Abstract:
An alloy particle, characterized in that it contains no lead, has a plurality of melting points including an initial minimum melting point (a) and an maximum melting point, has the initial minimum melting point (a) al least in a surface portion, and exhibits an elevated minimum melting point (a') higher than the initial minimum melting point (a) after it is heated to a temperature of the initial minimum melting point (a) or higher to melt it at least at the surface portion and then is cooled to room temperature to thereby solidify the molten portion.
Abstract:
A construct for heating a food item in a microwave oven comprises a base (102), a wall (104) extending upwardly from the base (102), a microwave energy shielding element (108) overlying at least a portion of the wall (104), and a microwave energy diffusing element (112) circumscribed by the microwave energy shielding element (108), where the microwave energy diffusing element (112) includes a plurality of microwave energy reflective elements (116) within a microwave energy transparent area (114).
Abstract:
A metal/resin composite obtained by uniting and bonding a metal shape and a thermoplastic resin shape by injection molding (injection bonding), wherein the accuracy of the perpendicularity of the thermoplastic resin shape to the metal shape has been improved. The metal/resin composite (40) comprises a metal shape (20) and a thermoplastic resin shape united with and bonded to one side of the metal shape (20) through injection molding. The thermoplastic resin shape comprises a pedestal (42) and a boss part (41) vertically disposed on this pedestal (42). The pedestal (42) has runners (43) which are connected to the pedestal (42) through two gates and through which a molten thermoplastic resin injected from an injection gate (45) is introduced into the boss part (41). Thus, the thermoplastic resin injected from the injection gate (45) approximately evenly flows into opposed parts of the boss part (41) through the gates (47) and fills the boss part (41). Due to this constitution, the boss part (41) can be bonded perpendicularly to the metal shape (20) by injection bonding.
Abstract:
A thermal interface material is described for thermal coupling of an electronic component to a thermally conductive member. The thermal interface material includes a viscoelastic polymer matrix material, fusible solder particles in the matrix material, and filler particles in the matrix material. The solder particles have a melting temperature below a selected temperature (e.g. 157°C for indium) and the filler particles have a melting temperature substantially above the selected temperature (e.g. 961°C for silver). The filler particles keep the thermal interface material intact under adverse thermal and stress conditions.
Abstract:
The invention relates to thermoplastic polymer blends containing at least one polycarbonate and at least one mould-release agent with at least one polyol component. The inventive polymer blends are characterised in that at least one polyol component (I) consists of a base body with 4 or more carbon atoms, 3 or more, preferably 4 or more hydroxyl groups, more than one hydroxyl group which is esterified with aliphatic carboxylic acids and one or preferably, more than one free hydroxyl group.
Abstract:
Multilayer polymeric films and other optical bodies are provided which are useful in making colored mirrors and polarizers. The films are characterized by a change in color as a function of viewing angle.