公开(公告)号：EP2046107A4

公开(公告)日：2009-12-30

申请号：EP07790940

申请日：2007-07-18

Applicant: NEC CORP

Inventor： KUBOTA AKIHITO

IPC: H05K9/00 ,  H05K1/14 ,  H05K3/36 ,  H05K7/20

CPC classification number: H05K1/141 ,  H05K1/0218 ,  H05K1/148 ,  H05K9/0049 ,  H05K2201/10371 ,  H05K2201/2018 ,  Y10T29/49126

公开(公告)号：EP1871157A3

公开(公告)日：2009-12-09

申请号：EP07104681.7

申请日：2007-03-22

Applicant: ASUSTeK Computer Inc.

Inventor： Wang, Ching-Jen

IPC: H05K9/00

CPC classification number: H05K9/0028 ,  H01R13/6586 ,  H01R13/6594 ,  H05K1/0218 ,  H05K9/0039 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10515

Abstract: This invention discloses an EMI shielding module installed on the circuit board with at least one connection hole. This EMI shielding module includes a shielding case and at least one protrusion. The shielding case capped on the device is arranged on the circuit board. The protrusion is arranged on the shielding case and inserted in the connection hole. Therefore, the shielding case is grounded by connecting it to the circuit board with the protrusion inserted in the connection hole.

Abstract translation: 本发明公开了一种安装在电路板上的EMI屏蔽模块，其具有至少一个连接孔。 该EMI屏蔽模块包括屏蔽壳体和至少一个突起。 电路板上设置有盖在设备上的屏蔽壳。 突起布置在屏蔽壳体上并插入连接孔中。 因此，通过将突起插入连接孔中而将屏蔽壳体连接到电路板而将屏蔽壳体接地。

公开(公告)号：EP1937040A3

公开(公告)日：2009-07-01

申请号：EP07123279.7

申请日：2007-12-14

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Kornbichler, Andreas ,  Nalezinski, Martin ,  Richter, Olaf ,  Ziroff, Andreas Dr.

IPC: H05K1/02

CPC classification number: H05K1/0243 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/144 ,  H05K1/182 ,  H05K3/3442 ,  H05K3/4697 ,  H05K2201/037 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/10371

Abstract: Die vorliegende Erfindung betrifft eine Leiterplatte mit einer ersten isolierenden Schicht (1b), auf der ein Hochfrequenzbauelement (17b) vorgesehen ist, wobei eine elektrische Leitung (9b) von dem Hochfrequenzbauelement (17b) durch die erste Schicht (1b) verläuft. Um die Qualität von elektrischen Signale zu verbessern, die von dem Hochfrequenzbauelement durch die erste Schicht hindurchgehen, und gleichzeitig eine ausreichende Stabilität der Leiterplatte zu gewährleisten, ist die erste Schicht (1b) dünn, und ist eine zweite isolierende Schicht (2b) zur Verstärkung der ersten Schicht (1b) vorgesehen, und ist das Hochfrequenzbauelement (17b) in einem Hohlraum (8b) in der zweiten Schicht (2b) aufgenommen.

公开(公告)号：EP2046107A1

公开(公告)日：2009-04-08

申请号：EP07790940.6

申请日：2007-07-18

Applicant: NEC Corporation

Inventor： KUBOTA, Akihito

IPC: H05K9/00 ,  H05K1/14 ,  H05K3/36 ,  H05K7/20

CPC classification number: H05K1/141 ,  H05K1/0218 ,  H05K1/148 ,  H05K9/0049 ,  H05K2201/10371 ,  H05K2201/2018 ,  Y10T29/49126

Abstract: Provided is a circuit board device, wherein degrees of freedom are provided for a GND connecting position among plural printed boards, and noise shield and/or heat sink effects are provided. An electronic device provided with the circuit board device and a GND connecting method are also provided. Circuit board device (100) includes a pair of printed boards (110, 120), noise generating component (112) and/or heat generating component (122), and metal plate (140). Printed boards (110, 120) include mounting surfaces and GND connecting terminals (111, 121) arranged on the respective mounting surfaces, and the mounting surfaces are arranged to face each other. Noise generating component (112) and/or heat generating component (122) is mounted on the mounting surface of at least one of a pair of printed boards (110, 120). Metal plate (140) is arranged between the mounting surfaces of the pair of printed boards (110, 120), and is located at a distance from at least one of noise generating component (112) and heat generating component (122) so as to overlap with the noise generating component and/or the heat generating component. Furthermore, metal plate (140) is in contact with each of GND connecting terminals (111, 121) so that GND connecting terminals (111, 121) are electrically connected to each other.

Abstract translation: 提供了一种电路板装置，其中为多个印刷电路板之间的GND连接位置提供了自由度，并且提供了噪声屏蔽和/或散热效果。 还提供了设置有电路板装置和GND连接方法的电子装置。 电路板装置（100）包括一对印刷板（110,120），噪声生成部件（112）和/或发热部件（122）以及金属板（140）。 印刷电路板（110,120）包括安装表面和布置在相应安装表面上的GND连接端子（111,121），并且安装表面被布置为彼此面对。 噪声产生部件112和/或发热部件122安装在一对印刷板110,120中的至少一个的安装表面上。 金属板（140）设置在一对印刷板（110,120）的安装表面之间，并且与噪声产生部件（112）和发热部件（122）中的至少一个隔开一定距离，以便 与噪音产生部件和/或发热部件重叠。 此外，金属板（140）与GND连接端子（111,121）中的每一个接触，使得GND连接端子（111,121）彼此电连接。

公开(公告)号：EP1445999B1

公开(公告)日：2007-10-03

申请号：EP03388025.3

申请日：2003-04-25

Applicant: Sony Ericsson Mobile Communications AB

Inventor： Fagrenius, Gustav ,  Bengtsson, Henrik ,  Sandevi, Tommy ,  Hermann, Fredrik ,  Andersson, Niklas ,  Meynert, Hans

IPC: H05K9/00

CPC classification number: H05K9/0028 ,  H05K3/341 ,  H05K3/3484 ,  H05K2201/09036 ,  H05K2201/0969 ,  H05K2201/10371 ,  Y02P70/613

公开(公告)号：EP1724832A2

公开(公告)日：2006-11-22

申请号：EP06010226.6

申请日：2006-05-18

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Kimura,Junichi c/o Matsushita Elec. Ind. Co.,Ltd ,  Honjo,Kazuhiko c/o Matsushita Elec. Ind. Co.,Ltd ,  Kawamoto, Eiji c/o Matsushita Elec. Ind. Co., Ltd. ,  Harada, Shinji c/o Matsushita Elec. Ind. Co., Ltd. ,  Kitagawa, Motoyoshi Matsushita Elec. Ind. Co.,Ltd.

IPC: H01L23/538 ,  H01L23/498 ,  H01L25/10

CPC classification number: H05K1/144 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0237 ,  H05K1/185 ,  H05K3/0052 ,  H05K3/3436 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/09181 ,  H05K2201/10371 ,  H05K2201/10666 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: A multilayer module which includes parts-containing module (32) whose circuit board (1) has been mounted at one surface with electronic component (2a) and the electronic component is covered with resin layer (39). Connection terminals (34a), (34b) have been provided either at resin layer (39) or at the other surface of circuit board (1), also through hole (46) has been provided for connection between the two surfaces of module (32). Also included is module (33), which has been provided with connection terminal (35a), (35b) at a place corresponding to connection terminal (34a), (34b), and through hole (47) for connection between the connection terminal (35a), (35b) and electronic component (2b). Disposed between conductor layer (34) and conductor layer (35) is insulation layer (36), which insulation layer having conductive bond (37) for connection between connection terminals (34a), (34b) and connection terminals (35a), (35b), respectively. In the above-described configuration, places of through hole (47) and electronic component (2b) in module (33) are not restricted by a location of through hole (46).

Abstract translation: 一种多层模块，其包括模块（32），其电路板（1）被安装在与电子元件（2a）的一个表面上，所述电子部件用树脂覆盖层（39）含有份-。 连接端子（34A），（34B）已被提供或者在树脂层（39），或在电路板的另一表面（1），即通孔（46），已经提供了（32模块的两个表面之间的连接 ）。 所以包括的是模块（33），其已经提供有连接端子（35A），（35B）中的一个位置对应于连接端子（34A），（34B）和通孔（47），用于连接端子之间的连接（ 35A），（35B）和电子部件（2B）。 导体层（34）和导体层（35）之间设置绝缘层（36），其中具有用于，（34B）和连接端子（35A）的连接端子之间的连接（34A）导电键（37）的绝缘层，（35B ）表示。 另外，在上述的构成中，在模块（33）至（47）和电子部件（2b）的孔的孔的地方都没有通过的位置通过（46）的限制。

公开(公告)号：EP1709852A2

公开(公告)日：2006-10-11

申请号：EP04815798.6

申请日：2004-12-28

Applicant: Motorola, Inc., A Corporation of the State of Delaware

Inventor： GOUDARZI, Vahid

IPC: H05K7/02

CPC classification number: H05K3/341 ,  H05K3/282 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10674 ,  Y02P70/613 ,  Y10T29/5313

Abstract: A populated printed wiring board (PWB) (100) and method of manufacturing the populated PWB are taught. The populated PWB is manufactured by fabricating a PWB (102, 402) with exposed copper pads (302), coating the copper pads with an organic solderability preservative (OSP) (404), depositing a solder paste that includes lead-free solder on the OSP covered copper pads (406), placing components (408) and heating the PWB above a liquidous temperature of the lead-free solder in an air atmosphere (410). The process allows very close spacing of components and component leads while forming reliable solder joints to components that are mechanically stressed and components that have non-negligible planarity or coplanarity tolerances.

公开(公告)号：EP1646269A3

公开(公告)日：2006-09-06

申请号：EP05108651.0

申请日：2005-09-20

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Berberich, Reinhold ,  Busch, Dieter ,  Zintler, Albert

IPC: H05K1/11 ,  H05K1/16 ,  H05K9/00

CPC classification number: H05K1/162 ,  H05K1/117 ,  H05K3/366 ,  H05K2201/0715 ,  H05K2201/09481 ,  H05K2201/09672 ,  H05K2201/10371

Abstract: Bei einer elektrischen Schaltung mit einer Mehrlagen-Leiterplatte und einem gegen elektro-magnetische Störungen abschirmenden Gehäuse (14,15) sind Teile mindestens einer äußeren Lage (1) als Kontaktfläche (6) ausgebildet, die mit jeweils einer Leiterfläche (10) auf einer weiteren Lage (2,3) kontaktiert sind, die einen gegenüber der Kontaktfläche (6) versetzten Flächenbereich einnimmt und mit einer gegenüber liegenden Massefläche (5) der äußeren Lage (1) einen Durchführungskondensator bildet.

公开(公告)号：EP1653792A1

公开(公告)日：2006-05-03

申请号：EP05108243.6

申请日：2005-09-08

Applicant: ROBERT BOSCH GMBH

Inventor： Gottwald, Frank

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K1/0218 ,  H05K3/107 ,  H05K9/0039 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09509 ,  H05K2201/09981 ,  H05K2201/10371

Abstract: Vorrichtung zur Abschirmung elektrischer Schaltungen (7) auf einer Leiterplatte (1) und Verfahren zur Herstellung dieser Vorrichtung, indem ein elektrisch leitfähiger, wannenförmiger Abschirmdeckel (2) mit einer Leiterplatte (1) derart verbunden wird, dass der elektrisch leitfähige, wannenförmige Abschirmdeckel und die Leiterplatte eine elektrische Schaltung einschließen, wobei die Leiterplatte an der Befestigungsfläche, an der diese mit dem Abschirmdeckel verbunden ist, vertieft ist.

Abstract translation: 该装置具有在电学上，导电槽状的屏蔽盖（2）没有与印刷电路板（1）在寻求的方式并在盖连接，并且板包住在电电路（7）。 该板在其中板与盖相连的固定表面凹陷。 板具有与铜套（3），并在面对所述盖的一侧上的层的铜层的矩形，沟槽形状的凹部。 因此独立claimsoft被包括用于在电路制造用于屏蔽的方法。

公开(公告)号：EP1411756A3

公开(公告)日：2005-07-13

申请号：EP03023519.6

申请日：2003-10-15

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Nakatsuji, Koji ,  Yamada, Hiroyuki ,  Asano, Hiromasa ,  Suzuki, Masanori ,  Terao, Atsuhito

IPC: H05K9/00

CPC classification number: H05K9/0037 ,  H05K1/0218 ,  H05K1/18 ,  H05K9/0039 ,  H05K2201/1003 ,  H05K2201/10371

Abstract: A radio frequency apparatus comprising a printed circuit board 20 mounting an electronic component 21 including a coil 23 as an inductance element, a metal frame body 26 covering this printed circuit board 20 and connected to the ground, a lid 27 formed integrally with the frame body 26 , covering the inductance element 23 mounting side of the frame body 26, and a leg 28 formed by cutting and bending from the lid 27 , having a width nearly same as the width of the coil 23 , in which the leg 28 is disposed closely to the coil 23.