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公开(公告)号：EP2213771A4
公开(公告)日：2014-02-26
申请号：EP08854900
申请日：2008-08-21
申请人： FUJIFILM CORP
发明人： HATANAKA YUSUKE , HOTTA YOSHINORI , UESUGI AKIO
CPC分类号： H05K3/423 , C25D11/045 , C25D11/12 , C25D11/20 , H01L23/49827 , H01L2924/0002 , H05K1/0306 , H05K3/002 , H05K2201/0116 , H05K2201/10378 , H05K2203/0315 , H05K2203/1142 , H05K2203/1476 , H01L2924/00
摘要： Disclosed is a microfine structure which can be used as an anisotropic conductive member. Also disclosed is a method for producing such a microfine structure. Specifically disclosed is a microfine structure which is composed of a base having penetrating micropores at a density of not less than 10,000,000 micropores/mm 2 . In this microfine structure, some penetrating micropores are filled with a substance other than the material of the base.
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12.发明公开LIGHT-REFLECTING ANISOTROPICALLY CONDUCTIVE ADHESIVE AND LIGHT EMITTING DEVICE 有权光反射，各向异性导电粘接剂和光发射器件
公开(公告)号：EP2584015A4
公开(公告)日：2014-01-08
申请号：EP12757068
申请日：2012-03-14
申请人： DEXERIALS CORP
IPC分类号： C09J183/04 , C09J9/02 , C09J11/04 , C09J11/06 , C09J183/06 , H01B1/00 , H01B1/20 , H01B5/16 , H01L33/60
CPC分类号： H01L33/46 , C08G77/12 , C08G77/38 , C08K5/0025 , C08K5/09 , C08K2003/2241 , C08K2003/2296 , C09J9/02 , C09J183/06 , H01B1/22 , H01B3/00 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/07811 , H01L2924/00 , H01L2924/00014
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13.发明公开SILVER-COATED SPHERICAL RESIN, METHOD FOR PRODUCING SAME, ANISOTROPICALLY CONDUCTIVE ADHESIVE CONTAINING SILVER-COATED SPHERICAL RESIN, ANISOTROPICALLY CONDUCTIVE FILM CONTAINING SILVER-COATED SPHERICAL RESIN, AND CONDUCTIVE SPACER CONTAINING SILVER-COATED SPHERICAL RESIN 有权涂银球形树脂，用于生产，WITH涂银球形树脂的各向异性导电胶，与涂有银的球形树脂及行政座与涂有银的球形树脂的各向异性导电膜
公开(公告)号：EP2607520A1
公开(公告)日：2013-06-26
申请号：EP11818207.0
申请日：2011-08-17
摘要： This silver-coated spherical resin includes: a spherical resin; and silver coated on a surface of the spherical resin, wherein an amount of the silver is in a range of 2 to 80 parts by mass with respect to 100 parts by mass of the silver-coated spherical resin, and a crystallite diameter of the silver measured by X-ray diffractometry is in a range of 18 to 24 nm. This method for producing a silver-coated spherical resin includes: a process of subjecting a spherical resin to a pretreatment using an aqueous solution of a tin compound; and a subsequent process of subjecting the spherical resin to an electroless silver plating using a reducing agent, wherein, during the pretreatment, a temperature of the aqueous solution of the tin compound is set to be in a range of 20 to 45°C.
摘要翻译： 此银涂布的球形树脂包括：球形树脂; 和银涂布的球形树脂的表面上，在银的量worin的范围中与由银涂布的球形树脂的相对于100质量份为2〜80质量份是，银的微晶直径 通过X射线衍射法测定是在一个范围内的18至24纳米的这种用于制造银涂覆的球形树脂方法包括：一个使一个球形树脂使用在锡化合物的溶液wässrige预处理过程; 和在无电镀银使用还原剂，worin在预处理过程中的球状树脂经受的后续工艺中，锡化合物的wässrige溶液的温度被设定为在范围20至45℃
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14.发明授权ELECTROCONDUCTIVE RUBBER COMPONENT, METHOD OF USING IT AND PORTABLE TELEPHONE COMPRISING IT 有权导电橡胶成分，对于其使用方法和移动电话这个综合
公开(公告)号：EP2325948B1
公开(公告)日：2013-04-17
申请号：EP09814366.2
申请日：2009-06-11
发明人： TANAKA, Jinya , KOIZUMI, Masakazu
CPC分类号： H05K3/4015 , B32B7/02 , B32B7/10 , B32B15/06 , B32B25/02 , B32B25/042 , B32B25/14 , B32B2250/248 , B32B2255/10 , B32B2255/205 , B32B2255/24 , B32B2255/28 , B32B2264/105 , B32B2264/108 , B32B2307/202 , B32B2307/206 , B32B2307/212 , B32B2307/50 , B32B2457/00 , B32B2457/08 , H01R12/714 , H01R13/2414 , H05K3/341 , H05K2201/0314 , Y10T156/10 , Y10T428/12549 , Y10T428/24174
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15.发明公开CURABLE RESIN COMPOSITION, ADHESIVE EPOXY RESIN PASTE, DIE-BONDING AGENT, NON-CONDUCTIVE PASTE, ADHESIVE EPOXY RESIN FILM, NON-CONDUCTIVE EPOXY RESIN FILM, ANISOTROPIC CONDUCTIVE PASTE, AND ANISOTROPIC CONDUCTIVE FILM 审中-公开固化树脂组合物，胶粘剂CAPABLE EPOXIDHARZPASTE，奇普·宾德，NOT导电膏，粘结炸药环氧膜，不会导致环氧树脂膜各向异性导电膏与各向异性导电膜
公开(公告)号：EP2559717A1
公开(公告)日：2013-02-20
申请号：EP11768893.7
申请日：2011-04-13
IPC分类号： C08G59/18 , C08G59/42 , C09J7/00 , C09J9/02 , C09J11/06 , C09J163/00 , C09J201/00 , H01B1/22 , H01B5/16
CPC分类号： C08G59/42 , C08F220/18 , C08L33/068 , C08L63/00 , C09J9/02 , C09J163/00 , H01L2224/14 , H01L2224/48091 , H01L2224/49107 , H01L2224/73204 , H01L2224/73265 , C08F2220/1808 , C08F2220/325 , H01L2924/00014
摘要： To provide a curable resin composition that can improve resistant properties such as thermal impact resistance even in a high-temperature and high-humidity environment and has a high adhesive property, high conduction reliability and superior crack resistant property. The curable resin composition contains an epoxy resin and an epoxy resin-use curing agent, and is characterized in that a difference between a maximum value of tan δ in a viscoelastic spectrum and a value of the tan δ at -40°C thereof is 0.1 or more.
摘要翻译： 提供一种可固化树脂组合物做了能提高耐性质：如即使在高温热的耐冲击性和高湿度环境，并具有高粘合性，高导通可靠性和优异的耐裂缝性能。 的固化性树脂组合物含有环氧树脂和环氧树脂使用的固化剂，并且其特征在于在-40℃下做“在粘弹性谱和tanδ的值”的黄褐色的最大值之间的差是其0.1 以上。
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公开(公告)号：EP2426672A4
公开(公告)日：2012-12-12
申请号：EP10769665
申请日：2010-04-22
CPC分类号： H01R4/04 , H01B1/22 , H01B1/24 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29369 , H01L2224/29393 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/12044 , H05K3/323 , H05K2201/0224 , H05K2201/0323 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
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17.发明公开METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, ELECTRONIC COMPONENT AND CONDUCTIVE FILM 审中-公开VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN KOMPONENTE，ELEKTRONISCHE KOMPONENTE UNDLEITFÄHIGERFILM
公开(公告)号：EP2509400A1
公开(公告)日：2012-10-10
申请号：EP10834332.8
申请日：2010-06-22
发明人： OKUMIYA, Hideaki , SUGA, Yasuhiro
CPC分类号： H01L31/05 , H01L21/6835 , H01L2224/83101 , H01L2924/00013 , H05K3/323 , Y02E10/50 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Provided is a method for manufacturing an electronic component using a conductive film formed by layering an adhesive layer and a release layer. The method for manufacturing the electronic component having a wiring includes: disposing an adhesive film formed by layering an adhesive layer and a release layer above a substrate having a surface on which a wiring is formed, such that the adhesive layer faces the surface; cutting the adhesive layer by inserting the wiring into the adhesive layer by depressing the adhesive film to the substrate; separating one adhesive layer portion of the cut adhesive layer from the surface; and releasing the release layer from the other adhesive layer portion of the cut adhesive layer.
摘要翻译： 提供一种使用通过层压粘合剂层和剥离层形成的导电膜来制造电子部件的方法。 制造具有布线的电子部件的方法包括：将粘合剂层和剥离层分层形成的粘合膜设置在其上形成有布线的表面的基板上，使得粘合剂层面向表面; 通过将粘合剂膜压到基材上将布线插入粘合剂层中来切割粘合剂层; 将切割的粘合剂层的一个粘合剂层部分与表面分离; 并将脱模层从切割的粘合剂层的另一粘合剂层部分释放出来。
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公开(公告)号：EP2312697A4
公开(公告)日：2012-03-21
申请号：EP10755894
申请日：2010-03-12
发明人： TATSUZAWA TAKASHI , SEKI TAKASHI , KOBAYASHI KOUJI , FUJINAWA TOHRU , ARIFUKU MOTOHIRO , SEKI KOTARO
CPC分类号： B65H75/28 , B65H2701/377 , H01R4/04 , H01R12/52 , H05K3/323 , Y10T428/14 , Y10T428/266 , Y10T428/28
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19.发明公开ANISOTROPIC CONDUCTIVE SHEET, PRODUCTION METHOD THEREOF, CONNECTION METHOD AND INSPECTION METHOD 审中-公开各向异性导电片，工艺制作，相关的方法和分析方法。
公开(公告)号：EP1919034A4
公开(公告)日：2009-12-02
申请号：EP06745939
申请日：2006-05-01
发明人： FUJITA TARO , OKUDA YASUHIRO , HAGA TSUYOSHI
CPC分类号： H01R12/7076 , G01R1/0466 , H01R12/714 , H01R13/035 , Y10T29/49117 , Y10T408/03 , Y10T428/24273 , Y10T428/24322 , Y10T428/24802 , Y10T428/24917 , Y10T428/249953 , Y10T428/249987 , Y10T428/249988 , Y10T428/249989
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20.发明公开CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER 有权电路连接材料，电路部件的连接结构及方法将电路连接链接
公开(公告)号：EP2046104A1
公开(公告)日：2009-04-08
申请号：EP06768353.2
申请日：2006-07-21
发明人： ARIFUKU, Motohiro , MOCHIZUKI, Nichiomi , NAKAZAWA, Takashi , KOBAYASHI, Kouji , FUJINAWA, Tohru , TATSUZAWA, Takashi
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
摘要翻译： 用于电路部件各自具有一个基板和形成在所述基板的主表面上的电路电极，响应于光或热，以及含有氨基甲酸乙酯基团和酯有机化合物的粘合剂组合物，其包含没固化之间连接的电路连接材料 组。
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