Abstract:
A method of optimizing the frequency response of an interconnect system of the type which conveys high frequency signals between bond pads of separate integrated circuits (ICs) mounted on a printed circuit board (PCB) through inductive conductors, such as bond wires and package legs, and a trace on the surface of the PCB. To improve the interconnect system, capacitance is added to the trace and inductance is added to the conductors, with the added trace capacitance and conductor inductance being appropriately sized relative to one another and to various other interconnect system impedances to optimize the interconnect system impedance matching frequency response.
Abstract:
According to the invention, a thermal release (6) is electrically connected to a resistance meander (1) and can be triggered by said meander (1) in the case of an overload when the circuit substrate (5) heats up. The resistance meander (1) is embodied in a defined area (4) on the circuit support as a multiple interlaced structure surrounding the hot spot (3) which is to be produced in an optimised manner and in a defined position. The thermal release is thermally coupled to the circuit substrate (5) at said hot spot (3).
Abstract:
A flexible printed circuitry member includes a generally planar dielectric substrate (22). First and second pseudo-twisted conductors (24, 25) are disposed on opposite sides of the substrate (22) and extend longitudinally in a pattern of twist sections between crossover points whereat the conductors cross over each other separated by the dielectric substrate. The crossover points (29) define a centerline with the first and second conductors (24, 25) reversing each other on opposite sides of the centerline at each crossover point (29). The twist sections between crossover points along the centerline are of randomly differing lengths (P11 - P16, P21 - P26, P31 - P36).
Abstract:
A flat flexible electrical cable includes a pair of pseudo-twisted conductors (3a, 3b) on a flexible dielectric substrate (2, d). Each conductor includes alternate straight (4) and oblique (5) sections. The straight sections (4) of the conductors are generally parallel to each other and of uniform width. The oblique sections (5) of the conductors cross each other at a crossover point (8). Each oblique section (5) of each conductor is reduced in width uniformly in a direction from the straight-to-oblique transfer point (7) of the respective conductor to the crossover point (8) of the conductors (3a, 3b).
Abstract:
In a multi-layered printed circuit board on which an LSI having a plurality of power supply pins and a plurality of signal pins is mounted, and a grid array package which adopts the printed circuit board, some or all of the plurality of power supply pins are connected to a power supply pattern via an inductance pattern, thereby reducing generation of radiation noise.
Abstract:
A circuit package, or other device, (10) is mounted on a printed circuit board, or other substrate, (14) with an electrically conductive sinuous resistor wire structure (30) therebetween to define a space filled with adhesive. When the adhesive is set the package is held in place. When removal is desired, current is passed through the sinuous wire structure to soften the adhesive to permit removal of the package without damage to the package or the board.
Abstract:
In order to accomplish the miniaturization of a power module, the invention proposes such one which comprises a high frequency multi-stage power amplifier circuit which includes a chip part and a power amplifier semiconductor each mounted on a printed-circuit board that is firmly fixed to a heat radiation plate by fixing means like soldering, wherein there is arranged a microstrip line in an area of the printed-circuit board under a suface mounting type package in which said power amplifier semiconductor is mounted.
Abstract:
A device (10) for protecting stored sensitive data includes a housing (12) formed by a top plate (P1), a base plate (P6) and a four side plates (P2-P5), each plate carrying a meandering electrically conductive path segment. A printed circuit board (14) is mounted in the housing (12) and carries electronic circuit components including a memory (110) for the stored sensitive data. The four side plates (P2-P5) are disposed in an end-to-side configuration. Three of the side plates (P2,P4,P5) are mounted between the top and base plates (P1,P6), and the fourth side plate (P3) is mounted between the top plate (P1) and the PCB (14), which projects from the housing (12) at this location. The conductive path segments on the side plates (P2-P5) are interconnected via frangible electrically conductive epoxy material (40) and conductive tracks on the PCB, except that the conductive path segment on the fourth plate (P3) is connected directly to the conductive path segment on an adjacent plate (P2) by a 6-sided interconnection block (250). If the adhesive binding the housing components together is removed, side plate pivoting is prevented by the end-to-side disposition and/or the frangible epoxy material (40) and/or the interconnection block (250).
Abstract:
Die Erfindung bezieht sich auf eine geätzte Verdrahtung (Spider) für integrierte Schaltkreise mit einem an der Peripherie rundum verlaufenden an mehreren Punkten mit der Verdrahtung verbundenen metallischen Rahmen für Galvanisier- und Kurzschlußzwecke. Bei der Trennung mehrerer nebeneinanderliegender Schaltkreise nach der Galvanisierung mußte bisher ein ganzer Streifen des Trägermaterials verworfen werden, um die kurzschlußfreie Auftrennung der geätzten Verdrahtungen zu ermöglichen. Zur Vermeidung dieses Verwurfs sieht die Erfindung vor, die Zuleitungen 1 zu den Verbindungspunkten 2 des Rahmens mit der Verdrahtung benachbarter Schaltkreise mäanderförmig auszubilden.