公开(公告)号：EP0067231A4

公开(公告)日：1985-02-28

申请号：EP81903226

申请日：1981-12-08

Applicant: SONY CORP

Inventor： OHSAWA KENJI ,  OHSAWA MASAYUKI ,  KURATA KEIJI ,  ITO TAKAO

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4655 ,  H05K3/002 ,  H05K3/3447 ,  H05K3/3463 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/4038 ,  H05K3/4076 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/063 ,  H05K2203/0759 ,  H05K2203/1344 ,  Y10T29/49165

公开(公告)号：EP0008107B1

公开(公告)日：1982-07-21

申请号：EP79102832.7

申请日：1979-08-06

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Geng, Heinz ,  Rauhhut, Joachim, Dipl.-Ing. ,  Kammermaier, Johann, Dr. Dipl.-Phys.

IPC: H01L49/02 ,  H05K3/00

CPC classification number: B32B15/04 ,  B32B7/12 ,  B32B15/08 ,  B32B27/322 ,  B32B2255/205 ,  B32B2457/00 ,  H05K1/0237 ,  H05K1/0242 ,  H05K1/0393 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/386 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0361 ,  H05K2203/0759 ,  H05K2203/1545

公开(公告)号：EP3048462A1

公开(公告)日：2016-07-27

申请号：EP14857140.9

申请日：2014-09-11

Applicant: Nitto Denko Corporation

Inventor： SHIBATA Naoki ,  TSUJITA Yuichi

IPC: G02B6/12 ,  G02B6/13 ,  G02B6/42 ,  H05K1/02 ,  H05K1/18

CPC classification number: G02B6/4245 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/4232 ,  G02B6/4239 ,  G02B6/428 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/117 ,  H05K3/328 ,  H05K2201/0108 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2201/0358 ,  H05K2201/09481 ,  H05K2201/09827 ,  H05K2201/10121 ,  H05K2201/2009 ,  H05K2201/2054

Abstract: In an opto-electric hybrid board according to the present invention, an electrical interconnect line 22 and an optical element 24 are provided on a first surface of a substrate 21, and an optical waveguide W optically coupled to the optical element 24 is provided on a second surface of the substrate 21. A reinforcement layer 25 for reinforcing the substrate 21 is integrally mounted on the first surface of the substrate 21 on which the electrical interconnect line 22 and the optical element 24 are provided, with an adhesive layer 26 therebetween. A connector pad part 36 for externally electrically connecting the electrical interconnect line 22 is provided on the second surface of the substrate 21 on which the optical waveguide W is provided. With this configuration, the reinforcement layer 25 is mounted on the substrate 21 with high strength without adverse effects exerted on the optical element 24 and the optical waveguide W.

Abstract translation: 在根据本发明的光电混合基板中，在基板21的第一表面上设置电互连线22和光学元件24，并且光耦合到光学元件24的光波导W设置在 基板21的第二表面。用于加强基板21的加强层25一体地安装在其上设置有电互连线22和光学元件24的基板21的第一表面上，其间具有粘合剂层26。 用于外部电连接电互连线22的连接器焊盘部分36设置在其上设置有光波导W的基板21的第二表面上。 利用这种构造，加强层25以高强度安装在基板21上，而不会对光学元件24和光波导W产生不利影响。

公开(公告)号：EP2457725A4

公开(公告)日：2014-11-19

申请号：EP10802160

申请日：2010-06-25

Applicant: MITSUBISHI GAS CHEMICAL CO ,  PI R & D CO LTD

Inventor： NOZAKI MITSURU ,  NOMOTO AKIHIRO ,  AKIYAMA NORIKATSU ,  NAGATA EIJI ,  YANO MASASHI

IPC: B32B15/088 ,  B32B15/08 ,  C25D1/04 ,  C25D5/02 ,  C25D7/00 ,  C25D7/06 ,  H05K1/03 ,  H05K3/38

CPC classification number: H05K1/09 ,  B32B15/08 ,  C25D1/04 ,  C25D5/022 ,  C25D7/0614 ,  C25D7/0678 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/384 ,  H05K3/4652 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0307 ,  Y10T428/31681

Abstract: The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 µm to 3.0 µm and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and form a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.

Abstract translation: 本发明的问题是提供一种在添加剂法的工作过程中，在去污处理后进行电镀时，耐热性进一步提高，板粘合强度提高的树脂复合电解铜箔。 该解决方案是在电解铜箔（A）的一个表面上形成具有多个微小突起的表面粗糙度（Rz）在1.0μm至3.0μm范围内且亮度值不大于30的粗糙表面， 并且形成含有嵌段共聚聚酰亚胺树脂（a）的树脂组合物（B）的层，该嵌段共聚聚酰亚胺树脂（a）具有在粗糙化表面上交替重复地结合第一结构单元和第二结构单元的低聚物的酰亚胺结构。

公开(公告)号：EP2371536A4

公开(公告)日：2013-08-14

申请号：EP09834755

申请日：2009-12-10

Applicant: MITSUBISHI GAS CHEMICAL CO ,  PI R & D CO LTD

Inventor： NOZAKI MITSURU ,  OOMORI TAKABUMI ,  NOMOTO AKIHIRO ,  AKIYAMA NORIKATSU ,  NAGATA EIJI ,  YANO MASASHI

IPC: B32B15/088 ,  H05K1/09 ,  H05K3/38

CPC classification number: H05K3/386 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0358 ,  Y10T428/31681

Abstract: This invention relates to a resin composite copper foil capable of applying a copper foil with very small unevenness on a copper foil (matte) surface without deteriorating adhesion force to a resin composition of a copper-clad laminate, and more particularly to a resin composite copper foil comprising a copper foil and a polyimide resin layer wherein the polyimide resin layer contains a specific block copolymerized polyimide resin and an inorganic filler.

公开(公告)号：EP2439063A1

公开(公告)日：2012-04-11

申请号：EP10796975.0

申请日：2010-06-03

Applicant: Nippon Mining & Metals Co., Ltd.

Inventor： KANMURI Kazuki

IPC: B32B15/08 ,  H05K9/00

CPC classification number: H05K9/0084 ,  B32B7/02 ,  B32B15/08 ,  B32B15/09 ,  B32B15/20 ,  B32B2307/212 ,  B32B2307/50 ,  B32B2307/54 ,  B32B2307/70 ,  B32B2457/08 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10T428/31678

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, wherein elongation after fracture of the copper foil is 5% or more, and wherein (F x T)/(f x t) => 1 is satisfied when t is a thickness of the copper foil, f is a stress of the copper foil under tensile strain of 4%, T is a thickness of the resin layer and F is a stress of the resin layer under tensile strain of 4%.

Abstract translation: 包含铜箔和层压在其上的树脂层的铜箔复合体，其中铜箔断裂后的伸长率为5％以上，并且当t为厚度时，满足（F×T）/（fxt）=> 1 的铜箔，f是拉伸应变为4％时的铜箔的应力，T是树脂层的厚度，F是树脂层在拉伸应变下的应力为4％。

公开(公告)号：EP2371536A1

公开(公告)日：2011-10-05

申请号：EP09834755.2

申请日：2009-12-10

Applicant: Mitsubishi Gas Chemical Company, Inc. ,  PI R & D Co. Ltd

Inventor： NOZAKI, Mitsuru ,  OOMORI, Takabumi ,  NOMOTO, Akihiro ,  AKIYAMA, Norikatsu ,  NAGATA, Eiji ,  YANO, Masashi

IPC: B32B15/088 ,  H05K1/09

CPC classification number: H05K3/386 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0358 ,  Y10T428/31681

Abstract: This invention relates to a resin composite copper foil capable of applying a copper foil with very small unevenness on a copper foil (matte) surface without deteriorating adhesion force to a resin composition of a copper-clad laminate, and more particularly to a resin composite copper foil comprising a copper foil and a polyimide resin layer wherein the polyimide resin layer contains a specific block copolymerized polyimide resin and an inorganic filler.

Abstract translation: 本发明涉及一种能够在铜箔（无光泽）表面上施加非常小的不均匀性的铜箔的树脂复合铜箔，而不会对覆铜层压板的树脂组合物造成附着力的降低，更具体地说，涉及一种树脂复合铜 包括铜箔和聚酰亚胺树脂层的箔，其中聚酰亚胺树脂层含有特定的嵌段共聚聚酰亚胺树脂和无机填料。

公开(公告)号：EP1791409B1

公开(公告)日：2011-08-10

申请号：EP06256011.5

申请日：2006-11-23

Applicant: TDK Corporation

Inventor： Kawabata, Kenichi, c/o TDK Corporation ,  Morita, Takaaki, c/o TDK Corporation

IPC: H05K1/18

CPC classification number: H05K3/4652 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24226 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/185 ,  H05K3/0044 ,  H05K3/0058 ,  H05K3/4602 ,  H05K3/4682 ,  H05K3/4688 ,  H05K2201/0358 ,  H05K2201/09518 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/025 ,  H05K2203/0554 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/49128 ,  Y10T428/24917 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

公开(公告)号：EP2246184A1

公开(公告)日：2010-11-03

申请号：EP09702944.1

申请日：2009-01-15

Applicant: The Furukawa Electric Co., Ltd.

Inventor： TACHIBANA, Akira ,  INUKAI, Toshiyuki ,  SUGAHARA, Chikahito ,  MORII, Akira

IPC: B32B15/08 ,  B32B15/088 ,  H01B17/62 ,  H05K1/03

CPC classification number: H05K1/0346 ,  H01L23/142 ,  H01L2924/0002 ,  H05K1/056 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2203/0783 ,  Y10T428/31678 ,  Y10T428/31681 ,  H01L2924/00

Abstract: Disclosed is a composite material for electrical/electronic component, having a resin coating film formed on at least a part of a metal base, and the residual solvent quantity in the resin coating film being controlled to be 1-30% by mass. The resin coating film is preferably composed of a polyimide or a polyamide-imide.

Abstract translation: 公开了一种用于电气/电子部件用复合材料，具有树脂被膜形成于至少一个金属基体的一部分，并且在所述树脂涂层的电影中的残留溶剂量被控制为按质量计1-30％。 树脂涂膜优选由聚酰亚胺或聚酰胺酰亚胺的。

公开(公告)号：EP1795336A4

公开(公告)日：2010-10-20

申请号：EP05782330

申请日：2005-09-09

Applicant: MITSUI MINING & SMELTING CO

Inventor： MATSUNAGA T ,  MATSUSHIMA T ,  SATO TETSURO ,  NAKAMURA K ,  KON HIROYUKI ,  IWAKIRI K

IPC: B32B15/04 ,  C23C28/00 ,  C25D7/06 ,  H05K1/09

CPC classification number: C25D7/0614 ,  B32B7/06 ,  B32B15/01 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/08 ,  B32B27/26 ,  B32B27/285 ,  B32B27/286 ,  B32B27/38 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/24 ,  B32B2255/28 ,  B32B2270/00 ,  B32B2457/08 ,  C22C19/002 ,  C23C28/00 ,  C25D3/562 ,  H05K3/025 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0358 ,  H05K2203/0723 ,  Y10T428/12569 ,  Y10T428/24355