公开(公告)号：EP1941789A4

公开(公告)日：2008-11-26

申请号：EP06761598

申请日：2006-07-28

Applicant: BYD CO LTD

Inventor： ZHANG HUA

IPC: H05K9/00 ,  C09J7/00 ,  H05K3/00 ,  H05K3/38

CPC classification number: H05K3/38 ,  H05K1/0218 ,  H05K1/118 ,  H05K3/0058 ,  H05K2201/0355 ,  H05K2201/0715 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2203/0191 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: Disclosed is a flexible printed circuit, comprising a substrate, and a silver foil and a reinforcement plate attached on said substrate in order, wherein there is an ink layer between said silver foil and said reinforcement plate. According to the invention, by printing the ink onto the silver foil and then attaching the reinforcement plate, especially printing the ink in the form of a dot, strip or mesh, the total thickness of the flexible printed circuit will not increase while the surface roughness of the silver foil increases, resulting in increase of adhesion of the reinforcement plate. This strengthens the attachment between the reinforcement plate and the silver foil, meeting the requirement of peeling-resistant strength between the reinforcement plate and the silver foil.

Abstract translation: 本发明公开了一种柔性印刷电路，其包括衬底，以及依次附接在所述衬底上的银箔和加强板，其中在所述银箔和所述加强板之间存在油墨层。 根据本发明，通过将墨印刷到银箔上并且然后附接加强板，特别是以点，条或网的形式印刷油墨，柔性​​印刷电路的总厚度不会增加，而表面粗糙度 的银箔增加，导致增强板的附着增加。 这加强了加强板和银箔之间的连接，满足了加强板和银箔之间的抗剥离强度要求。

公开(公告)号：EP1755023A4

公开(公告)日：2008-10-29

申请号：EP05743287

申请日：2005-05-20

Applicant: NISSHA PRINTING

Inventor： NISHIKAWA KAZUHIRO ,  KAI YOSHIHIRO ,  NAKAMURA KAZUTO

IPC: G06F3/033 ,  G06F3/048 ,  H01H9/02 ,  H01H13/70 ,  H01H13/785 ,  H05K3/40

CPC classification number: G06F3/045 ,  H01H13/785 ,  H01H2201/036 ,  H01H2207/00 ,  H05K1/116 ,  H05K3/4046 ,  H05K3/4069 ,  H05K2201/09909 ,  H05K2201/10416

Abstract: There is provided a touch panel capable of obtaining a stable connection resistance without requiring fitting accuracy at the time of the connection to an external terminal, and a protective panel for a display window of an electronic device using the same. The analog type touch panel includes a touch side substrate 2 and a non-touch side substrate 3 each having resistive films 2a, 3a provided on opposed inner surfaces thereof. Through-holes 4a, 4b, 4c, 4d formed at the periphery of the non-touch side substrate 3. A connecting part 5 for electrically connecting electrodes of the resistive films 2a, 3a to an external terminal, in which a conductive paste is injected into the through-holes and a rivet 14 is inserted into each of the through-holes from the lower surface side so that a head of the rivet 14 forms flat connecting electrodes 15a, 15b for connection to the external terminal on the lower surface of the non-touch side substrate 3.

公开(公告)号：EP1976029A1

公开(公告)日：2008-10-01

申请号：EP06843047.9

申请日：2006-12-22

Applicant: Rohm Co., Ltd.

Inventor： ISHIHARA, Takayuki ,  KIGOSHI, Satohiro

IPC: H01L33/00

CPC classification number: G09F9/33 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K1/0289 ,  H05K3/284 ,  H05K2201/0162 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2201/09909 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: To provide a semiconductor display device capable of being easily manufactured and a method for manufacturing the semiconductor display device.
The semiconductor display unit 1 includes: a printed circuit board 3 with a display section 2 formed thereon; a protection member 4; a embankment member 5; X lines 6; and Y lines 7. The embankment member 5 is composed of silicon resin which is capable of repelling epoxy resin constituting the protection member 4. Even when the embankment member 5 is lower than the protection member 4 or even when potting is performed to make the liquid epoxy resin 21 higher than the embankment member 5 at a manufacturing process, the epoxy resin 21 is repelled by the embankment member 5 and dose not spill.

Abstract translation: 提供能够容易制造的半导体显示装置及其制造方法。 半导体显示单元1包括：印刷电路板3，其上形成有显示部分2; 保护构件4; 路堤5; X线6; 路线构件5由能够排斥构成保护构件4的环氧树脂的硅树脂构成。即使当路堤构件5比保护构件4低时，或者即使在进行灌封以使液体 环氧树脂21在制造过程中高于路堤构件5，环氧树脂21被路堤构件5排斥并且不会溢出。

公开(公告)号：EP1571894A4

公开(公告)日：2007-11-07

申请号：EP03809838

申请日：2003-07-15

Applicant: DAISHO DENSHI CO LTD

Inventor： ISHIKAWA ATSUSHI ,  DEGUCHI OSAMU ,  KAMEYAMA KATSUYOSHI ,  NAGAOKA MAKOTO ,  KIMURA AKIHIRO

IPC: H05K13/04 ,  H05K1/00 ,  H05K3/00 ,  H05K3/34 ,  H05K3/38 ,  H05K13/00 ,  H05K13/02

CPC classification number: H05K13/0069 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/386 ,  H05K2201/015 ,  H05K2201/09909 ,  H05K2203/016 ,  Y10S269/903 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/5313 ,  Y10T29/53265

Abstract: A holding/convey jig having a plate surface provided with an adhesive pattern of low adhesion for placing and holding a printed circuit board having a conductive portion and a non-conductive portion. The adhesive pattern of low adhesion is formed only at a position corresponding to the non-conductive portion. Moreover, there is disclosed a holding/convey jig having a plate surface provided with a fluorine-based resin layer for placing and holding a printed circuit board having a conductive pattern on an insulating substrate surface. The fluorine-based resin layer has such a structure that the conductive pattern surface of the printed circuit board is held substantially parallel to the plate surface. The holding/convey jig can suppress a manufacturing defect in the step of agglutinating an electronic part onto the thin-plate printed circuit board or in the step of manufacturing the printed circuit board and reduce the manufacturing cost.

Abstract translation: 一种保持/运送夹具，其具有板表面，该板表面设置有低粘附性的粘合剂图案，用于放置和保持具有导电部分和非导电部分的印刷电路板。 低粘附力的粘合剂图案仅在与非导电部分对应的位置处形成。 此外，公开了一种具有板表面的保持/传送夹具，该板表面设置有用于在绝缘基板表面上放置和保持具有导电图案的印刷电路板的氟基树脂层。 氟基树脂层具有这样的结构，即印刷电路板的导电图案表面保持基本上平行于板表面。 保持/传送夹具可以抑制在将电子部件粘合到薄板印刷电路板上的步骤中或制造印刷电路板的步骤中的制造缺陷，并降低制造成本。

公开(公告)号：EP1840952A1

公开(公告)日：2007-10-03

申请号：EP07075207.6

申请日：2007-03-19

Applicant: Delphi Technologies, Inc.

Inventor： Workman, Derek B.

IPC: H01L21/56 ,  H01L23/31 ,  H05K3/30 ,  H01L21/60

CPC classification number: H05K3/303 ,  H01L21/563 ,  H01L23/315 ,  H01L24/29 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10165 ,  H01L2224/11334 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K2201/09909 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/2036 ,  H05K2203/013 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An electronic package having a controlled standoff height between a surface mount electronic device and a substrate includes a plurality of polymeric standoffs adhered to at least one of the underside of the surface mount electronic device or an upper surface of the substrate. The polymeric standoffs prevent collapse of the surface mount electronic device during overmolding or encapsulation of the surface mount electronic device.

Abstract translation: 具有在表面贴装电子器件和衬底之间具有受控的间隔高度的电子封装包括粘附到表面贴装电子器件的下侧中的至少一个或衬底的上表面的多个聚合物支座。 在表面贴装电子设备的过模制或封装期间，聚合物隔板防止表面贴装电子器件的塌陷。

公开(公告)号：EP1436142B1

公开(公告)日：2007-05-16

申请号：EP02766301.2

申请日：2002-09-18

Applicant: Graphic Packaging International, Inc.

Inventor： LAI, Laurence, M., C.

IPC: C23F1/02 ,  H05K3/06 ,  B65D81/34

CPC classification number: C23F1/02 ,  H05K1/0393 ,  H05K3/061 ,  H05K2201/09909 ,  H05K2203/1545 ,  Y10T428/24917

Abstract: Corruption of features formed by etching a metal-containing web in a continuous etch process is reduced by distorting the original design or designs of the features to compensate for localized areas subject to excessive etching during the continuous etch process. In the case of a planar speaker diaphragm, for example, the width of the portions of the trace that are in a cross-machine direction is increased to compensate for the higher etching rate caused by the motion through the etch bath. While this causes the modified trace design to appear to be distorted relative to the original trace design, the etched trace resulting from the modified trace design has improved uniformity and greater fidelity to the original trace design than if the original trace design had been used in the continuous etch process.

公开(公告)号：EP1744337A2

公开(公告)日：2007-01-17

申请号：EP06011373.5

申请日：2006-06-01

Applicant: FANUC LTD

Inventor： Fuchigami, Hiroshi, FANUC Dai3virakaramatsu ,  Yairo, Osamu

IPC: H01H13/703

CPC classification number: H05K1/144 ,  H01H13/703 ,  H01H2221/004 ,  H01H2229/028 ,  H01H2229/056 ,  H05K1/0393 ,  H05K2201/09109 ,  H05K2201/09909 ,  H05K2201/2036

Abstract: A membrane switch is formed by laminating a pair of flexible printed circuit (FPC) boards with two types of resist between them. An oil-resistant thermally adhesive resist is used in the peripheral area between the laminated FPC boards, and a resist that is not thermally adhesive is used in the central area. The thickness of these resists forms a spacer between the FPC boards

Abstract translation: 薄膜开关通过在一对柔性印刷电路板（FPC）之间层压两种抗蚀剂而形成。 在层叠的FPC板之间的周边区域中使用耐油性热粘合剂抗蚀剂，并且在中心区域使用不具有热粘合性的抗蚀剂。 这些抗蚀剂的厚度在FPC板之间形成间隔物

公开(公告)号：EP1577699A3

公开(公告)日：2006-04-26

申请号：EP05005366.9

申请日：2005-03-11

Applicant: SEIKO EPSON CORPORATION

Inventor： Ito, Haruki

IPC: G02F1/13

CPC classification number: G02F1/1362 ,  G02F1/13452 ,  G02F1/13458 ,  G02F1/136277 ,  H05K3/0023 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2203/013 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A panel for an electro-optical apparatus, includes a substrate, a plurality of wires formed on the substrate, convex portions formed from resin and provided either on the plurality of wires or on the substrate, conductive layers provided so as to cover at least a portion of the surfaces of the convex portions, and that are electrically connected to the respective wires, and a plurality of external connection terminals for electrically connecting electronic components, formed by the convex portions and the conductive layers.

Abstract translation: 一种用于电光设备面板，包括：基板，形成在基板的电线的复数，由树脂形成，并在电线的多元性或在基片上提供的任一凸部，设置成导电层，以覆盖至少一个 在凸部的表面的一部分，并没有被电连接到所述respectivement电线，和外部连接端子的电为多个连接的电子部件，通过凸部和导电层形成。

公开(公告)号：EP1352548B1

公开(公告)日：2006-04-12

申请号：EP01270087.8

申请日：2001-12-10

Applicant: Xaar Technology Limited

Inventor： BAKER-SMITH, Hugh ,  KINGS, Donald ,  TATUM, John

IPC: H05K3/00 ,  H05K3/10

CPC classification number: H05K3/46 ,  H05K3/125 ,  H05K3/1258 ,  H05K3/4664 ,  H05K2201/09909 ,  H05K2203/0126 ,  H05K2203/013 ,  H05K2203/1173

Abstract: A method of forming a printed circuit board using an ink jet print head by printing a three dimensional groove using a curable, non-conductive deposition liquid and depositing a liquid that dries to form a conductive track. The walls on either side of the groove impede the liquid from spreading and consequently larger quantities of the conductive deposition liquid can be deposited without causing a short circuit. A multi layer printed circuit board can be produced by depositing further layers of curable non-conductive deposition liquid over the conductive track, a further conductive track in an upper layer being in contact with a conductive track in a lower layer along a slope formed from the non-conductive deposition liquid.

Abstract translation: 使用喷墨打印头通过使用可固化的非导电沉积液印刷三维凹槽并沉积干燥形成导电轨迹的液体来形成印刷电路板的方法。 槽的任一侧的壁阻碍液体的扩散，因此可以沉积大量的导电沉积液体而不引起短路。 多层印刷电路板可以通过在导电轨道上沉积可再循环的非导电沉积液体的另外的层来制造，上层中的另一个导电轨道沿着沿着形成的斜面形成的斜面与下层中的导电轨道接触 非导电沉积液。

公开(公告)号：EP1593450A1

公开(公告)日：2005-11-09

申请号：EP05252728.0

申请日：2005-05-03

Applicant: Agere System Inc.

Inventor： Albanese, Patricia Marie ,  Osenbach, John W. ,  Shilling, Thomas H.

IPC: B23K1/00 ,  H05K3/34 ,  H05K3/26

CPC classification number: B23K1/0016 ,  B23K2201/42 ,  H01L2224/16225 ,  H05K3/26 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10689 ,  H05K2201/10727

Abstract: The specification describes a surface mount method for the manufacture of high device density circuit boards. The stand-off space of the components (11) on the board (13) can be enlarged significantly by selectively omitting, or selectively removing, the soldermask (16) underneath the component (11) package. This improves access of the cleaning fluid to the underside of the component (11) during the cleaning operation.

Abstract translation: 说明书描述的表面安装方法，用于高器件密度的电路板的制造。 在板（13）的部件（11）的对峙的空间可以通过显着选择性省略，或选择性地去除被放大，阻焊（16）的部件（11）封装的下面。 这改善了清洁操作期间清洗液的访问组件（11）的下侧。