利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

259 条记录 (耗时 0.018 秒)

    VORRICHTUNG ZUR PRÜFUNG EINES KERAMISCHEN PFANNENEINSATZES FÜR HÜFTGELENKSIMPLANTATE
    33.
    发明公开
    VORRICHTUNG ZUR PRÜFUNG EINES KERAMISCHEN PFANNENEINSATZES FÜR HÜFTGELENKSIMPLANTATE 有权
    VORRICHTUNG ZURPRÜFUNGEINES KERAMISCHEN PFANNENEINSATZESFÜRHÜFTGELENKSIMPLANTATE

    公开(公告)号：EP2822512A1

    公开(公告)日：2015-01-14

    申请号：EP13709386.0

    申请日：2013-03-06

    申请人： CeramTec GmbH

    发明人： FLOHR, Markus ,  BERTMARING, Hendrik ,  HÄUSSLER, Kim,Lars ,  GRAF, Helena

    IPC分类号： A61F2/46 ,  A61F2/34 ,  A61F2/30

    CPC分类号： A61F2/468 ,  A61F2/34 ,  A61F2002/30332 ,  A61F2002/30345 ,  A61F2002/30649 ,  A61F2002/4666 ,  A61F2310/00077 ,  A61F2310/00179 ,  G01N3/02 ,  G01N3/08 ,  G01N2203/0276 ,  G01N2203/0452

    摘要： The invention relates to a device for testing a ceramic socket insert (3) for hip joint implants having a receiving device (5), a pressure piece (6) and optionally having a plunger (7), wherein the receiving device (5) has a recess (9) with a positioning region (10) for receiving the socket insert (3) and the recess (9) has a receiving cone (11) in the positioning region (10). According to the invention, in order for the device to be universally applicable to all socket inserts (monolithic, modular, pre-joined) and therefore replace all current devices, an annular ductile adapter piece (8) having a conical outer surface contacting the receiving cone (11) and an inner surface contacting the socket insert is arranged in the positioning region (10) between the receiving device (5) and the socket insert (3), wherein the friction between the receiving device (5) and adapter piece (8) is lower than between the adapter piece (8) and socket insert (3).

    摘要翻译： 本发明涉及一种用于测试用于髋关节植入物的陶瓷插座插入件的装置，其具有接收装置，压力片并且可选地具有柱塞，其中接收装置具有凹部，该凹部具有用于接收插座插入件的定位区域，并且凹部具有 定位区域中的接收锥体。 根据本发明，为了使该装置普遍适用于所有插座（单片，模块化，预连接）并因此替换所有当前装置，环形延性适配器件具有与接收锥接触的锥形外表面和 接触插座插入件的内表面布置在接收装置和插座插入件之间的定位区域中，其中接收装置和适配器件之间的摩擦力低于适配器件和插座插入件之间的摩擦力。

    LEITERPLATTE AUS AIN MIT KUPFERSTRUKTUREN
    35.
    发明公开
    LEITERPLATTE AUS AIN MIT KUPFERSTRUKTUREN 审中-公开

    公开(公告)号：EP2774461A1

    公开(公告)日：2014-09-10

    申请号：EP12787675.3

    申请日：2012-10-31

    申请人： CeramTec GmbH

    发明人： DOHN, Alexander ,  LENEIS, Roland ,  HERRMANN, Klaus ,  JÄHNIG, Dietmar

    IPC分类号： H05K3/24 ,  H05K3/40 ,  H01L27/01 ,  H05K3/12 ,  H05K1/03 ,  H05K1/09 ,  H05K1/02

    CPC分类号： H05K3/1216 ,  H05K1/0263 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/115 ,  H05K3/1291 ,  H05K3/245 ,  H05K3/246 ,  H05K3/4038 ,  H05K3/4061 ,  H05K2201/10106 ,  H05K2203/086 ,  H05K2203/1476 ,  Y10T29/49165

    摘要： The invention relates to a process for producing a ceramic circuit board with electrical conductor traces and contacting points on at least one of the two sides, and with at least one through-hole contact (via). According to the invention, the following successive process steps are performed: a) Production of a ceramic substrate made of aluminium nitride and drilling of holes at the intended locations for the vias, b) Filling the holes with a first adhesive paste made of copper, tungsten, molybdenum or alloys thereof, or mixtures thereof, and c) Single-pass overprinting with a second adhesive paste using a first screen-printing operation on at least one side of the ceramic substrate with the desired layout of the conductor traces and contact points, d) Optionally, a full or partial repeat of overprinting with the second adhesive paste, e) Stoving the printed ceramic substrate in an oven with N
    2 (nitrogen), wherein the oxygen content is kept controlled to 0-50 ppm O
    2 , f) Overprinting using a second screen-printing process with a low-glass cover paste over the second adhesive paste until the desired thickness of the conductor traces and contact points is achieved, g) Stoving the printed ceramic substrate in an oven with N
    2 (nitrogen), wherein the oxygen content is kept controlled to 0-50 ppm O
    2 .

    摘要翻译： 用于制造具有电导体迹线和侧面上的接触点并具有通孔接触的陶瓷电路板的方法，其顺序为a）在用于通孔的位置处产生AlN衬底和钻孔，b）用粘合剂填充孔 含有铜，钨和/或钼的合金或其合金，以及c）利用导电迹线和接触点的布局在陶瓷基板的侧面上使用第一丝网印刷操作的第二粘合剂糊剂进行单遍套印， d）任选地，用第二粘合剂浆料完全或部分重复套印，e）在氮气烘箱中用氮气烘烤印刷的陶瓷衬底，同时控制0-50ppm O2的氧气，f）使用第二丝网印刷方法 在第二粘合剂糊剂上覆盖玻璃膏，并且g）用氮气保持印刷的陶瓷基板，同时保持氧含量在0-50ppm O2。

    MINIATURISIERTE SCHNEIDPLATTE
    37.
    发明公开
    MINIATURISIERTE SCHNEIDPLATTE 审中-公开

    公开(公告)号：EP2763809A1

    公开(公告)日：2014-08-13

    申请号：EP12772755.0

    申请日：2012-10-05

    申请人： CeramTec GmbH

    发明人： BEN AMOR, Raouf

    IPC分类号： B23B27/16

    摘要： The invention relates to a cutting plate (4) for a chip-removing cutting tool, comprising a cutting plate top face (9) and a cutting plate bottom face (10), one or more lateral faces (13), cutting edges (6) at the transition between the cutting plate top face (9) and the one or more lateral face (6), and a circular chip recess (1) in the cutting plate top face (9) that has an outside diameter d1. In order to reduce the production costs, according to the invention the following applies to the outside diameter d1 of the chip recess (1): 2 mm

    摘要翻译： 本发明涉及一种用于切屑切割工具的切割板，包括切割板顶面和切割板底面，一个或多个侧面，切割板顶面与一个或多个切割板顶面之间的过渡处的切割刃 侧面和切割板顶面中具有外径d1的圆形切屑凹部。 为了降低生产成本，根据本发明，以下适用于芯片凹槽的外径d1：2mm×d1 <= 6mm，优选2mm