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Patent Agency Ranking
公开(公告)号：CN1516251A
公开(公告)日：2004-07-28
申请号：CN03137862.5
申请日：1995-03-17
Applicant: 日立化成工业株式会社
CPC classification number: H01L21/568 , H01L21/4803 , H01L21/56 , H01L21/561 , H01L23/3121 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/97 , H01L2221/68377 , H01L2224/16237 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/32503 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/83001 , H01L2224/83102 , H01L2224/8319 , H01L2224/83385 , H01L2224/8381 , H01L2224/8385 , H01L2224/85001 , H01L2224/92125 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15183 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/203 , H01L2924/351 , H05K3/20 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2224/92247 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2924/0002
Abstract: 本发明涉及半导体组件的制造方法及半导体组件，该半导体元件装载用基板具有绝缘性支撑体和在该支撑体的单面上形成的多条配线，其特征在于，具有：在上述绝缘性支撑体的表面上形成多组半导体元件装载区域和该半导体装载区域的外侧的树脂密封用半导体封装区域的工序；在上述半导体封装区域中形成金属线焊接端子、且在上述半导体元件装载区域中形成外部连接端子、且形成将该金属线焊接端子和该外部连接端子串接在一起的上述配线的配线形成工序，以及在形成上述外部连接端端子的地方的上述绝缘性支撑体上形成到达上述外部连接端子的开口部的开口部形成工序。
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公开(公告)号：CN1288951C
公开(公告)日：2006-12-06
申请号：CN02800482.5
申请日：2002-02-25
Applicant: 日立化成工业株式会社
IPC: H05K9/00
CPC classification number: H05K9/0096
Abstract: 电磁波屏蔽膜(1)备有用粘结剂(3)粘接在透明基材(2)上的具有网格状几何图案的导体(4)，在此导体(4)周围设置接地部分(5)。这种接地部分(5)具有吸收电磁波用的导体区(501)和防止导体区(501)产生波纹用的导体不存在区(10)。
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公开(公告)号：CN1457630A
公开(公告)日：2003-11-19
申请号：CN02800482.5
申请日：2002-02-25
Applicant: 日立化成工业株式会社
IPC: H05K9/00
CPC classification number: H05K9/0096
Abstract: 电磁波屏蔽膜(1)备有用粘结剂(3)粘接在透明基材(2)上的具有网格状几何图案的导体(4)，在此导体(4)周围设置接地部分(5)。这种接地部分(5)具有吸收电磁波用的导体区(501)和防止导体区(501)产生波纹用的导体不存在区(10)。
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公开(公告)号：CN1117395C
公开(公告)日：2003-08-06
申请号：CN95192144.4
申请日：1995-03-17
Applicant: 日立化成工业株式会社
IPC: H01L23/12
CPC classification number: H01L21/568 , H01L21/4803 , H01L21/56 , H01L21/561 , H01L23/3121 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/97 , H01L2221/68377 , H01L2224/16237 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/32503 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/83001 , H01L2224/83102 , H01L2224/8319 , H01L2224/83385 , H01L2224/8381 , H01L2224/8385 , H01L2224/85001 , H01L2224/92125 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15183 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/203 , H01L2924/351 , H05K3/20 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2224/92247 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2924/0002
Abstract: 本发明提供一种能适应半导体高度集成化的半导体组件基片。在电解铜箔上镀镍层，形成配线，在铜箔上装配LSI芯片，由引线连接LSI端子与配线，并采用环氧树脂密封半导体。用碱腐蚀方法溶解只除去铜箔，露出镍层，在对铜溶解性小的镍剥离液中除去镍层，使配线露出。涂敷焊料保护层，设置图形并使连接端子露出，在该配线露出处溶融配置焊料球，通过焊料球与外部配线板连接。
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公开(公告)号：CN1144016A
公开(公告)日：1997-02-26
申请号：CN95192144.4
申请日：1995-03-17
Applicant: 日立化成工业株式会社
IPC: H01L23/12
CPC classification number: H01L21/568 , H01L21/4803 , H01L21/56 , H01L21/561 , H01L23/3121 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/97 , H01L2221/68377 , H01L2224/16237 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/32503 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/83001 , H01L2224/83102 , H01L2224/8319 , H01L2224/83385 , H01L2224/8381 , H01L2224/8385 , H01L2224/85001 , H01L2224/92125 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15183 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/203 , H01L2924/351 , H05K3/20 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2224/92247 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2924/0002
Abstract: 本发明提供一种能适应半导体高度集成化的半导体组件基片。在电解铜箔上镀镍层，形成配线，在铜箔上装配LSI芯片，由引线连接LSI端子与配线，并采用环氧树脂密封半导体。用碱腐蚀方法溶解只除去铜箔，露出镍层，在对铜溶解性小的镍剥离液中除去镍层，使配线露出。涂敷焊料保护层，设置图形并使连接端子露出，在该配线露出处溶融配置焊料球，通过焊料球与外部配线板连接。
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