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    POLYMER PARTICLE, CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
    91.
    发明公开
    POLYMER PARTICLE, CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE 审中-公开
    POLYMERPARTIKEL，LEITFÄHIGESPARTIKEL，ANISOTROPESLEITFÄHIGESMATERIAL UND VERBINDUNGSSTRUKTUR

    公开(公告)号：EP2308904A1

    公开(公告)日：2011-04-13

    申请号：EP09802911.9

    申请日：2009-07-27

    Applicant: Sekisui Chemical Co., Ltd.

    Inventor： WADA, Takuya ,  NAGATANI, Naoyuki

    IPC: C08F220/10 ,  C08J3/12

    CPC classification number: H05K3/323 ,  C01P2004/84 ,  C08F220/18 ,  C08F222/1006 ,  C09C3/10 ,  H05K2201/0218 ,  H05K2201/0221

    Abstract: An object of the present invention is to provide a polymer particulate material with a low compression modulus and a high recovery rate from compression deformation.
    The present invention provides a polymer particulate material obtainable by co-polymerizing comonomer components including a polyfunctional (meth)acrylate having a structure represented by the below formulas (1), (2) or (3), and a monofunctional (meth)acrylate monomer having a structure represented by the below formula (4), the polymer particulate material shows a recovery rate from compressive deformation of 70% or higher:

    In the formula (1), n represents an integer within the range of 4 to 10. In the formula (2), R11 represents a hydrogen atom or a C1-4 alkyl group, R12, R13 and R14 each represent a C1-4 alkylene group, and R15, R16 and R17 each represent a hydrogen atom or a methyl group. In the formula (3), R3, R4, R5 and R6 each represent a C1-4 alkylene group, and R7, R8, R9 and R10 each represent a hydrogen atom or a methyl group. In the formula (4), R1 represents a hydrogen atom or a methyl group, and R2 represents a C5-18 alkyl group.

    Abstract translation: 本发明的目的是提供一种具有低压缩模量和高压缩变形回收率的聚合物颗粒材料。 本发明提供一种聚合物颗粒材料，其可通过共聚单体组分包括具有由下式（1），（2）或（3）表示的结构的多官能（甲基）丙烯酸酯和单官能（甲基）丙烯酸酯单体 具有由下式（4）表示的结构，聚合物颗粒材料表现出从压缩变形的回收率为70％以上：在式（1）中，n表示4〜10的整数。在 式（2）中，R11表示氢原子或C1-4烷基，R12，R13和R14各自表示C1-4亚烷基，R15，R16和R17各自表示氢原子或甲基。 在式（3）中，R 3，R 4，R 5和R 6各自表示C 1-4亚烷基，R 7，R 8，R 9和R 10各自表示氢原子或甲基。 在式（4）中，R 1表示氢原子或甲基，R 2表示C 5-18烷基。

    Conductive fine particles and anisotropic conductive material
    92.
    发明公开
    Conductive fine particles and anisotropic conductive material 审中-公开
    Leitfähigefeine Teilchen und anisotropesleitfähiges材质

    公开(公告)号：EP2282314A1

    公开(公告)日：2011-02-09

    申请号：EP10172148.8

    申请日：2010-08-06

    Applicant: Hitachi Chemical Co., Ltd.

    Inventor： Enomoto, Nana ,  Akai, Kunihiko

    IPC: H01B1/02

    CPC classification number: H01B1/02 ,  H05K3/321 ,  H05K2201/0218 ,  Y10T428/2991

    Abstract: The invention provides conductive fine particles with a satisfactory monodisperse property, low cost, resistance to migration and excellent conductivity. Conductive fine particles having core particle surfaces coated with a metal-plated coating film layer containing nickel and phosphorus and a multilayer conductive layer comprising a palladium layer as the outer surface, wherein the phosphorus content in region A of the metal-plated coating film layer, at a distance of no greater than 20% of the thickness of the entire metal-plated coating film layer from the surface of the core particle, is 7-15 wt% of the entire region A, the phosphorus content in region B of the metal-plated coating film layer, at a distance of no greater than 10% of the thickness of the entire metal-plated coating film layer from the surface of the metal-plated coating film layer on the palladium layer side, is 0.1-3 wt% of the entire region B, and the phosphorus content of the entire metal-plated coating film layer is 7 wt% or greater,

    Abstract translation: 本发明提供具有满意的单分散性，低成本，耐迁移性和优异的导电性的导电性细颗粒。 具有被包含镍和磷的金属镀覆膜层的芯颗粒表面的导电性微粒以及包含钯层作为外表面的多层导电层，其中，金属镀膜层的区域A中的磷含量， 在芯粒子表面的整个金属镀覆膜层的厚度的20％以下的距离为整个区域A的7〜15重量％，金属的B区的磷含量 在镀钯膜层上的金属镀覆膜层的表面上钯离子层的厚度的10％以下的距离为0.1〜3重量％ 的整个区域B，并且整个金属镀膜层的磷含量为7重量％以上，

    Moisture resistant electrically conductive cements and method for the production and using same
    97.
    发明公开
    Moisture resistant electrically conductive cements and method for the production and using same 失效
    耐湿性导电水泥和用于制造和使用它们的方法

    公开(公告)号：EP1246206A2

    公开(公告)日：2002-10-02

    申请号：EP02012317.0

    申请日：1990-11-14

    Applicant: POLY-FLEX CIRCUITS, INC.

    Inventor： Durand, David ,  Vieau, David P. ,  Wei, Tai Shing ,  Chu, Ang-Ling

    IPC: H01B1/22 ,  C09J163/00 ,  H01R4/04 ,  H05K3/32

    CPC classification number: H05K3/321 ,  C08L2666/54 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/181 ,  H05K3/0023 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1453

    Abstract: An electrically conductive cement which when used to bond electrically conductive mating surfaces provides substantially stable conductivity characteristics under high humidity conditions; comprised of a carrier that provides a volumetric shrinkage of more than about 6.8% (vol.) and a conductive filler including agglomerates, particles, powders, flakes, coated nickel particles, and coated glass spheres, having size and surface characteristics that maintain stable electrical contact by forming a moisture resistant contact with an electrical component lead. The carrier having a volumetric shrinkage between the uncured and cured states of greater than about 6.8% (vol) appears to effect a compaction of the filler particles causing the particles to be forced into enhanced electrical contact with the surfaces to be connected and to provide a measure of compaction between the particles themselves to enhance particle-to-particle conduction. The shrinkage of the polymeric carrier during curing places the interior particles under compression with sufficient force to urge the particles into engagement with one another as well as to cause the particles to penetrate non-conductive oxides that may be present on a component lead.

    Abstract translation: 导电水泥其中当用于粘合导电的配合表面提供高湿度条件下是基本上稳定的传导特性; 由载体的没有提供的大于约6.8％的体积收缩率（体积）和导电填料包括团聚颗粒，粉末，薄片，涂覆镍颗粒和涂覆的玻璃球，具有尺寸和表面特征做了保持稳定的电 通过形成具有在电气元件引线的耐潮接触。 具有大于约6.8％（体积）的未固化和固化状态之间的体积收缩的载体显示，以实现使颗粒填料粒子的压实被迫进入增强与所述表面电接触以连接，并提供一种 颗粒本身之间压实措施，以提高颗粒与颗粒的传导。 聚合物载体的压缩下固化场所内部的颗粒用足够的力时的收缩以促使颗粒进入彼此接合以及使颗粒穿透非导电氧化物也可存在于元件引线。

    SOLDERING METHODS AND COMPOSITIONS
    99.
    发明公开
    SOLDERING METHODS AND COMPOSITIONS 失效
    焊料组合和 - 方法

    公开(公告)号：EP0854768A1

    公开(公告)日：1998-07-29

    申请号：EP96936190.0

    申请日：1996-10-04

    Applicant: BROWN UNIVERSITY RESEARCH FOUNDATION

    Inventor： AVERY, Donald, H. ,  RANIERI, John, P.

    IPC: B23K1 ,  B23K35 ,  H05K3

    CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K2201/36 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2203/043

    Abstract: Soldering methods and compositions are disclosed to provide electrical connections between surfaces with reduced likelihood of short circuits or solder-starved joints. Bimetallic solder particles are employed to preferably form 'metallic foam' joints upon heating. The use of bimetallic particles which fuse together rapidly reduces the likelihood of reflow-related solder joint faults. The methods and compositions of the present invention can also reduce the potential for thermal fatigue and other solder joint failures in electronic devices following fabrication because the porous solder joints relieve plastic constraints and lower the average tensile joint stress. In one preferred embodiment, solder compositions are employed which are composed of particles of a first metal coated with a second metal. The metals are chosen such that their individual melting points are higher than the melting points of the alloy or alloys formed when they are combined. Upon heating of such coated particles, melting occurs at the interfaces between the core materials and their coatings. The liquidus so formed causes various particles to fuse together in a porous metal foam that provides an electronic connection capable of withstanding thermal cycling with significantly lower failure rates. This soldering technique is particularly advantageous when applied to soldering of ball arrays and similar structures that facilitate mounting of chips to printed circuit boards, other chips or substrates, generally. The present invention can also be useful in reducing the total amount of lead and/or other toxic components present in solder compositions.

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