公开(公告)号：WO2008076428A1

公开(公告)日：2008-06-26

申请号：PCT/US2007/025841

申请日：2007-12-17

Applicant: TESSERA INTERCONNECT MATERIALS, INC. ,  ENDO, Kimitaka

Inventor： ENDO, Kimitaka

IPC: H01L23/538 ,  H01L23/50 ,  H01L21/48

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/50 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H05K1/0231 ,  H05K1/188 ,  H05K3/243 ,  H05K3/328 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/10636 ,  H05K2203/0369 ,  H05K2203/0384 ,  Y02P70/611 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A multiple wiring layer interconnection element (100) includes capacitors (110) or other electrical components embedded between a first exposed wiring layer (120) and a second exposed wiring layer (122) of the interconnection element (100). Internal wiring layers (124) and (126) are provided between exposed surfaces (112) of the respective capacitors (110), the internal wiring layers being electrically insulated from the capacitors (110) by dielectric layers (114) and (116), respectively. The internal wiring layers (124), (126) are isolated from each other by an internal dielectric layer (130). Conductive vias (132) provide conductive interconnection between the two internal wiring layers (124, 126). A method of fabricating a multiple wiring layer interconnection element is also provided.

Abstract translation: 多个布线层互连元件（100）包括电容器（110）或嵌入在互连元件（100）的第一暴露布线层（120）和第二暴露布线层（122）之间的其它电气部件。 内部布线层（124）和（126）设置在相应电容器（110）的暴露表面（112）之间，内部布线层通过电介质层（114）和（116）与电容器（110）电绝缘， 分别。 内部布线层（124），（126）通过内部电介质层（130）彼此隔离。 导电通孔（132）在两个内部布线层（124,126）之间提供导电互连。 还提供了制造多重布线层互连元件的方法。

公开(公告)号：WO2010021685A1

公开(公告)日：2010-02-25

申请号：PCT/US2009/004694

申请日：2009-08-14

Applicant: TESSERA INTERCONNECT MATERIALS, INC. ,  HABA, Belgacem ,  RYU, Chang, Myung ,  ENDO, Kimitaka ,  WADE, Christopher, Paul

Inventor： HABA, Belgacem ,  RYU, Chang, Myung ,  ENDO, Kimitaka ,  WADE, Christopher, Paul

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L24/89 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13017 ,  H01L2224/13021 ,  H01L2224/13609 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An interconnection element 110 can include a substrate, e.g., a connection substrate, element of a package, circuit panel or microelectronic substrate, e.g., semiconductor chip, the substrate having a plurality of metal conductive elements such as conductive pads 112, contacts, bond pads, traces, or the like exposed at the surface. A plurality of solid metal posts 130 may overlie and project away from respective ones of the conductive elements. An intermetallic layer 121 can be disposed between the posts and the conductive elements, such layer providing electrically conductive interconnection between the posts 130 and the conductive elements 112. Bases of the posts adjacent to the intermetallic layer can be aligned with the intermetallic layer.

Abstract translation: 互连元件110可以包括衬底，例如连接衬底，封装的元件，电路板或微电子衬底，例如半导体芯片，衬底具有多个金属导电元件，例如导电焊盘112，触点，接合焊盘 ，痕迹等暴露在表面。 多个固体金属柱130可以覆盖并突出远离相应的导电元件。 金属间层121可以设置在柱和导电元件之间，这样的层提供柱130和导电元件112之间的导电互连。邻接金属间层的柱的基座可以与金属间层对准。

公开(公告)号：WO2009023283A3

公开(公告)日：2009-02-19

申请号：PCT/US2008/009840

申请日：2008-08-15

Applicant: TESSERA, INC. ,  KWON, Jinsu ,  ENDO, Kimitaka ,  MORAN, Sean

Inventor： KWON, Jinsu ,  ENDO, Kimitaka ,  MORAN, Sean

IPC: H01L23/48 ,  G05F1/00

Abstract: An interconnection element (170, 190) is provided for conductive interconnection with another element (172) having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element (187) having a major surface. A plated metal layer (130, 192) including a plurality of exposed metal posts (130) can project outwardly beyond the major surface (176) of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element (187). The interconnection element typically includes a plurality of terminals (151) in conductive communication with the metal posts. The terminals can be connected through the dielectric element (187) to the metal posts (130). The posts may be defined by plating a metal (122, 124) onto exposed co-planar surfaces of a mandrel (120) and interior surfaces of openings (102) in a mandrel, after which the mandrel can be removed.

公开(公告)号：WO2009023284A2

公开(公告)日：2009-02-19

申请号：PCT/US2008/009841

申请日：2008-08-15

Applicant: TESSERA, INC. ,  MORAN, Sean ,  KWON, Jinsu ,  ENDO, Kimitaka

Inventor： MORAN, Sean ,  KWON, Jinsu ,  ENDO, Kimitaka

IPC: H01L23/48

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2203/0384 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00

Abstract: An interconnection element (170) can be formed by- plating a metal layer (124) within holes (106) in an essentially non-metallic layer (104) of a mandrel 120), wherein posts (130) can be plated onto a metal layer (102) exposed within the holes, e.g., a metal layer covering the holes in the non-metallic layer. The tips (160) of the posts can be formed adjacent to ends or bottoms of the blind holes. Terminals (151) can be formed in conductive communication with the conductive posts. The terminals can be connected through a dielectric layer (187) to the conductive posts. At least a portion of the mandrel (120) can then be removed from at least ends of the holes. In this way, the tips (160) of the conductive posts can become raised above a major surface (152), (176) of the interconnection element such that at least the tips of the posts project beyond the major surface.

Abstract translation: 可通过在心轴120的基本上非金属层（104）中的孔（106）内镀覆金属层（124）来形成互连元件（170），其中支柱 130）可以被电镀到暴露在孔内的金属层（102）上，例如覆盖非金属层中的孔的金属层。 柱的尖端（160）可以形成为与盲孔的端部或底部相邻。 端子（151）可以形成为与导电柱导电连通。 端子可以通过介电层（187）连接到导电柱。 然后可以从孔的至少一端移除心轴（120）的至少一部分。 以这种方式，导电柱的尖端（160）可以在互连元件的主表面（152）（176）上方升高，使得柱的至少尖端突出超过主表面。

公开(公告)号：WO2010005592A3

公开(公告)日：2010-01-14

申请号：PCT/US2009/004033

申请日：2009-07-08

Applicant: TESSERA, INC. ,  RYU, Chang, Myung ,  ENDO, Kimitaka ,  HABA, Belgacem ,  KUBOTA, Yoichi

Inventor： RYU, Chang, Myung ,  ENDO, Kimitaka ,  HABA, Belgacem ,  KUBOTA, Yoichi

IPC: H01L23/498 ,  H01L21/48

Abstract: A microelectronic interconnect element can include a plurality of first metal lines (110) and plurality of second metal lines (110') interleaved with the first metal lines (110). Each of the first and second metal lines has a surface (122), (120') extending within the same reference plane. The first metal lines (110) have surfaces (120) above the reference plane and remote therefrom and the second metal lines (110') have surfaces (122') below the reference plane and remote therefrom. A dielectric layer (114A) can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines.

公开(公告)号：WO2009048604A2

公开(公告)日：2009-04-16

申请号：PCT/US2008/011632

申请日：2008-10-08

Applicant: TESSERA, INC. ,  HABA, Belgacem ,  OGANESIAN, Vage ,  ENDO, Kimitaka

Inventor： HABA, Belgacem ,  OGANESIAN, Vage ,  ENDO, Kimitaka

IPC: H05K3/46 ,  H01L23/12 ,  H01L23/48

CPC classification number: H01L21/486 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/24226 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/0038 ,  H05K3/4038 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0382 ,  H05K2201/096 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1189 ,  H01L2924/00

Abstract: An interconnect element (130) can include a dielectric layer (116) having a top face (116b) and a bottom face (116a) remote from the top face, a first metal layer defining a plane extending along the bottom face and a second metal layer extending along the top face. One of the first or second metal layers, or both, can include a plurality of conductive traces (132, 134). A plurality of conductive protrusions (112) can extend upwardly from the plane defined by the first metal layer (102) through the dielectric layer (116). The conductive protrusions (112) can have top surfaces (126) at a first height (115) above the first metal layer (132) which may be more than 50% of a height of the dielectric layer. A plurality of conductive vias (128) can extend from the top surfaces (126) of the protrusions (112) to connect the protrusions (112) with the second metal layer.

Abstract translation: 互连元件（130）可以包括具有顶面（116b）和远离顶面的底面（116a）的电介质层（116），限定沿底面延伸的平面的第一金属层和第二金属 层沿顶面延伸。 第一或第二金属层之一或两者可以包括多个导电迹线（132,134）。 多个导电突起（112）可以从由第一金属层（102）限定的平面向上延伸穿过介电层（116）。 导电突起（112）可以具有在第一金属层（132）上方的第一高度（115）处的顶表面（126），其可以大于电介质层的高度的50％。 多个导电通孔（128）可以从突起（112）的顶表面（126）延伸，以将突起（112）与第二金属层连接。

公开(公告)号：WO2006039633A2

公开(公告)日：2006-04-13

申请号：PCT/US2005/035459

申请日：2005-09-30

Applicant: SOCKETSTRATE, INC. ,  NORTH CORPORATION ,  ENDO, Kimitaka ,  MASUDA, Kenji ,  SHIMADA, Tomokazu

Inventor： ENDO, Kimitaka ,  MASUDA, Kenji ,  SHIMADA, Tomokazu

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K3/46

CPC classification number: H05K3/4617 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/5383 ,  H01L2924/0002 ,  H05K3/064 ,  H05K3/205 ,  H05K3/423 ,  H05K3/4647 ,  H05K2203/0384 ,  H05K2203/0542 ,  H05K2203/0733 ,  Y10S438/931 ,  Y10T29/49124 ,  H01L2924/00

Abstract: An interconnect element (2) is provided which includes a dielectric element (4) having a first major surface, a second major surface remote from the first major surface, and a plurality of recesses extending inwardly from the first major surface. A plurality of metal traces (6), (6a) are embedded in the plurality of recesses, the metal traces having outer surfaces substantially co-planar with the first major surface and inner surfaces remote from the outer surfaces. A plurality of posts (8) extend from the inner surfaces of the plurality of metal traces (6), (6a) through the dielectric element (4), the plurality of posts having tops exposed at the second major surface. A multilayer wiring board (12) including a plurality of such interconnect elements (2) is also provided, as, well as various methods for making such interconnect elements and multilayer wiring boards.

Abstract translation: 提供互连元件（2），其包括具有第一主表面的电介质元件（4），远离第一主表面的第二主表面和从第一主表面向内延伸的多个凹槽。 多个金属迹线（6），（6a）嵌入在多个凹部中，金属迹线具有与第一主表面和远离外表面的内表面基本共面的外表面。 多个柱（8）从多个金属迹线（6），（6a）的内表面延伸穿过电介质元件（4），多个柱具有在第二主表面处露出的顶部。 还提供了包括多个这种互连元件（2）的多层布线板（12）以及用于制造这种互连元件和多层布线板的各种方法。