公开(公告)号：EP1753278A1

公开(公告)日：2007-02-14

申请号：EP05745811.9

申请日：2005-05-26

申请人： Ibiden Co.,Ltd. ,  JSR Corporation

发明人： KARIYA, Takashi ,  FURUTANI, Toshiki ,  GOTO, Hirofumi ,  IWANAGA, Shin-ichiro

IPC分类号： H05K3/46 ,  H01L21/60 ,  H01L23/12

CPC分类号： H01L23/49822 ,  H01L23/49811 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/0271 ,  H05K1/0373 ,  H05K1/115 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/068 ,  H05K2201/10674

摘要： A multilayer printed wiring board is equipped with a core board 20, a build-up layer 30 formed on the core board 20 so as to have a conductor pattern 32 on the upper surface thereof, a low-elasticity layer 40 formed on the build-up layer 30, lands 52 that are provided on the upper surface of the low-elasticity layer 40 and connected to an IC chip 70 via solder bumps 66, and conductor posts 50 that penetrate through the low-elasticity layer 40 and electrically connect the lands 52 to the conductor pattern 32. The low-elasticity layer 40 is formed of resin composition containing epoxy resin, phenol resin, cross-linked rubber particles and a hardening catalyst.

摘要翻译： 多层印刷线路板具备：芯板20;形成在芯板20上从而在其上表面上具有导体图案32的积层30;形成在积层30上的低弹性层40; 上层30，设置在低弹性层40的上表面上并通过焊料凸点66连接到IC芯片70的焊盘52以及贯穿低弹性层40并且电连接焊盘的导体柱50 52连接到导体图案32.低弹性层40由包含环氧树脂，酚醛树脂，交联橡胶颗粒和硬化催化剂的树脂组合物形成。

公开(公告)号：EP2015623A1

公开(公告)日：2009-01-14

申请号：EP07742023.0

申请日：2007-04-20

申请人： Ibiden Co., Ltd.

发明人： KARIYA, Takashi ,  FURUTANI, Toshiki ,  KAWANISHI, Takeshi

IPC分类号： H05K3/46

CPC分类号： H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/112 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/10674 ,  H01L2224/05599

摘要： This invention provides a multilayer printed wiring board which achieves fine pitches. A heat resistant substrate is incorporated in a multilayer printed wiring board and interlayer resin insulation layer and conductive layer are placed alternately on the heat resistant substrate. A built-up wiring board in which respective conductive layers are connected by via hole is formed. A via hole is formed on the surface of a mirror-processed Si substrate by using a heat resistant substrate composed of Si substrate so that finer wiring than a resin substrate having unevenness in its surface can be formed, whereby achieving fine pitches. Further, by forming the wiring on a mirror processed surface, dispersion of wiring decreases thereby decreasing dispersion of impedance.

摘要翻译： 本发明提供一种实现精细间距的多层印刷线路板。 将耐热基板装入多层印刷线路板中，并将层间树脂绝缘层和导电层交替放置在耐热基板上。 形成各个导电层​​通过通孔连接的组合布线板。 通过使用由Si衬底构成的耐热衬底，在经过镜面处理的Si衬底的表面上形成通孔，从而可以形成比其表面具有不平坦的树脂衬底更精细的布线，从而实现精细间距。 此外，通过在镜面处理的表面上形成布线，布线的分散减小，从而减小了阻抗的分散。

公开(公告)号：EP2259666A1

公开(公告)日：2010-12-08

申请号：EP08873563.4

申请日：2008-08-26

申请人： Ibiden Co., Ltd.

发明人： FURUTANI, Toshiki ,  FURUSAWA, Takeshi ,  KARIYA, Takashi ,  TANIGUCHI, Hirotaka

IPC分类号： H05K3/46 ,  H01L23/12

CPC分类号： H05K1/187 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/3135 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/205 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49169 ,  H01L2924/00012 ,  H01L2924/00

摘要： A connection terminal (80) to mount an electronic component (2) is formed on a first base material in which a metal foil is disposed on a support body so as to be detachable. Then, the connection terminal (80) and a bump (20) of an electronic component (2) are electrically connected and underfill material (4) is filled between the electronic component (2) and the first base material. Next, insulative material (3) is disposed on the first base material to cover the electronic component (2). Then, the support body and the metal foil are detached, and the unnecessary portion of the exposed metal foil is etched away. Accordingly, a wiring board (1) with a built-in electronic component is obtained.

摘要翻译： 安装电子部件（2）的连接端子（80）形成在第一基材上，金属箔设置在支撑体上以便可拆卸。 然后，连接端子（80）和电子部件（2）的凸块（20）电连接，底部填充材料（4）填充在电子部件（2）和第一基材之间。 接下来，将绝缘材料（3）设置在第一基材上以覆盖电子部件（2）。 然后，拆下支撑体和金属箔，并且将暴露的金属箔的不需要的部分蚀刻掉。 因此，获得具有内置电子部件的布线基板（1）。

公开(公告)号：EP1959717A1

公开(公告)日：2008-08-20

申请号：EP06833717.9

申请日：2006-11-30

申请人： IBIDEN CO., LTD.

发明人： KARIYA, Takashi ,  FURUTANI, Toshiki ,  KAWANISHI, Takeshi

IPC分类号： H05K1/18

CPC分类号： H05K3/4015 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/72 ,  H01L24/78 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/838 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/326 ,  H05K3/341 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T29/49135 ,  Y10T29/49142 ,  Y10T29/49149 ,  Y10T29/49153 ,  H01L2224/13099 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2224/48 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).

摘要翻译： 根据本发明的印刷电路板是印刷电路板（4），包括由金属线制成的元件安装销（1），以与半导体芯片（10）连接。 半导体芯片（10）是表面安装型半导体芯片，其在其安装表面上具有用于倒装芯片安装系统的电极焊盘。 部件安装销（1）通过引线接合技术形成。 该印刷电路板（4）能够减少由半导体芯片（10）和印刷电路板（4）的热膨胀系数之间的差异引起的误连接或断开。

公开(公告)号：EP2015623B1

公开(公告)日：2012-03-28

申请号：EP07742023.0

申请日：2007-04-20

申请人： Ibiden Co., Ltd.

发明人： KARIYA, Takashi ,  FURUTANI, Toshiki ,  KAWANISHI, Takeshi

IPC分类号： H05K3/46

CPC分类号： H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/112 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/10674 ,  H01L2224/05599

摘要： [PROBLEMS] To provide a multilayer printed wiring board for obtaining fine pitch. [MEANS FOR SOLVING PROBLEMS] In a build-up wiring layer, a heat resistant substrate (30) is incorporated in a multilayer printed wiring board (10), an interlayer resin insulating layer (50) and a conductor layer (58) are alternately laminated on the heat resistant substrate, and conductor layers are connected by via holes (60). Since the heat resistant substrate composed of a Si substrate (20) is used, a wiring thinner than that formed on an uneven resin substrate can be formed by making via holes (48) on the surface of the mirror-finished Si substrate, and thus, fine pitch is obtained. Furthermore, by forming a wiring on the mirror-finished surface, variance of the wiring is reduced and fluctuation of impedance is reduced.

公开(公告)号：EP1677585A1

公开(公告)日：2006-07-05

申请号：EP05704388.7

申请日：2005-01-28

申请人： IBIDEN CO., LTD.

发明人： KARIYA, Takashi ,  FURUTANI, Toshiki

IPC分类号： H05K3/46

CPC分类号： H01L24/16 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30105 ,  H05K1/0271 ,  H05K1/0373 ,  H05K1/111 ,  H05K1/115 ,  H05K3/243 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/068 ,  H05K2201/09881 ,  H05K2201/10674 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2224/0401

摘要： A multilayer printed wiring board 10 includes: a core substrate 20; a build-up layer 30 formed on the core substrate 20 and having a conductor pattern 32 on an upper surface; a low elastic modulus layer 40 formed on the build-up layer 30; lands 52 that are disposed on an upper surface of the low elastic modulus layer 40 and connected via solder bumps 66 to a semiconductor chip 70; and conductor posts 50 that are passing through the low elastic modulus layer 40 and electrically connecting lands 52 with conductor patterns 32. The conductor posts 50 are formed to have the diameters of an upper portion and a lower portion of 80µm, the diameter of an intermediate portion of 35µm, the height of 200µm, and the aspect ratio Rasp (height/minimum diameter) of 5.7 and the maximum diameter/minimum diameter of 2.3.

摘要翻译： 多层印刷线路板10包括：芯基板20; 形成在芯基板20上并且在上表面上具有导体图案32的堆积层30; 形成在积层30上的低弹性模量层40; 焊盘52设置在低弹性模量层40的上表面上并通过焊锡凸块66连接到半导体芯片70; 以及导体柱50，其穿过低弹性模量层40和电连接焊盘52与导体图案32.导体柱50形成为具有80μm的上部和下部的直径，中间部分的直径 35μm，高度200μm，纵横比Rasp（高/最小直径）为5.7，最大直径/最小直径为2.3。

公开(公告)号：EP2187439A1

公开(公告)日：2010-05-19

申请号：EP08868937.7

申请日：2008-10-09

申请人： Ibiden Co., Ltd.

发明人： SAKAMOTO, Hajime ,  FURUTANI, Toshiki ,  SEGAWA, Hiroshi

IPC分类号： H01L23/32

CPC分类号： H01L21/4857 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  H01L23/5383 ,  H01L24/48 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The purpose of the present invention is to provide an interposer able to ease suitably the stress concentration at the conductor portion such a via conductor even when a semiconductor element generates heat, and an interposer in according with the present invention comprises at least one layer of an inorganic insulating layer, the first wiring formed in or on the surface of the above-described inorganic insulating layer, at least one layer of an organic insulating layer formed on the outmost layer inorganic insulating layer and on the above-described first wiring, the second wiring formed on the surface of the above-described organic insulating layer, and
a conductor portion for connecting the above-described first wiring and the above-described second wiring.

摘要翻译： 本发明的目的在于提供一种插入器，即使在半导体元件发热的情况下，也能够适当地缓和导体部分的通孔导体的应力集中，并且本发明的插入器包括至少一层 无机绝缘层，形成在上述无机绝缘层的表面中或表面上的第一布线，形成在最外层无机绝缘层上和上述第一布线上的至少一层有机绝缘层，第二 形成在上述有机绝缘层的表面上的布线以及用于连接上述第一布线和上述第二布线的导体部分。

公开(公告)号：EP2187438A1

公开(公告)日：2010-05-19

申请号：EP08868233.1

申请日：2008-10-09

申请人： Ibiden Co., Ltd.

发明人： SAKAMOTO, Hajime ,  KAWANO, Shuichi ,  KOMATSU, Daiki ,  FURUTANI, Toshiki ,  SEGAWA, Hiroshi

IPC分类号： H01L23/32 ,  H01L25/04 ,  H01L25/18

CPC分类号： H01L23/5386 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/5383 ,  H01L23/5384 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15192 ,  H01L2924/3011 ,  Y10T29/49155

摘要： The objective of the present invention is to provide an interposer in which numerous wiring distributions may be arranged with the smallest possible number of layers, and which is suitable for large-volume signal transmission between electronic components. The interposer according to the present invention is structured with: a support substrate; a first insulation layer made of inorganic material and formed on the support substrate; first lands formed in the first insulation layer; second lands formed in the first insulation layer; first wiring formed in the first insulation layer and electrically connecting the first lands and the second lands; a second insulation layer formed on the first insulation layer, the first lands, the second lands and the first wiring, and having first opening portions for first via conductors and second opening portions for second via conductors; first pads formed on the second insulation layer to load a first electronic component; second pads formed on the second insulation layer to load a second electronic component; second wiring formed on the second insulation layer; first via conductors formed in the first opening portions and electrically connecting the first lands and the first pads; and second via conductors formed in the second opening portions and electrically connecting the second lands and the second wiring. It is characterized that the first pads and the second pads are electrically connected through the first wiring and the second wiring, and the second wiring has a longer wiring length and a greater thickness than the first wiring.

摘要翻译： 本发明的目的是提供一种中间层，其中可布置多个布线分布，其层数最小，适用于电子部件之间的大容量信号传输。 根据本发明的插入件结构为：支撑基板; 由无机材料制成并形成在所述支撑基板上的第一绝缘层; 形成在第一绝缘层中的第一焊盘; 形成在第一绝缘层中的第二焊盘; 第一布线形成在第一绝缘层中并电连接第一焊盘和第二焊盘; 形成在第一绝缘层上的第二绝缘层，第一焊盘，第二焊盘和第一布线，并且具有用于第一通孔导体的第一开口部分和用于第二通路导体的第二开口部分; 形成在第二绝缘层上以加载第一电子部件的第一焊盘; 形成在所述第二绝缘层上以加载第二电子部件的第二焊盘; 形成在第二绝缘层上的第二布线; 第一通孔，形成在第一开口部分中并电连接第一焊盘和第一焊盘; 以及形成在第二开口部分中的第二通孔导体，并电连接第二焊盘和第二布线。 其特征在于，第一焊盘和第二焊盘通过第一布线和第二布线电连接，并且第二布线具有比第一布线更长的布线长度和更大的厚度。

公开(公告)号：EP1895821A1

公开(公告)日：2008-03-05

申请号：EP06833716.1

申请日：2006-11-30

申请人： IBIDEN CO., LTD.

发明人： KARIYA, Takashi ,  FURUTANI, Toshiki ,  KAWANISHI, Takeshi

IPC分类号： H05K1/18 ,  H05K3/32 ,  H05K3/34

CPC分类号： H05K3/326 ,  H01L23/49811 ,  H01L24/72 ,  H01L24/81 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/28 ,  H05K3/341 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/0397 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： The present invention is to provide a printed wiring board in which malconnection or disconnection caused by a difference between coefficients of thermal expansion of a semiconductor chip and a printed wiring board can be decreased even when a highly-integrated semiconductor apparatus is mounted thereon and an electronic device using the same. An electronic device (4) according to the present invention includes a printed wiring board (1) with a component mounting pin (18) and a surface-mounting type semiconductor apparatus (2) with an electrode pad (3), wherein the component mounting pin (18) has elasticity and is urged against the electrode pad (3) to maintain electric connection.

摘要翻译： 本发明是提供一种malconnection或断开由半导体芯片和印制布线基板的热膨胀系数之间的差异所引起的印刷电路板可以降低即使在高度集成的半导体装置安装在其上并以电子 使用相同的设备。 一种电子设备（4）雅丁到本发明包括印刷布线板（1）与安装部件用引脚（18）和一个表面安装型半导体装置（2），在电极垫（3），worin部件安装 销（18）具有弹性，被推向电极垫（3），以保持电连接。