Abstract:
An apparatus (100) for coating at least a first plurality of articles (130), each article thereof having at least a first surface (140) to be coated is disclosed. The apparatus (100) includes an emission source (120) for directing emission elements (155) towards the first surfaces (140) of the plurality of articles (130), at least one support member for supporting the first plurality of articles (130), wherein support member (110) supports the first plurality of articles (130) such that the first surface (140) is exposed to the path of emission (155) from said emission source (120), and a drive assembly (160) for moving the support member (110) such that the first plurality of articles (130) is moveable with respect to the path of emission (155) from said emission source (120).
Abstract:
Embodiments of the present disclosure generally relate to an apparatus and method for reducing particle generation in a processing chamber. In one embodiment, the methods generally includes generating a plasma between a powered top electrode and a grounded bottom electrode, wherein the top electrode is parallel to the bottom electrode, and applying a constant zero DC bias voltage to the powered top electrode during a film deposition process to minimize the electrical potential difference between the powered top electrode and the plasma and/or the electrical potential difference between the grounded bottom electrode and the plasma. Minimizing the electrical potential difference between the plasma and the electrodes reduces particle generation because the acceleration of the ions in the sheath region of the electrodes is reduced and the collision force of the ions with the protective coating layer on the electrodes is minimized. Therefore, particle generation on the substrate surface is reduced.
Abstract:
L'invention concerne un procédé de production de films d'oxydes, de nitrures ou d'oxynitrures de métaux ou semi-conducteurs sur un substrat, par la méthode de PECVD comprenant les étapes consistant à (i) se munir d'un dispositif de PECVD, à basse pression, comprenant au moins une source de plasma, laquelle comprend au moins une électrode reliée à un générateur AC, DC ou DC puisé, pour le dépôt desdits films sur le substrat, (ii) appliquer une puissance électrique à la source de plasma et appliquer su r le substrat un précurseur gazeux de films d'oxydes, de nitrures ou d'oxynitrures de métaux ou semi-conducteurs et un gaz réactif à base d'oxygène ou de dérivés oxygénés ou de dérivés azotés. L'invention concerne également des films d'oxydes, de nitrures ou d'oxynitrures de métaux ou semi-conducteurs obtenus par le procédé.
Abstract:
Die Erfindung betrifft eine Vorrichtung zum Abscheiden einer Schicht auf einem Substrat (2) innerhalb einer Vakuumkammer (1) mittels plasmaunterstützter chemischer Dampfabscheidung, umfassend mindestens einen Einlass (3) zum Einlassen mindestens eines Gases in die Vakuumkammer (1) sowie mindestens ein mit einem Target (5; 9) bestücktes Magnetron (4) zum Erzeugen eines Plasmas, bei der das Target (5; 9) während des Abscheidens der Schicht zumindest in einem Bereich eine Temperatur von mindestens 300 °C aufweist.
Abstract:
Device for generating a plasma discharge near a substrate for patterning the surface of the substrate, comprising a first electrode having a first discharge portion and a second electrode having a second discharge portion, a high voltage source for generating a high voltage difference between the first and the second electrode, and positioning means for positioning the first electrode with respect to the substrate. The device is further provided with an intermediate structure that is, in use, arranged in between the first electrode and the substrate while allowing for positioning the first electrode with respect to the substrate.
Abstract:
A computer implemented method and a data center management appliance for simulating noπstandard operation of an element of a data center is provided. The method includes acts of determining a one data center resource affected by a data center element, selecting a simulator from a plurality of simulators based on the data center resource and the data center element and generating a impact analysis of the nonstandard operation of the data center element using the simulator. The data center management appliance includes a network interface, a memory and a controller coupled to the network interface and the memory. The controller is configured to determine a data center resource affected by a data center element, select a simulator from a plurality of simulators based on the data center resource and the data center element and generate a impact analysis of nonstandard operation of the data center element using the first simulator.