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41.发明公开Photosensitive resin composition for forming conductor patterns and multilayer circuit boards using same 失效用于形成导体图案的感光性树脂组合物和使用其的多层电路板
公开(公告)号：EP0428870A3
公开(公告)日：1992-03-11
申请号：EP90119995.0
申请日：1990-10-18
Applicant: HITACHI, LTD.
Inventor： Imabayashi, Shinichiro , Oka, Hitoshi , Tanaka, Isamu , Kikuchi, Hiroshi , Watanabe, Makio
CPC classification number: H05K3/185 , G03F7/004 , G03F7/028 , H05K3/0023 , H05K3/426 , H05K3/429 , H05K3/4602 , H05K3/4661 , H05K2201/0145 , H05K2201/092 , H05K2201/09845
Abstract: A resin composition for forming conductor patterns comprising a photo curable resin, a photopolymerization initiator, a thermosetting resin, photosensitive semiconductor particles, and if necessary a polyfunctional unsaturated compound is suitable for forming very fine conductor patterns in a build-up method.
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公开(公告)号：EP0124800B1
公开(公告)日：1990-07-18
申请号：EP84104209.6
申请日：1984-04-13
Applicant: HÜLS TROISDORF AKTIENGESELLSCHAFT
Inventor： Spielau, Paul, Dr. , Fassbender, Helmut, Dr. , Weiss, Richard, Dr.
IPC: H05K1/03
CPC classification number: B32B15/14 , B32B5/26 , B32B5/28 , B32B15/20 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2457/08 , H05K1/024 , H05K1/036 , H05K1/0366 , H05K2201/0129 , H05K2201/0145 , H05K2201/0278 , Y10S428/901 , Y10T428/31511 , Y10T428/31518 , Y10T428/31522 , Y10T428/31525 , Y10T428/31529 , Y10T442/3423 , Y10T442/3431 , Y10T442/3439 , Y10T442/3512 , Y10T442/352 , Y10T442/656 , Y10T442/669
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43.发明公开Electric circuit for electronic machines, printed by means of a silk-screen process onto a polyester film with a multi-layered structure 失效用于电子设备的电气电路，其被使用在具有多层结构的聚酯薄膜丝网印刷法印刷。
公开(公告)号：EP0340376A1
公开(公告)日：1989-11-08
申请号：EP88830200.7
申请日：1988-05-09
Applicant: CISEL - S.P.A. , R.I.C.O. - S.R.L.
Inventor： Saraceni, Maurizio , Saraceni, Luciano
CPC classification number: H05K3/4069 , H05K1/0393 , H05K1/095 , H05K3/28 , H05K3/281 , H05K2201/0145
Abstract: A circuit board of which the main wires (2), which are conventionally printed, by silk screening on one side of a polyester film (1), are covered and protected by a second film of polyester (5) which also covers the holes (1a) made in the film (1) at the various intersection points at which the electric contact is made between the main and secondary wires (4), which are subsequently silk-printed on the other side of the film (1) and if necessary covered by a layer of protecting varnish (6).
Abstract translation: 这样一种电路板，其中的主导线（2），其是传统的打印，通过丝网印刷在聚酯薄膜（1）的一侧上覆盖和聚酯的第二受保护的电影（5），其覆盖所述孔（ 1a）的在膜（1）在其中电接触在主，副线之间所作的各种交叉点由（4），其随后丝印刷在该膜的另一侧（1），如果必要 通过保护漆（6）的一个层覆盖。
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公开(公告)号：EP0209391A3
公开(公告)日：1988-08-31
申请号：EP86305529
申请日：1986-07-17
Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
Inventor： Sugimoto, Hiroaki , Hayatsu, Kazuo , Hieda, Kazuo
CPC classification number: H05K1/0366 , H05K2201/0129 , H05K2201/0141 , H05K2201/0145 , H05K2201/0278
Abstract: A resin composition comprising 5-60% by weight of fibre obtained by melt spinning an aromatic polyester which exhibits anisotropy when melted and 40-95% by weight of a thermoplastic resin can provide a circuit board which suffers a lineal dimensional change no more than 1% when immersed in a soldering alloy bath at 260°C for 5 seconds and which is also light in weight, nonhygroscopic and has excellent electrical properties.
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45.发明授权
公开(公告)号：EP3115418B1
公开(公告)日：2018-05-23
申请号：EP15757754.5
申请日：2015-02-19
Applicant: Mitsubishi Gas Chemical Company, Inc.
Inventor： UENO, Yoshitaka , KUDO, Masataka , YAGINUMA, Michio
IPC: C08L71/12 , B32B15/08 , B32B17/04 , C08J5/24 , C08K3/00 , C08K5/315 , C08K5/5399 , C08L63/00 , C08L79/04 , H05K1/03
CPC classification number: C08L71/126 , B32B5/02 , B32B15/08 , B32B27/06 , B32B27/20 , B32B2262/101 , B32B2307/202 , B32B2307/3065 , B32B2457/00 , B32B2457/08 , C08G73/0655 , C08J5/24 , C08J2371/12 , C08K3/36 , C08K5/5399 , C08K7/18 , C08L63/00 , C08L71/12 , C08L79/04 , C08L2203/20 , H05K1/0346 , H05K1/0373 , H05K2201/0145 , H05K2201/0209
Abstract: A resin composition comprising a polyphenylene ether (A) having a number average molecular weight of 500 to 5000; a cyclophosphazene compound (B); a non-halogen-based epoxy resin (C); a cyanate compound (D); and a filler (E).
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Patent Agency Ranking46.发明公开
公开(公告)号：EP3288348A4
公开(公告)日：2018-05-02
申请号：EP15890019
申请日：2015-11-09
Applicant: HANSOL TECHNICS INC
Inventor： BOO JAE-HO , CHOI CHI-YOUNG
CPC classification number: H01Q1/38 , H01Q1/243 , H05K1/032 , H05K1/119 , H05K3/0014 , H05K3/06 , H05K3/22 , H05K3/4038 , H05K2201/0145 , H05K2201/0154 , H05K2201/0355 , H05K2201/09018 , H05K2203/0759
Abstract: The present invention relates to a curved-type rigid board and a manufacturing method thereof. According to the present invention, it is possible to maximize space utilization in a portable terminal by easily applying a three-dimensional antenna to the portable terminal by means of a curved-type rigid board having a curved state with a certain curvature.
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47.发明公开
公开(公告)号：EP3115418A4
公开(公告)日：2017-10-18
申请号：EP15757754
申请日：2015-02-19
Applicant: MITSUBISHI GAS CHEMICAL CO
Inventor： UENO YOSHITAKA , KUDO MASATAKA , YAGINUMA MICHIO
IPC: C08L71/12 , B32B15/08 , B32B17/04 , C08J5/24 , C08K3/00 , C08K5/315 , C08K5/5399 , C08L63/00 , C08L79/04 , H05K1/03
CPC classification number: C08L71/126 , B32B5/02 , B32B15/08 , B32B27/06 , B32B27/20 , B32B2262/101 , B32B2307/202 , B32B2307/3065 , B32B2457/00 , B32B2457/08 , C08G73/0655 , C08J5/24 , C08J2371/12 , C08K3/36 , C08K5/5399 , C08K7/18 , C08L63/00 , C08L71/12 , C08L79/04 , C08L2203/20 , H05K1/0346 , H05K1/0373 , H05K2201/0145 , H05K2201/0209
Abstract: A resin composition comprising a polyphenylene ether (A) having a number average molecular weight of 500 to 5000; a cyclophosphazene compound (B); a non-halogen-based epoxy resin (C); a cyanate compound (D); and a filler (E).
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48.发明公开PHENOXY CYCLOTRIPHOSPHAZENE ACTIVE ESTER, HALOGEN-FREE RESIN COMPOSITION AND USE THEREOF 审中-公开ACTIVE PHENOXYCYCLOTRIPHOSPHAZENESTER，无卤素树脂组合物及其用途
公开(公告)号：EP3037475A1
公开(公告)日：2016-06-29
申请号：EP14894791.4
申请日：2014-06-13
Applicant: Shengyi Technology Co., Ltd.
Inventor： HE, Yueshan
IPC: C08L63/00 , C08G63/692 , H01B3/40 , H05K1/03
CPC classification number: C07F9/65812 , C07F9/65815 , C08G59/304 , C08J5/043 , C08J5/24 , C08J2363/00 , C08J2363/08 , C08J2371/00 , C08J2375/00 , C08J2379/00 , C08J2379/02 , C08J2435/06 , C08J2463/08 , C08K5/5399 , C08L63/08 , C08L71/00 , C08L75/00 , C08L79/02 , C08L2201/02 , C08L2201/22 , C08L2203/20 , C08L2205/03 , C09K21/12 , C09K21/14 , H05K1/0373 , H05K2201/012 , H05K2201/0145 , H05K2201/0209
Abstract: The present invention discloses a phenoxycyclotriphosphazene active ester, a halogen-free resin composition and uses thereof. The phenoxycyclotriphosphazene active ester comprises at least 65 mol.% of a substance having the following structural formula. The halogen-free resin composition comprises 5-50 parts by weight of a phenoxycyclotriphosphazene active ester, 15-85 parts by weight of a thermosetting resin, 1-35 parts by weight of a curing agent, 0-5 parts by weight of a curing accelerator and 0-100 parts by weight of an inorganic filler. The present invention discloses introducing phenoxycyclotriphosphazene active ester into a thermosetting resin, reacting active esters with thermosetting resins, such as epoxy resin, without producing hydroxy groups, which not only satisfies the requirements on being halogen-free and flame retardancy, but also improves the electrical properties (decreasing and stabilizing Dk and Df) of the system, so as to make non-halogenation of high frequency and high speed substrate materials possible.
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公开(公告)号：EP2922099A1
公开(公告)日：2015-09-23
申请号：EP15156396.2
申请日：2006-08-14
Applicant: Cambrios Technologies Corporation
Inventor： Alden, Jonathan , Dai, Haixia , Knapp, Michael, R. , Na, Shuo , Pakbaz, Hash , Pschenitzka, Florian , Quan, Xina , Spaid, Michael, A. , Winoto, Adrian , Wolk, Jeffrey
IPC: H01L31/0224 , H01B1/22 , G02F1/1343 , G02B5/02 , C30B7/02 , C30B29/02 , C30B29/60 , C30B33/00 , B82Y30/00 , B82Y20/00
CPC classification number: H01B1/22 , B22F1/0025 , B22F2998/00 , B82Y20/00 , B82Y30/00 , C03C17/007 , C03C17/008 , C03C2217/445 , C03C2217/479 , C09D11/52 , C23F11/02 , C30B7/02 , C30B29/02 , C30B29/60 , C30B33/00 , G02F1/13439 , H01L27/14623 , H01L31/02164 , H01L31/022466 , H01L2224/45139 , H01L2224/49175 , H01L2924/00011 , H01L2924/12044 , H01L2924/3011 , H05K1/0269 , H05K1/097 , H05K3/048 , H05K2201/0145 , H05K2201/0154 , H05K2201/026 , H05K2201/10128 , H05K2203/1545 , Y10S977/762 , H01L2924/00 , H01L2924/01004 , H01L2924/0102 , H01L2924/01039
Abstract: There is disclosed a transparent conductor comprising a substrate and a conductive layer on the substrate, the conductive layer including a plurality of metal nanowires and a matrix.
Abstract translation: 公开了一种透明导体，其在衬底上包括衬底和导电层，导电层包括多个金属纳米线和基体。
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50.发明公开CONDUCTIVE FILM FORMING METHOD, COPPER FINE PARTICLE-DISPERSED LIQUID, AND CIRCUIT BOARD 审中-公开导电薄膜，香料颗粒分散液体和PCB的生产方法
公开(公告)号：EP2787796A4
公开(公告)日：2015-09-09
申请号：EP12862999
申请日：2012-08-13
Applicant: ISHIHARA CHEMICAL CO LTD , APPLIED NANOTECH HOLDINGS INC
Inventor： KAWATO YUICHI , MITA TOMOHIRO , MAEDA YUSUKE , KUDO TOMIO
CPC classification number: H05K1/092 , C09D11/52 , H05K1/0306 , H05K1/032 , H05K1/0346 , H05K1/0366 , H05K1/05 , H05K1/097 , H05K3/108 , H05K3/1283 , H05K3/185 , H05K3/241 , H05K3/246 , H05K3/381 , H05K2201/0129 , H05K2201/0145 , H05K2201/2072 , H05K2203/1105
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