-
公开(公告)号:EP2035943A4
公开(公告)日:2012-11-21
申请号:EP07796091
申请日:2007-06-14
Applicant: IBM
Inventor: MOHINDRA AJAY , NAIK VIJAY K
IPC: G06F15/173 , G06F9/50
CPC classification number: H04L41/12 , G06F8/61 , G06F9/5055 , H04L41/5003 , H04L41/5048 , H04L41/5054
-
52.
公开(公告)号:EP2157512A4
公开(公告)日:2012-10-10
申请号:EP08752541
申请日:2008-05-09
Applicant: IBM
Inventor: OGASAWARA TAKESHI
CPC classification number: G06F9/5027 , G06F2209/5018
-
公开(公告)号:EP2357654A4
公开(公告)日:2012-08-29
申请号:EP09823395
申请日:2009-08-04
Applicant: IBM
Inventor: MIYATAKE HISATADA
CPC classification number: G11C15/04 , G06F11/1064
-
54.METHOD AND SYSTEM FOR RULES BASED WORKFLOW OF MEDIA SERVICES 审中-公开
Title translation: 方法和系统基于操作媒体业务规则公开(公告)号:EP2257887A4
公开(公告)日:2012-08-22
申请号:EP09711173
申请日:2009-02-11
Applicant: IBM
Inventor: DETTORI PAOLO , NOGIMA JULIO , SCHAFFA FRANK A , SANCHEZ GALLO DIEGO
IPC: G06F15/173 , G06F9/54
CPC classification number: H04L67/2819 , G06F9/546 , H04L67/2838 , H04L67/288
-
公开(公告)号:EP1917678A4
公开(公告)日:2012-08-22
申请号:EP06759161
申请日:2006-05-04
Applicant: IBM
Inventor: KANAKASABAPATHY SIVANANDA K , GAIDIS MICHAEL C
IPC: H01L21/00 , H01L21/26 , H01L21/302 , H01L29/78
CPC classification number: H01L43/12 , H01L21/76897 , H01L27/222 , H01L43/08 , H01L2924/3011
-
56.DIELECTRIC CAP HAVING MATERIAL WITH OPTICAL BAND GAP TO SUBSTANTIALLY BLOCK UV RADIATION DURING CURING TREATMENT, AND RELATED METHODS 审中-公开
Title translation: 与光学带隙的材料的介电CLOSURE基本上LOCKED对UV辐射硬化及相关过程期间公开(公告)号:EP2111637A4
公开(公告)日:2012-08-08
申请号:EP08728172
申请日:2008-01-24
Applicant: IBM
Inventor: BELYANSKY MICHAEL P , BONILLA GRISELDA , LIU XIAO HU , NGUYEN SON VAN , SHAW THOMAS M , SHOBHA HOSADURGA K , YANG DAEWON
IPC: H01L23/12 , H01L21/3105 , H01L21/318 , H01L21/768
CPC classification number: H01L21/02123 , H01L21/02126 , H01L21/02167 , H01L21/0217 , H01L21/02274 , H01L21/02348 , H01L21/318 , H01L21/3185 , H01L21/76826 , H01L21/76828 , H01L21/76834
-
57.
公开(公告)号:EP2168163A4
公开(公告)日:2012-08-01
申请号:EP08771894
申请日:2008-06-25
Applicant: IBM
Inventor: ESHUN EBENEZER E , JOHNSON JEFFREY B , PHELPS RICHARD A , RASSEL ROBERT M , ZIERAK MICHAEL L
IPC: H01L29/808 , H01L21/337 , H01L29/36
CPC classification number: H01L29/808 , H01L27/0617 , H01L27/098 , H01L29/36 , H01L29/66901
-
58.MASHUP COMPONENT ISOLATION VIA SERVER-SIDE ANALYSIS AND INSTRUMENTATION 审中-公开
Title translation: 混搭COMPONENT ISOLATION通过服务器端分析和仪器公开(公告)号:EP2153315A4
公开(公告)日:2012-08-01
申请号:EP08743430
申请日:2008-05-05
Applicant: IBM
Inventor: STEINER MICHAEL , VIKRAM KRISHNAPRASAD
CPC classification number: H04L63/10 , H04L63/1441 , H04L63/1483
-
59.
公开(公告)号:EP1905074A4
公开(公告)日:2012-06-27
申请号:EP06773946
申请日:2006-06-26
Applicant: IBM
Inventor: BRYANT ANDRES , NOWAK EDWARD J , WILLIAMS RICHARD Q
IPC: H01L21/84 , H01L27/108 , H01L29/786
CPC classification number: H01L27/1203 , H01L21/84 , H01L27/0811 , H01L28/40 , H01L29/78648 , Y10T436/235 , Y10T436/25125 , Y10T436/2525 , Y10T436/25375
-
公开(公告)号:EP2047506A4
公开(公告)日:2012-04-25
申请号:EP07783916
申请日:2007-05-18
Applicant: IBM
Inventor: STANDAERT THEODORUS E , DAVIS PEGEEN M , FITZSIMMONS JOHN A , GRECO STEPHEN E , KO TZE-MAN , LUSTIG NAFTALI E , NICHOLSON LEE M , SANKARAN SUJATHA
IPC: H01L21/4763 , H01L21/768
CPC classification number: H01L21/76808 , H01L21/76805 , H01L21/76814 , H01L21/76846 , H01L2924/0002 , H01L2924/00
-
-
-
-
-
-
-
-
-