公开(公告)号：EP1344435B1

公开(公告)日：2008-05-14

申请号：EP01989795.8

申请日：2001-11-15

Applicant: Intel Corporation

Inventor： SANKMAN, Robert

IPC: H05K3/40 ,  H05K3/46 ,  H01L23/498

CPC classification number: H05K3/4038 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K3/4602 ,  H05K2201/1028 ,  H05K2203/0235 ,  H01L2224/05599

Abstract: A microelectronic substrate (110) having a plurality of alternating substantially planar layers of dielectric material (102) and conductive material (104), and further having a first surface (116) and a second surface (130), wherein the dielectric material (102) and the conductive material (104) layers extend substantially perpendicularly between the first and second surfaces (116, 130).

公开(公告)号：EP1852910A1

公开(公告)日：2007-11-07

申请号：EP07100139.0

申请日：2007-01-04

Applicant: Eudyna Devices Inc.

Inventor： Oe, Satoshi

IPC: H01L23/498 ,  H05K3/34

CPC classification number: H05K3/3405 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2224/16225 ,  H05K3/222 ,  H05K3/3468 ,  H05K2201/062 ,  H05K2201/0715 ,  H05K2201/09781 ,  H05K2201/1028 ,  H05K2201/10386 ,  H05K2203/173

Abstract: A mounting substrate (10) including an interconnection (12) provided on a front surface of a substrate, a lead pad (24) provided separately from the interconnection (12), on the front surface of the substrate (10) and, a lead (20) connected to the lead pad (24) by solder (22), and a connecting portion (28) that connects the interconnection (12) and the lead pad (24) after the lead (20) is connected.

Abstract translation: 一种安装基板（10），其包括设置在基板的前表面上的互连（12），在所述基板（10）的前表面上与所述互连（12）分开设置的引线焊盘（24），以及引线 （20）通过焊料（22）连接到引线焊盘（24），以及在引线（20）连接之后连接互连（12）和引线焊盘（24）的连接部分（28）。

公开(公告)号：EP0893945A4

公开(公告)日：2005-03-30

申请号：EP98900724

申请日：1998-01-22

Applicant: ROHM CO LTD

Inventor： NAKAMURA SATOSHI ,  TANAKA MASAHARU

IPC: H05K3/34 ,  H05K3/40 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K3/4015 ,  H05K3/3405 ,  H05K3/341 ,  H05K2201/09172 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10962 ,  Y02P70/613

Abstract: There are disclosed printed board (5) on which electronic parts are mounted, a method for manufacturing the printed board, and a structure for connecting conductor elements (8, 8') to this printed board. The printed board includes an insulating supporting substrate (50) and at least one metallic terminal (53, 54). The supporting substrate is provided with at least one opening (51, 52) through the substrate, and the metallic terminal is fixed to the supporting substrate without protruding from the supporting substrate and bridges the opening.

公开(公告)号：EP1099362B1

公开(公告)日：2004-11-24

申请号：EP99933415.4

申请日：1999-06-29

Applicant: Telefonaktiebolaget LM Ericsson (publ)

Inventor： BERG, Rustan ,  HERNEFJORD, Ingemar

IPC: H05K3/34

CPC classification number: H05K3/341 ,  H01R43/0256 ,  H05K1/0306 ,  H05K3/4015 ,  H05K2201/068 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2201/10969 ,  Y02P70/613

Abstract: The present invention relates to mounting an electric connector (20) onto a printed circuit board, particularly to a printed circuit board comprised of ceramic material, for instance either an LTCC substrate or an HTCC substrate. The problem addressed is one where the connector (20) tends to loosen from the substrate when the temperature varies. This is due to the difference in the coefficients of thermal expansion of the printed circuit board and the connector (20). The problem is solved with the aid of a so-called shim (10) that has a coefficient of thermal expansion between that of the printed circuit board and that of the connector. One side of the shim (10) is soldered onto the connector and the other side of the shim is soldered onto the printed circuit board. The connector (20) is therewith fastened to the printed circuit board. Shear stresses acting between the connector (20) and the printed circuit board are distributed through said board through the medium of two joints instead of one. The connector may alternatively be provided with a built-in shim.

公开(公告)号：EP1465468A1

公开(公告)日：2004-10-06

申请号：EP04006594.8

申请日：2004-03-18

Applicant: Sanyo Electric Co., Ltd. ,  Sanyo Tuner Industries Co., Ltd

Inventor： Mori, Takayuki ,  Komamizu, Shuichi ,  Makino, Kazumi

IPC: H05K3/12 ,  H05K3/34 ,  B41N1/24

CPC classification number: H05K3/3484 ,  B41N1/248 ,  H05K3/1225 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3463 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2201/10818 ,  H05K2203/0545

Abstract: A lead-free solder paste printing method is practiced with use of a metal mask having two openings which are circular or elliptical in shape by placing the metal mask (1) on a circuit board (2) having an electrode (21) formed in a predetermined pattern to join an end portion of a lead member (6), and moving a printing squeegee along the upper surface of the metal mask (1) to thereby print a lead-free solder paste on the surface of the electrode (21) on the circuit board (2). The method produces on the electrode (21) of the circuit board (2) two lead-free solder paste patterns (30a,30a) each circular or elliptical in shape and arranged in a direction in which the lead member (6) is to extend from the electrode.

Abstract translation: 使用具有圆形或椭圆形形状的两个开口的金属掩模，通过将金属掩模（1）放置在具有形成在其中的电极（21）的电路板（2）上来实现无铅焊膏印刷方法 预定图案以接合引线构件（6）的端部，并且沿着金属掩模（1）的上表面移动印刷刮板，从而在电极（21）的表面上印刷无铅焊膏 电路板（2）。 该方法在电路板（2）的电极（21）上产生两个形状为圆形或椭圆形的无铅焊膏图形（30a，30a），并且沿引导构件（6）延伸的方向 从电极。

公开(公告)号：EP1325538B1

公开(公告)日：2004-04-21

申请号：EP01965238.7

申请日：2001-08-31

Applicant: DaimlerChrysler AG

Inventor： KANBACH, Helmut

IPC: H01R4/02 ,  H01R12/08 ,  H01R43/02

CPC classification number: H01R12/61 ,  H01R4/025 ,  H01R43/0242 ,  H05K3/363 ,  H05K2201/1028 ,  H05K2203/1115 ,  H05K2203/175 ,  Y10T29/49149

Abstract: The invention relates to a method for connecting two film cable ends. A metal strip (4), which is tin-plated with a solder, is placed transversally across the conductor strips (2) between the two film cable ends (1), the latter are pressed together with the interposed tin-plated metal strip, the metal strip is supplied with current and heated until the solder of the metal strip melts and fuses with the conductor strips of the film cable. Once the solder connection has been made, the metal strip is severed in the intermediate spaces between two neighbouring conductor strips.

公开(公告)号：EP1315780A2

公开(公告)日：2003-06-04

申请号：EP01968695.5

申请日：2001-09-07

Applicant: 3M Innovative Properties Company

Inventor： KAWATE, Kohichiro ,  HIRASAWA, Yuji

IPC: C09J7/02 ,  C09J5/06 ,  H01R4/04

CPC classification number: H05K3/321 ,  C09J5/06 ,  C09J7/28 ,  C09J2201/128 ,  C09J2201/602 ,  C09J2461/00 ,  C09J2463/00 ,  H01R4/04 ,  H05K3/4015 ,  H05K2201/0382 ,  H05K2201/1028 ,  H05K2203/1189

Abstract: A thermocurable electroconductive adhesive sheet which is able to make an electric connection having mechanical, thermal and electric stability, and low resistance, produced by a simple and easy process is provided.

公开(公告)号：EP0800338B1

公开(公告)日：2001-05-30

申请号：EP97105474.7

申请日：1997-04-02

Applicant: Langer, Gunter

Inventor： Langer, Gunter

IPC: H05K9/00

CPC classification number: H05K1/0218 ,  H05K3/341 ,  H05K3/3452 ,  H05K9/0039 ,  H05K2201/09236 ,  H05K2201/1028 ,  H05K2201/10371 ,  H05K2201/10689 ,  H05K2201/10818 ,  Y02P70/613

公开(公告)号：EP0999253A1

公开(公告)日：2000-05-10

申请号：EP99919580.3

申请日：1999-05-14

Applicant: Sony Chemicals Corporation

Inventor： KUMAKURA, Masayuki, Sony Chemicals Corp.

IPC: C09J167/00 ,  C09J7/02 ,  H01B3/00 ,  H01B7/08 ,  H05K1/03

CPC classification number: H05K3/386 ,  C09J167/00 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0769 ,  H05K2201/1028 ,  H05K2203/122 ,  H05K2203/1545 ,  Y10T428/2933 ,  Y10T428/2938 ,  Y10T428/2958

Abstract: When an adhesive is applied on a metallic wiring, the metal forming the metallic wiring film dissolutes as ions into the adhesive with time. If the adhesive is based on a polyester resin and placed in an environment of high temperature or high temperature and high humidity, adhesion and insulation are deteriorated by the free metallic ions. However, adhesives of the present invention contain a cation scavenger to scavenge the free metallic ions in the adhesives. Thus, highly durable flat cables can be obtained.
Thus, flat cables with reduced loss in adhesive strength and insulation are provided.

Abstract translation: 当将粘合剂施加在金属布线上时，形成金属布线膜的金属随时间溶解成粘合剂中的离子。 如果粘合剂基于聚酯树脂并且放置在高温或高温和高湿度的环境中，则通过游离的金属离子使粘合和绝缘劣化。 然而，本发明的粘合剂含有阳离子清除剂以清除粘合剂中的游离金属离子。 因此，可以获得高度耐用的扁平电缆。 因此，提供了具有降低的粘合强度和绝缘损失的扁平电缆。

公开(公告)号：EP0510516A3

公开(公告)日：1993-04-28

申请号：EP92106571.0

申请日：1992-04-16

Applicant: Dr. Johannes Heidenhain GmbH

Inventor： Kraus, Heinz ,  Bayer, Erich

IPC: G01D5/34 ,  G01D5/26

CPC classification number: G01D5/34707 ,  H01R12/52 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/36 ,  H05K3/4092 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2201/1084

Abstract: Bei einer derartigen Sensoranordnung, beispielsweise zur Abtastung einer Meßteilung bei einer Positionsmeßeinrichtung, weist ein Substrat (2) die Sensoren (5) und in integrierter Form mit diesen Sensoren (5) elektrisch verbundene Leiterbahnen (6) eines ersten Teils eines elektrischen Verbindungselements (7) auf. Diese Leiterbahnen (6) überragen das Substrat (2) in einen zweiten Teil des elektrischen Verbindungselements (7) freitragend und werden an ihren freien Enden (13) mit Kontaktstellen einer Leiterplatte durch Lötung verbunden.