公开(公告)号：EP2790388B1

公开(公告)日：2015-10-28

申请号：EP14150619.6

申请日：2014-01-09

Applicant: Samsung Electronics Co., Ltd

Inventor： Jung, Min-Su ,  Kim, Sang-Hyeon ,  Kim, Young-Tae ,  Kim, Hong-Beom ,  Jeong, Il-Sung

IPC: H04M1/02 ,  H05K1/02

CPC classification number: H05K1/0216 ,  H04M1/0277 ,  H05K3/301 ,  H05K2201/10159 ,  H05K2201/10371

公开(公告)号：EP2568419B1

公开(公告)日：2015-02-25

申请号：EP12195562.9

申请日：2008-07-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kato, Noboru ,  Ishino, Satoshi ,  Kataya, Takeshi ,  Kimura, Ikuhei ,  Ikemoto, Nobuo ,  Dokai, Yuya

IPC: G06K19/077 ,  H01Q1/44 ,  H01Q1/24 ,  H01Q1/50 ,  H01Q7/00 ,  H01Q9/30 ,  H04B5/02 ,  H05K1/14 ,  H01Q1/36

CPC classification number: G06K19/07749 ,  G06K19/06187 ,  G06K19/0723 ,  G06K19/07756 ,  G06K19/07773 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  G06K19/07786 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q1/44 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q13/10 ,  H05K1/0216 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/141 ,  H05K1/16 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10371 ,  H05K2201/10522 ,  H01L2924/00014 ,  H01L2924/00

Abstract: To provide a radio IC device miniaturized without degrading the radiation characteristics. A radio IC device includes an electromagnetic coupling module (1) including a radio IC chip (5) processing transmitted and received signals and a feed circuit board (10) having an inductance element. The feed circuit board (10) has an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case (28) or a wiring cable. The shielding case (28) or the wiring cable functions as a radiation plate. The radio IC chip (5) is operated by a signal received by the shielding case (28) or the wiring, and the answer signal from the radio IC chip (5) is radiated from the shielding case (28) or the wiring cable to the outside. A metal component may function as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board (20).

公开(公告)号：EP2782133A2

公开(公告)日：2014-09-24

申请号：EP13195878.7

申请日：2013-12-05

Applicant: FUJITSU LIMITED

Inventor： Masuda, Satoshi

IPC: H01L23/66 ,  H01L25/16 ,  H01L23/047

CPC classification number: H05K7/026 ,  H01L23/045 ,  H01L23/047 ,  H01L23/3677 ,  H01L23/49833 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/06181 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/19107 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/0215 ,  H05K3/4697 ,  H05K7/20509 ,  H05K9/0039 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2201/10242 ,  H05K2201/10371 ,  H05K2201/1056 ,  H01L2224/45099

Abstract: A high-frequency module includes a lower base member having a recess part formed in an upper face thereof, and having a base metal part formed on a lower face thereof that is to be grounded, an upper substrate disposed inside the recess part of the lower base member, a semiconductor device mounted on an upper face of the upper substrate, a first ground line connected to the semiconductor device and formed on the upper substrate, and a ground metal part connected to the base metal part and disposed in the lower base member, wherein the ground metal part is connected to the first ground line on the upper substrate.

Abstract translation: 本发明提供一种高频模块，其特征在于，具备：下部基体部件，其上表面形成有凹部，在其下面形成有接地的基体金属部;上部基板，其配置在下部凹部的内侧 基部构件，安装在上基板的上表面上的半导体器件，连接到半导体器件并形成在上基板上的第一接地线以及连接到基部金属部并设置在下基部构件中的接地金属部 其中，所述接地金属部分连接到所述上基板上的所述第一接地线。

公开(公告)号：EP2442628A3

公开(公告)日：2014-05-07

申请号：EP11184583.0

申请日：2011-10-11

Applicant: Innochips Technology Co., Ltd.

Inventor： Park, In-Kil ,  Kim, Dae Kyum

IPC: H05K1/02 ,  H05K3/34 ,  H05K9/00

CPC classification number: H05K3/3431 ,  H05K9/0015 ,  H05K2201/10371 ,  Y02P70/613

Abstract: Provided is an electromagnetic interference shielding gasket, which includes an elastomer, a soldering prevention part disposed in at least one region of a side surface and a bottom surface of the elastomer, and an electrode disposed on the bottom surface of the elastomer. Even when solder cream for attaching the EMI shielding gasket to a printed circuit board is pushed from the bottom surface of the EMI shielding gasket by its surface tension and solder-rising, the solder cream stays in the soldering prevention part without moving upward along the side surface of the EMI shielding gasket. Accordingly, the reliability of soldering can be ensured without sacrificing elastic resilient force of the EMI shielding gasket.

公开(公告)号：EP2606407A2

公开(公告)日：2013-06-26

申请号：EP11749066.4

申请日：2011-08-19

Applicant: Apple Inc.

Inventor： ROTHKOPF, Fletcher R. ,  HOBSON, Phillip M. ,  MITTLEMAN, Adam ,  SHEDLETSKY, Anna-Katrina ,  JOL, Eric S. ,  LYNCH, Stephen Brian

IPC: G06F1/16

CPC classification number: H04M1/026 ,  G06F1/1626 ,  G06F1/1688 ,  G06F1/1698 ,  H01L23/5387 ,  H01L23/552 ,  H01L24/50 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/3025 ,  H01Q1/243 ,  H01Q1/526 ,  H04R3/00 ,  H04R2499/11 ,  H05K1/0215 ,  H05K1/114 ,  H05K1/189 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10371 ,  H01L2924/00

Abstract: A modular material antenna assembly is provided that includes an antenna block having a portion with a shape that interlocks with a corresponding portion of an electrically non-conductive frame and secures the antenna block to the electrically non-conductive frame. The electrically non-conductive frame is attached to an interior of an electrically conductive housing so that the electrically non-conductive frame and the electrically conductive housing form an integrated structure. An antenna flex is then mechanically secured to the antenna block. The antenna flex may also be electrically connected to a circuit board. The frame is designed to support a cover glass for the portable electronic device and may be affixed to a housing. The dielectric constant of the antenna block is substantially less than the dielectric constant of the frame.

Abstract translation: 提供了一种模块化天线组件，其包括天线块，天线块具有与非导电框架的对应部分互锁并且将天线块固定到不导电框架的形状的部分。 不导电框架连接到导电外壳的内部，使得非导电框架和导电外壳形成一体结构。 天线弯曲然后机械固定到天线块。 天线弯曲也可以电连接到电路板。 框架被设计成支撑用于便携式电子设备的防护玻璃并且可以被固定到外壳。 天线块的介电常数显着小于框架的介电常数。

公开(公告)号：EP2594120A2

公开(公告)日：2013-05-22

申请号：EP11730012.9

申请日：2011-07-07

Applicant: Continental Automotive GmbH

Inventor： GRAF, Rolf

IPC: H05K5/00 ,  H05K5/06 ,  F02M37/08 ,  H02K11/00

CPC classification number: H05K7/1427 ,  F02M37/08 ,  F04D13/0686 ,  H05K1/02 ,  H05K3/341 ,  H05K5/0056 ,  H05K5/0082 ,  H05K2201/0715 ,  H05K2201/10371

Abstract: The invention relates to a housing (7) for an electronic circuit for a fuel pump, the housing consisting of a base and a cover (5) which is connected to the base, a printed circuit board (1) and, disposed on one side of the latter, electric and/or electronic components (2). Disposed on the side of the printed circuit board (1) on which the components (2) are disposed is a self-contained metal strip (4), the components (2) being arranged in the region surrounded by the strip (4). A cover (5) is soldered to the self-contained strip (4) in such a way that the printed circuit board (1) forms a base and the cover (5) forms a housing (7), and the printed circuit board (1) has at least one blocking layer (8).

公开(公告)号：EP2473012A1

公开(公告)日：2012-07-04

申请号：EP10197384.0

申请日：2010-12-30

Applicant: Research In Motion Limited

Inventor： Cjen, Chao

IPC: H05K1/14 ,  H05K1/18

CPC classification number: H05K1/141 ,  H05K1/147 ,  H05K1/182 ,  H05K2201/09072 ,  H05K2201/10371 ,  H05K2203/167

Abstract: An apparatus includes a first printed circuit defining an aperture and configured for conductive communication between a first plurality of electronic components, and a second printed circuit configured for conductive communication between a second plurality of electronic components. The second printed circuit is fixed to the first printed circuit such that the second plurality of electronic components pass through the aperture, and the second plurality of electronic components are in conductive communication with the first plurality of electronic components.

Abstract translation: 一种装置包括：第一印刷电路，其限定孔并被配置为用于第一多个电子部件之间的导电连通;以及第二印刷电路，其被配置为在第二多个电子部件之间进行导电连通。 第二印刷电路固定到第一印刷电路，使得第二多个电子部件通过孔，并且第二多个电子部件与第一多个电子部件导通连通。

公开(公告)号：EP2387050A1

公开(公告)日：2011-11-16

申请号：EP11162278.3

申请日：2011-04-13

Applicant: BIOTRONIK SE & Co. KG

Inventor： Chen, Singjang ,  Benson, Jonathan ,  McCay, Erica L.

IPC: H01F27/36 ,  H05K1/02 ,  H05K9/00 ,  A61N1/375

CPC classification number: H05K9/0024 ,  A61N1/3718 ,  A61N1/375 ,  A61N1/39 ,  H01F27/36 ,  H05K1/0218 ,  H05K2201/0715 ,  H05K2201/10371 ,  Y10T29/49002

Abstract: The present invention relates to a shielding device for shielding an electronic component (102) to be mounted on a printed circuit board (132). The shielding device exhibiting a top shielding (110) and a bottom shielding (120; 140; 160; 180) separable from each other, wherein the top shielding (110) comprises an electrically and/or magnetically conductive material and the bottom shielding (120; 140; 160; 180) is multilayered. The bottom shielding exhibits at least one electrically and/or magnetically conductive metal sheet layer (122; 162; 164) being embedded between at least two insulating layers (126; 124) and comprises at least two electrically conductive transmission lines (172; 174; 176) for conducting electric current to the electronic component (102). The top shielding (100) and the conductive metal sheet layer (122; 162; 164) are electrically isolated from the electronic component (102). The bottom shielding (120; 140; 160; 180) is integrated into the printed circuit board (132) and the top shielding (110) and the bottom shielding (120; 140; 160; 180) are designed such when they are attached to each other, they completely envelope the electronic component (102).

Abstract translation: 本发明涉及一种用于屏蔽安装在印刷电路板（132）上的电子部件（102）的屏蔽装置。 所述屏蔽装置具有彼此分离的顶部屏蔽（110）和底部屏蔽（120; 140; 160; 180），其中所述顶部屏蔽（110）包括电和/或导磁材料，并且所述底部屏蔽（120 ; 140; 160; 180）是多层的。 底部屏蔽表现出至少一个电和/或导磁金属片层（122; 162; 164）嵌入在至少两个绝缘层（126; 124）之间，并且包括至少两个导电传输线（172; 174; 176），用于向电子部件（102）传导电流。 顶部屏蔽（100）和导电金属片层（122; 162; 164）与电子部件（102）电隔离。 底部屏蔽（120; 140; 160; 180）被集成到印刷电路板（132）中，并且顶部屏蔽（110）和底部屏蔽（120; 140; 160; 180）被设计成当它们被附接到 彼此完全包围电子部件（102）。

公开(公告)号：EP1422985B1

公开(公告)日：2011-01-05

申请号：EP02388071.9

申请日：2002-11-19

Applicant: Sony Ericsson Mobile Communications AB

Inventor： Holmberg, Per

IPC: H05K9/00

CPC classification number: H05K9/0026 ,  H05K1/0218 ,  H05K3/301 ,  H05K2201/0133 ,  H05K2201/10371 ,  H05K2201/10393 ,  H05K2201/2045

公开(公告)号：EP2036409B1

公开(公告)日：2010-12-01

申请号：EP07765509.0

申请日：2007-06-20

Applicant: Robert Bosch GmbH

Inventor： DILLMANN, Adolf ,  SILBERBAUER, Achim ,  HUBER, Daniel

IPC: H05K1/02 ,  H05K1/14 ,  H05K9/00

CPC classification number: H05K9/002 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10371

Abstract: The invention relates to an arrangement, formed by a screening element and at least two electronic units between which the screening element is arranged, wherein the electronic units (5,8,11) are in an overlapping position with respect to one another, and wherein the screening element (16) runs in angular fashion between the electronic units (5,8,11).