公开(公告)号：EP1740029A1

公开(公告)日：2007-01-03

申请号：EP06012641.4

申请日：2006-06-20

Applicant: OMRON CORPORATION

Inventor： Higasa, Koichi, c/o Omron Corporation ,  Sumimoto, Yoshiyuki, c/o Omron Corporation ,  Yoshioka, Daisuke, c/o Omron Corporation

IPC: H05K3/34

CPC classification number: H05K3/3452 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/341 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2201/2036 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: A circuit substrate (1) on which bubbles generated between a pad electrode (22) and a land (11A) can be eliminated is disclosed. Resists (13A,13B) are provided at any one of ends of a land (11A) on a circuit substrate. Solder paste (12A) is printed on the land (11A), and an electronic component (2) (MOSFET or the like) is placed and heated on the same. When the solder paste is melted, an electrode (22) of the electronic component comes into contact with the resists (13) on the circuit substrate. A gap is created by the resists between the land and the electrode of the electronic component. Since the melted solder paste does not wet the resists, bubbles generated in the solder escape to the end of the land through the gap.

Abstract translation: 公开了可以消除在焊盘电极（22）和焊盘（11A）之间产生的气泡的电路基板（1）。 抗蚀剂（13A，13B）设置在电路基板上的焊盘（11A）的任一端。 将焊膏（12A）印刷在焊盘（11A）上，并且将电子部件（2）（MOSFET等）放置并加热。 当焊膏熔化时，电子部件的电极（22）与电路基板上的抗蚀剂（13）接触。 由电子部件的焊盘和电极之间的抗蚀剂产生间隙。 由于熔融的焊膏不会使抗蚀剂湿润，所以在焊料中产生的气泡通过间隙逸出到焊盘的端部。

公开(公告)号：EP1627021A1

公开(公告)日：2006-02-22

申请号：EP04749595.7

申请日：2004-03-31

Applicant: 3M Innovative Properties Company

Inventor： YLITALO, Caroline M. ,  ELLIOTT, Peter T. ,  CLARK, John C. ,  JING, Naiyong ,  KORBA, Gary A.

IPC: C09J5/00

CPC classification number: H05K3/0058 ,  C09J5/00 ,  H01L23/24 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/386 ,  H05K2201/09909 ,  H05K2203/1476 ,  H01L2924/00

Abstract: Methods of applying adhesive to a surface of a substrate comprise: digitally applying a fixable fluid material to a portion of the substrate surface, fixing the first fluid material to form a fixed coating in contact with the substrate surface, wherein the fixed coating has at least one boundary that encloses a region of the substrate surface within the at least one boundary, and applying a second fluid material comprising at least one of an adhesive and an adhesive precursor to at least a portion of the enclosed region of the substrate surface. Various products, including laminated products, may be prepared according to such methods.

公开(公告)号：EP1616353A2

公开(公告)日：2006-01-18

申请号：EP04759413.0

申请日：2004-04-12

Applicant: FormFactor, Inc.

Inventor： KHANDROS, Igor, K. ,  MILLER, Charles, A. ,  WENZEL, Stuart, W.

IPC: H01L23/485 ,  H01L23/48

CPC classification number: H05K3/4007 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05027 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/73251 ,  H01L2224/81901 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H01R12/57 ,  H01R43/007 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09909 ,  Y10T29/49147 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device over the compliant pad to its end area. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad.

公开(公告)号：EP1170797A3

公开(公告)日：2005-05-25

申请号：EP01305412.7

申请日：2001-06-22

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Murata, Shinji, c/o Alps Electric Co. Ltd. ,  Yamamura, Ken, c/o Alps Electric Co. Ltd ,  Tokuta, Mitsuru, c/o Alps Electric Co. Ltd

IPC: H01L25/16 ,  H01G4/06

CPC classification number: H01L28/40 ,  H01L2224/4813 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/0023 ,  H05K3/108 ,  H05K3/386 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/09763 ,  H05K2201/09909

Abstract: In order to provide an electronic circuit board capable of preventing the breakdown voltage of a capacitor element from dropping and excellent in high frequency performance, a positive type photoresist is spin-coated over the surface of an alumina substrate (1) and is exposed to light and developed to form an insulating layer (5), partially followed by formation of a capacitor element by successively stacking a lower electrode, a dielectric layer (3) and an upper electrode (4) over this insulating layer, further followed by formation of a resistance element (13), an inductor element (14) and a transmission line (15), each in a filmy state, over the surface of the alumina substrate.

Abstract translation: 为了提供一种能够从在高频性能滴和优异的防止电容元件的击穿电压的电子电路板，正型光致抗蚀剂被旋涂在氧化铝（1）的表面上并暴露于光基板 和显影，形成在绝缘层（5），部分通过形成电容器元件，接着通过依次层叠下电极，一个介电层（3）和上部电极（4）在该绝缘层，此外，通过形成的一随后 电阻元件（13）到电感器元件（14）和一个传输线（15），在每一个薄膜状状态下，氧化铝基片的表面上。

公开(公告)号：EP1286575A3

公开(公告)日：2005-01-26

申请号：EP02255550.2

申请日：2002-08-08

Applicant: TDK Corporation

Inventor： Takaya, Minoru, c/o TDK Corporation ,  Endo, Toshikazu, c/o TDK Corporation

IPC: H05K1/03 ,  H05K3/46

CPC classification number: H05K1/0366 ,  H01L2224/97 ,  H05K1/0271 ,  H05K1/036 ,  H05K3/0052 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2203/061 ,  H05K2203/065

Abstract: The present invention relates to a module component for which degradation of electrical properties caused by absorption of moisture in the air can be prevented. An intermediate layer (70) comprises a first layer (20), a second layer (30) and a core layer (10). The core layer (10) comprises a material having a higher strength than the first layer (20) and the second layer (30), has a network structure that extends out in planar fashion, has an outer periphery (11) thereof positioned further to the inside than the outer peripheries of the first layer (20) and the second layer (30), and is sealed between the first layer (20) and the second layer (30). An upper layer (71) is laminated on the upper surface of the intermediate layer (70). A lower layer (72) is laminated on the lower surface of the intermediate layer (70). Mounted components (74) are mounted on any one of the upper layer (71) and the lower layer (72).

公开(公告)号：EP1403050A1

公开(公告)日：2004-03-31

申请号：EP03021553.7

申请日：2003-09-24

Applicant: BROTHER KOGYO KABUSHIKI KAISHA

Inventor： Shinkai, Yuji

IPC: B41J2/14 ,  B41J2/16

CPC classification number: H05K3/363 ,  B41J2/14209 ,  B41J2/1609 ,  B41J2/1623 ,  B41J2002/14217 ,  B41J2002/14225 ,  B41J2002/14306 ,  B41J2002/14459 ,  B41J2002/14491 ,  B41J2202/20 ,  H05K3/3452 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10977 ,  H05K2201/2036 ,  Y10T29/42 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49401

Abstract: A surface electrode is provided on a surface of a piezoelectric element for changing the volume of each pressure chamber in an inkjet head. The surface electrode has a main electrode portion opposed to the pressure chamber and a connecting portion not opposed to the pressure chamber. A land is provided on one end of the connecting portion of the surface electrode. The land is electrically connected to the surface electrode. When the land is connected to a terminal of an FPC, a driving signal can be transmitted to the surface electrode. The land is therefore connected to the terminal using solder and a thermosetting resin covering the surface of the solder, or using only a thermosetting resin.

Abstract translation: 表面电极设置在压电元件的表面上，用于改变喷墨头中的每个压力室的容积。 表面电极具有与压力室相对的主电极部分和不与压力室相对的连接部分。 在表面电极的连接部分的一端上提供焊盘。 焊盘电连接到表面电极。 当焊盘连接到FPC的端子时，驱动信号可以传输到表面电极。 因此，焊盘使用覆盖焊料表面的焊料和热固性树脂或仅使用热固性树脂连接到端子。

公开(公告)号：EP1055557B1

公开(公告)日：2004-03-10

申请号：EP00111207.7

申请日：2000-05-24

Applicant: ICHIKOH INDUSTRIES, LTD.

Inventor： Okubo, Katsuhiko, c/o Ichikoh Industries, Ltd.

IPC: B60Q1/26 ,  F21S8/10 ,  H05K3/30

CPC classification number: H05K3/306 ,  B60Q1/2696 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/09072 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2203/1178

公开(公告)号：EP1354237A2

公开(公告)日：2003-10-22

申请号：EP01272790.5

申请日：2001-12-27

Applicant: E-Magin Display Technologies Ltd.

Inventor： AMIR, Jack ,  BEN-SHALOM, Amir

IPC: G02F1/1343 ,  H05K1/11

CPC classification number: G02F1/1345 ,  H01L23/5328 ,  H01L2924/0002 ,  H01R4/04 ,  H05K1/0306 ,  H05K1/16 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4629 ,  H05K2201/09909 ,  H05K2201/10378 ,  Y10T442/623 ,  H01L2924/00

Abstract: A fat conductor electrically interconnecting between a pair of substantially parallel plates (201, 202) wherein each of the plates (201, 202) has a prearranged pattern of conducting surface coating regions on the central interior face side thereof, and the fat conductor is specifically for use in sandwiched constructions of the plates (201, 202) having encapsulated dielectric film therebetween, the fat conductor including: two thin conductive surface coating pads (206, 207) of substantially complementary size and one of the two pads (206, 207) is located on each facing plate (201, 202) and the pads (206, 207) are situated to face each other when the plates (201, 202) are sandwiched together and each pad (206, 207) has an associated conductive surface coating path on its respective surface; a perimeter wall of adhesive (208) arranged around one of the pads (206, 207); and a conductive paste (209) situated within the perimeter wall (208) such that when the plates (201, 202) are sandwiched together there is formed an electrically conductive connection between the pads (206, 207) via the paste (209).

公开(公告)号：EP1308933A2

公开(公告)日：2003-05-07

申请号：EP02024951.2

申请日：2002-11-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shin, Sang-chul

IPC: G11B5/48

CPC classification number: H05K1/0281 ,  G11B5/486 ,  G11B33/08 ,  H05K3/281 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2201/2045

Abstract: Provided is a hard disk drive. The provided hard disk drive includes a flexible printed circuit (FPC) in which a base layer and a cover layer are arranged with a circuit layer therebetween. In addition, a damping material is coupled at a predetermined portion of the signal patterns in the circuit layer so as to cross the signal patterns. The provided hard disk drive reduces vibration energy over an entire frequency band for minimizing the effect of vibration on servo control. As a result, the performance of the hard disk drive is improved.

Abstract translation: 提供了一个硬盘驱动器。 所提供的硬盘驱动器包括柔性印刷电路（FPC），其中基层和覆盖层之间布置有电路层。 此外，阻尼材料在电路层中的信号图案的预定部分处耦合，以便跨越信号图案。 所提供的硬盘驱动器在整个频带上减少振动能量，以最小化振动对伺服控制的影响。 结果，提高了硬盘驱动器的性能。

公开(公告)号：EP1286575A2

公开(公告)日：2003-02-26

申请号：EP02255550.2

申请日：2002-08-08

Applicant: TDK Corporation

Inventor： Takaya, Minoru, c/o TDK Corporation ,  Endo, Toshikazu, c/o TDK Corporation

IPC: H05K1/03 ,  H05K3/46

CPC classification number: H05K1/0366 ,  H01L2224/97 ,  H05K1/0271 ,  H05K1/036 ,  H05K3/0052 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2203/061 ,  H05K2203/065

Abstract: The present invention relates to a module component for which degradation of electrical properties caused by absorption of moisture in the air can be prevented. An intermediate layer (70) comprises a first layer (20), a second layer (30) and a core layer (10). The core layer (10) comprises a material having a higher strength than the first layer (20) and the second layer (30), has a network structure that extends out in planar fashion, has an outer periphery (11) thereof positioned further to the inside than the outer peripheries of the first layer (20) and the second layer (30), and is sealed between the first layer (20) and the second layer (30). An upper layer (71) is laminated on the upper surface of the intermediate layer (70). A lower layer (72) is laminated on the lower surface of the intermediate layer (70). Mounted components (74) are mounted on any one of the upper layer (71) and the lower layer (72).

Abstract translation: 本发明涉及一种模块组件，其用于通过水分吸收空气中的引起的电特性的劣化哪些可以防止。 的中间层（70）包括第一层（20），第二层（30）和芯层（10）。 芯层（10）包括具有比第一层（20）和第二层（30）更高的强度具有网络结构做平面地延伸出的材料，具有外周面（11）它们位于继 内侧比第一层（20）和第二层（30）和的外周在所述第一层（20）和第二层（30）之间密封。 上层（71）层叠在中间层（70）的上表面上。 下层（72）被层叠在中间层（70）的下表面上。 安装部件（74）安装在所述上层（71）中的任何一个和下层（72）。