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    METHOD OF MANUFACTURING A DEVICE, BY IRRADIATING SOME PARTS OF THE SURFACE OF THE DEVICE DIRECTLY THROUGH A MASK, AND OTHER PARTS INDIRECTLY THROUGH THE MASK AND VIA A REFLECTING SURFACE, THEREBY PRODUCING A PATTERN
    37.
    发明授权
    METHOD OF MANUFACTURING A DEVICE, BY IRRADIATING SOME PARTS OF THE SURFACE OF THE DEVICE DIRECTLY THROUGH A MASK, AND OTHER PARTS INDIRECTLY THROUGH THE MASK AND VIA A REFLECTING SURFACE, THEREBY PRODUCING A PATTERN 失效
    制造方法DEVICE通过由掩模及间接照射从掩模的其他部分装置的表面的某些部分的DIRECT照射VIA的反射表面在制造PATTERN

    公开(公告)号：EP0704145B1

    公开(公告)日：2000-09-06

    申请号：EP95913301.8

    申请日：1995-04-07

    Applicant: Koninklijke Philips Electronics N.V.

    Inventor： NELLISSEN, Antonius, Johannes, Maria

    IPC: H05K3/02

    CPC classification number: G03F7/703 ,  G03F7/24 ,  H05K1/0284 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/403 ,  H05K2201/09018 ,  H05K2203/056 ,  H05K2203/135

    Abstract: The invention relates to a method of manufacturing a device provided with a body (1) with a surface (2), at least a portion (3, 4) of the surface (2) being provided with a radiation-sensitive layer (6), after which portions (7, 8) of the radiation-sensitive layer (6) are exposed to radiation (10) through a mask (12) and brought into a pattern. Such a method is particularly suitable for the manufacture of devices in which bodies (1) are used as, for example, printed circuit boards, connections foils for, for example, ICs, or adapter plates between ICs and printed circuit boards. A method of the kind mentioned above is known whereby conductor patterns are provided on an upper and a lower side (22, 24, respectively) of a printed circuit board of a complicated three-dimensional (3-D) shape. For this purpose, a photosensitive layer (6) is provided on a conductive layer through electrodeposition and is illuminated through an upper and a lower mask, developed, and patterned. This known method as described has the disadvantage that several masks are used. The method is complicated and expensive as a result. According to the invention, the method is characterized in that a portion of the radiation-sensitive layer (6) is irradiated directly through the mask (12), while another portion is radiated indirectly via the mask (12) and a surface (13) which reflects the radiation (10). It is achieved thereby that several portions (7, 8) of the radiation-sensitive layer (6) can be illuminated by means of one mask. The use of one mask (12) and a reflecting surface (13) is simpler and cheaper.

    Metallization in semiconductor devices
    38.
    发明公开
    Metallization in semiconductor devices 失效
    金属化半导体器件

    公开(公告)号：EP0875928A3

    公开(公告)日：1998-12-30

    申请号：EP98104745.9

    申请日：1998-03-17

    Applicant: SIEMENS AKTIENGESELLSCHAFT

    Inventor： Tobben, Dirk ,  Spuler, Bruno ,  Gutsche, Martin ,  Weigand, Peter

    IPC: H01L21/768 ,  H01L21/321

    CPC classification number: H05K3/061 ,  H01L21/32139 ,  H01L21/76838 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2203/0585

    Abstract: A method for forming a plurality of electrically conductive wires on a substrate. The method includes forming a relatively non-planar metal layer over a surface of the substrate. A self-planarizing material is deposited over the metal layer. The self-planarizing material forms a planarization layer over the surface of the metal layer. The planarization layer has a surface relatively planar compared to the relatively non-planar metal layer. A photoresist layer is deposited over the surface of the planarization layer. The photoresist layer is patterned with a plurality of grooves to form a mask with such grooves exposing underling portions of the planarization layer. The photoresist mask is used as a mask to etch grooves in the exposed portions of the planarization layer and thereby form a second mask. The second mask exposes underling portions of the relatively non-planar metal layer. The second mask is used to etch grooves in the relatively non-planar conductive metal layer and thereby form the plurality of electrically conductive wires in the metal layer. The wires are separated from each other by the grooves formed in the relatively non-planar metal layer. The planarization layer is formed by a spinning-on an organic polymer, for example an organic polymer having silicon, or a flowable oxide, or a hydrogensilsequioxane, or divinyl-siloxane-benzocyclobutene. The metal layer is etched using reactive ion etching. The planarization layer is removed using a wet chemical etch.

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