or below operating temperature (typically less than about 130°C), thermally conductive filler with bulk thermal conductivity greater than about 50 W/mK, and optionally other additives. The polyester resin has improved thermo-oxidative stability compared to the polyolefin resins, thereby providing improved reliability performance during test.

Abstract translation: 本发明的相变TIM的实施方案包括熔融温度接近或低于工作温度（通常小于约130℃）的聚酯基质，体积导热率大于约50W / mK的导热填料，以及任选其它 添加剂。 与聚烯烃树脂相比，聚酯树脂具有改善的热氧化稳定性，从而在测试期间提供改进的可靠性。

公开(公告)号：WO2003034489A1

公开(公告)日：2003-04-24

申请号：PCT/US2002/033422

申请日：2002-10-17

Applicant: INTEL CORPORATION

Inventor： RUMER, Christopher ,  KONING, Paul ,  JAYARAMAN, Saikumar ,  DANI, Ashay

IPC: H01L23/42

CPC classification number: H01L24/29 ,  H01L23/3737 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/16152 ,  Y10S428/913 ,  Y10T428/1225 ,  Y10T428/12701 ,  Y10T428/12896 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/258 ,  Y10T428/2982 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31663 ,  Y10T428/31692 ,  H01L2924/00 ,  H01L2924/01022 ,  H01L2924/01034 ,  H01L2924/01083 ,  H01L2224/29099 ,  H01L2924/00014 ,  H01L2924/0503 ,  H01L2924/05032 ,  H01L2924/04642 ,  H01L2924/05432 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: A thermal interface material is described for thermal coupling of an electronic component to a thermally conductive member. The thermal interface material includes a viscoelastic polymer matrix material, fusible solder particles in the matrix material, and filler particles in the matrix material. The solder particles have a melting temperature below a selected temperature (e.g. 157°C for indium) and the filler particles have a melting temperature substantially above the selected temperature (e.g. 961°C for silver). The filler particles keep the thermal interface material intact under adverse thermal and stress conditions.

Abstract translation: 描述了热界面材料用于将电子部件热耦合到导热部件。 热界面材料包括粘弹性聚合物基质材料，基质材料中的易熔焊料颗粒和基质材料中的填料颗粒。 焊料颗粒的熔融温度低于所选择的温度（例如铟的157℃），并且填料颗粒具有基本上高于所选温度的熔融温度（例如银的961℃）。 填料颗粒在不利的热和应力条件下保持热界面材料完好无损。