公开(公告)号：WO1994007263A1

公开(公告)日：1994-03-31

申请号：PCT/US1993008215

申请日：1993-09-02

Applicant: OLIN CORPORATION

Inventor： OLIN CORPORATION ,  MAHULIKAR, Deepak ,  BRADEN, Jeffrey, S. ,  CHEN, Szuchain, F.

IPC: H01L23/02

CPC classification number: H01L24/83 ,  H01L23/315 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/86 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/83856 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: There is provided a molded plastic electronic package (40) having improved thermal dissipation. A heat spreader (26), formed from aluminum or an aluminum alloy, is partially encapsulated in the molding resin (30). Forming a black anodization layer (42) on the surface of the heat spreader (26) improves both thermal dissipation and adhesion to the molding resin.

Abstract translation: 提供了具有改进的热耗散的模制塑料电子封装（40）。 由铝或铝合金形成的散热器（26）被部分包封在模塑树脂（30）中。 在散热器（26）的表面上形成黑色阳极氧化层（42）改善了散热和对模制树脂的粘附。

公开(公告)号：WO2005081657A2

公开(公告)日：2005-09-09

申请号：PCT/US2004/015703

申请日：2004-05-19

Applicant: OLIN CORPORATION

Inventor： BRENNEMAN, William, L. ,  CHEN, Szuchain, F. ,  CHESKIS, Harvey, P.

IPC: B32B15/04 ,  C25D3/56 ,  C25D7/06 ,  C25D9/08 ,  C25D11/38 ,  H05K3/00 ,  H05K3/38

CPC classification number: H05K3/384 ,  B32B15/04 ,  C23C2222/20 ,  C25D3/56 ,  C25D7/0614 ,  C25D9/08 ,  C25D11/38 ,  H01L21/4846 ,  H01L21/486 ,  H05K3/0035 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2201/2054 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12993 ,  Y10T428/31678

Abstract: A copper foil (96) for lamination to a dielectric substrate (92) is coated with a laser ablation inhibiting layer (100) having an average surface roughness (R Z ) of less than 1.0 micron and an average nodule height of less than 1.2 micron that is effective to provide a lamination peel strength to FR-4 of at least 80.4 grams per millimeter (4.5 pounds per inch). The coated foil (96) further has a reflectivity value of at least 40. The coated foil (96) is typically laminated to a dielectric substrate (92), such as glass reinforced epoxy or polyimide and imaged into a plurality of circuit traces. Blind vias (98) may be drilled through the dielectric (92) terminating at an interface between the foil (96) and the dielectric (92). The coated foil (96) of the invention resists laser ablation, thereby resisting piercing (102) of the foil (96) by the laser during drilling.

Abstract translation: 用于层叠到电介质基板（92）的铜箔（96）涂覆有平均表面粗糙度（RZ）小于1.0微米且平均结节高度小于1.2微米的激光消融抑制层（100），其中 对FR-4的层压剥离强度至少为80.4克/毫米（4.5磅/英寸）是有效的。 涂覆的箔（96）还具有至少40的反射率值。涂覆的箔（96）通常层压到电介质基底（92），例如玻璃增强的环氧树脂或聚酰亚胺并成像为多个电路迹线。 盲孔（98）可以穿过终止于箔（96）和电介质（92）之间的界面处的电介质（92）。 本发明的涂覆箔（96）抵抗激光烧蚀，从而在钻孔期间通过激光器抵抗箔（96）的刺穿（102）。

公开(公告)号：WO2005042807A1

公开(公告)日：2005-05-12

申请号：PCT/US2004/034192

申请日：2004-10-15

Applicant: OLIN CORPORATION

Inventor： BRENNEMAN, William, L. ,  CHEN, Szuchain, F.

IPC: C25D7/00

CPC classification number: C25D7/0614 ,  C23C26/00 ,  H05K3/025 ,  H05K2203/1105 ,  Y10T428/12 ,  Y10T428/12438 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/265

Abstract: A composite material (20) useful for the manufacture of a circuit has a support layer (12'), a metal foil (16) layer having opposing first and second sides and a thickness of 15 microns or less and a release layer (14) effective to facilitate separation of the metal foil layer (16) from the support layer (12'), the release layer (14) disposed between and contacting both the support layer (12') and the metal foil layer (16). A reactive element containing layer (22), which may be the support layer (12'), effective to react with gaseous elements or compounds to form thermally stable compounds contacts the release layer (14). The composite material (20) is preferably subjected to a low temperature heat treatment. The combination of the low temperature heat treatment and the reactive element containing layer (22) results in reduced defects including blisters in the copper foil (16) during subsequent processing.

Abstract translation: 可用于制造电路的复合材料（20）具有支撑层（12'），具有相对的第一和第二侧面以及15微米或更小的厚度的金属箔（16）层和释放层（14） 有效促进金属箔层（16）与支撑层（12'）分离，释放层（14）设置在支撑层（12'）和金属箔层（16）之间并与之接触。 有效地与气态元素或化合物反应以形成热稳定化合物的可反应元件容纳层（22）可以是支撑层（12'）与释放层（14）接触。 复合材料（20）优选进行低温热处理。 低温热处理和含活性元素层（22）的组合导致在随后的处理期间包括铜箔（16）中的起泡的缺陷减少。

公开(公告)号：WO2005021836A2

公开(公告)日：2005-03-10

申请号：PCT/US2004/028188

申请日：2004-08-31

Applicant: OLIN CORPORATION

Inventor： HOWELL, Leonard, R. ,  CHEN, Szuchain, F.

IPC: C23F

CPC classification number: C23C22/40 ,  C25D3/565 ,  H05K3/282 ,  H05K3/385 ,  H05K2203/135 ,  Y10S428/901 ,  Y10S428/935 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12792 ,  Y10T428/1291 ,  Y10T428/12993 ,  Y10T428/31678

Abstract: The present invention is directed to an aqueous, antitarnish and adhesion promoting treatment composition, comprising: zinc ions; metal ions selected from the group consisting of tungsten ions, molybdenum ions, cobalt ions, nickel ions, zirconium ions, titanium ions, manganese ions, vanadium ions, iron ions, tin ions, indium ions, silver ions, and combinations thereof; and optionally, an electrolyte that does not contain potassium or sodium ions; wherein the treatment composition is substantially free of chromium, and wherein the treatment composition forms a coating on a substrate or material that enhances adhesion of a polymer to the material. The present invention is also directed to materials coated with the above treatment composition, and methods of coating materials using the above composition.

Abstract translation: 本发明涉及一种水性，抗磨损和粘附促进处理组合物，其包含：锌离子; 选自钨离子，钼离子，钴离子，镍离子，锆离子，钛离子，锰离子，钒离子，铁离子，锡离子，铟离子，银离子及其组合的金属离子; 和任选的不含钾或钠离子的电解质; 其中所述处理组合物基本上不含铬，并且其中所述处理组合物在增强聚合物与所述材料的粘附性的基材或材料上形成涂层。 本发明还涉及用上述处理组合物涂覆的材料，以及使用上述组合物涂覆材料的方法。

公开(公告)号：WO2005038989A2

公开(公告)日：2005-04-28

申请号：PCT/US2004/034692

申请日：2004-10-13

Applicant: OLIN CORPORATION, a corporation organized under the laws of the Commonwealth of Virginia

Inventor： CHEN, Szuchain, F. ,  LASIUK, Nicole, A. ,  GERFEN, John, E. ,  ROBINSON, Peter, W. ,  KHAN, Abid, A.

IPC: H01R

CPC classification number: H01L23/49582 ,  C23C2/02 ,  C23C28/021 ,  C23C28/023 ,  C23C28/025 ,  C23C28/321 ,  C23C28/322 ,  C23C28/3225 ,  C23C28/345 ,  C23C28/3455 ,  C23C28/347 ,  C25D5/10 ,  C25D5/12 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/181 ,  H01R13/03 ,  H05K3/244 ,  Y10T428/1259 ,  Y10T428/12611 ,  Y10T428/12715 ,  Y10T428/12896 ,  H01L2924/00 ,  H01L2924/207 ,  H01L2924/00014 ,  H01L2924/2075 ,  H01L2924/00012

Abstract: A coated electrically conductive substrate (26) where there are multiple closely spaced leads (10) and tin whiskers constitute a potential short circuit. Such substrates (26) include leadframes, terminal pins and circuit traces. This electrically conductive substrate (26) has a plurality of leads (16) separated by a distance (14) capable of bridging by a tin whisker, a silver or silver-base alloy layer (28) coating at least one surface, and a fine grain tin or tin-base alloy layer (30) directly coating said silver layer. An alternative coated electrically conductive substrate (26) has particular utility where debris from fretting wear may oxidize and increase electrical resistivity, such as in a connector assembly. This electrically conductive substrate (26) has a barrier layer (32) deposited on the substrate (26). Subsequently deposited layers include a sacrificial layer (34) deposited on the barrier layer (32)that is effective to form intermetallic compounds with tin, a low resistivity oxide metal layer (40) and an outermost layer (36) of tin or a tin-base alloy. The barrier layer (32) is preferably nickel or a nickel-base alloy and the low resisitivity oxide metal layer (40) is preferably silver or a silver-base alloy.

Abstract translation: 其中存在多个紧密间隔的引线（10）和锡晶须的涂覆的导电基底（26）构成潜在的短路。 这种衬底（26）包括引线框，端子引脚和电路迹线。 该导电衬底（26）具有多个引线（16），其间隔开能够由锡晶须桥接的距离（14），涂覆至少一个表面的银或银基合金层（28）和细微的 谷物锡或锡基合金层（30）直接涂覆所述银层。 替代的涂覆导电衬底（26）具有特别的用途，其中来自微动磨损的碎屑可能氧化并增加电阻率，例如在连接器组件中。 该导电衬底（26）具有沉积在衬底（26）上的阻挡层（32）。 随后沉积的层包括沉积在阻挡层（32）上的牺牲层（34），其有效地与锡形成金属间化合物，低电阻率的氧化物金属层（40）和锡或锡 - 锡的最外层（36） 基体合金。 阻挡层（32）优选为镍或镍基合金，低电阻率氧化物金属层（40）优选为银或银基合金。

公开(公告)号：WO2004053193A1

公开(公告)日：2004-06-24

申请号：PCT/US2003/038592

申请日：2003-12-05

Applicant: OLIN CORPORATION

Inventor： BRENNEMAN, William, L. ,  VACCO, Andrew, J. ,  CHEN, Szuchain, F.

IPC: C23C22/24

CPC classification number: B32B15/04 ,  B32B15/20 ,  B32B2305/07 ,  B32B2307/204 ,  B32B2311/12 ,  B32B2457/08 ,  C23C2222/20 ,  C25D3/56 ,  C25D7/0614 ,  C25D9/08 ,  C25D11/38 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12514 ,  Y10T428/12535 ,  Y10T428/12611 ,  Y10T428/12618 ,  Y10T428/31678

Abstract: In one aspect, a copper foil (14, 60) for lamination to a dielectric substrate (62) includes a layer (64) deposited on a surface of the copper foil (14, 60). The layer (64) is formed from chromium and zinc ions or oxides and is treated with an aqueous solution containing at least 0.5% silane. In another aspect, a peel strength enhancement coating (64) is disposed between a copper foil (14, 60) laminate and a dielectric substrate (62). The peel strength enhancement coating (64) comprises a metal and metal oxide mixture containing a metal selected from groups 5B, 6B, and 7B of the periodic table of the elements. The effective thickness of the peel strength enhancement coating (64) is that thickness capable of providing less than or equal to 10% loss of peel strength, when measured in accordance with IPC-TM-650 Method 2.4.8.5 using a 1/8 inch wide test specimen, after being immersed in 4N HCl at about 60°C for 6 hours.

Abstract translation: 一方面，用于层压到电介质基板（62）的铜箔（14,60）包括沉积在铜箔（14,60）的表面上的层（64）。 层（64）由铬和锌离子或氧化物形成，并用含有至少0.5％硅烷的水溶液处理。 另一方面，剥离强度增强涂层（64）设置在铜箔（14,60）层压体和电介质衬底（62）之间。 剥离强度增强涂层（64）包括含有选自元素周期表的5B，6B和7B族的金属的金属和金属氧化物混合物。 剥离强度增强涂层（64）的有效厚度是当根据IPC-TM-650方法2.4.8.5使用1/8英寸测量时能够提供小于或等于10％的剥离强度损失的厚度 在大约60℃下浸入4N HCl中6小时后，

公开(公告)号：WO2003022569A1

公开(公告)日：2003-03-20

申请号：PCT/US2002/027703

申请日：2002-08-30

Applicant: OLIN CORPORATION

Inventor： CHEN, Szuchain, F. ,  BRENNEMAN, William, L. ,  VACCO, Andrew ,  YUKOV, Nina

IPC: B32B15/20

CPC classification number: H05K3/384 ,  C25D1/04 ,  H05K3/025 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12535 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12993 ,  Y10T428/265

Abstract: A composite material (10), comprising a carrier strip (12), the carrier strip (12) comprising a first side, the first side comprising a substantially uniform roughness, an electrolytically deposited copper foil layer (14) having opposing first and second sides and a thickness of from 0.1 micron to 15 microns. The entire copper foil layer (14) thickness having been deposited from a copper containing alkaline electrolyte, and a release layer (16) effective to facilitate separation of the copper foil layer (14) from the carrier strip (12) disposed between and contacting both the first side of the carrier strip (12) and the second side of the copper foil layer (14).

Abstract translation: 一种复合材料（10），包括载体条（12），所述载体条（12）包括第一侧，所述第一侧包含基本均匀的粗糙度，电解沉积铜箔层（14）具有相对的第一和第二侧 厚度为0.1微米至15微米。 整个铜箔层（14）的厚度已经由含铜的碱性电解质沉积，以及有利于便于将铜箔层（14）与载体带（12）分离的隔离层（16） 载体带（12）的第一面和铜箔层（14）的第二面。