摘要:
Provided is a silicone resin composition useful for production of a cured product of a silicone resin composition having high UV stability. A silicone resin composition comprising at least one silicone resin, satisfying the following requirements (i) to (iii) : (i) silicon atoms contained therein essentially consist of at least one kind of silicon atoms selected from the group consisting of A1 silicon atoms and A2 silicon atoms, and A3 silicon atoms, and a ratio of the content of the A3 silicon atoms to the total content of the A1 silicon atoms, the A2 silicon atoms and the A3 silicon atoms is 50 mol% or more and 99 mol% or less; (ii) side chains bonding to the silicon atoms are alkyl groups having 1 to 3 carbons, alkoxy groups having 1 or 2 carbons or hydroxyl groups, a molar ratio of the alkoxy groups is less than 5 to 100 of the alkyl groups, and a molar ratio of the hydroxyl groups is 10 or more to 100 of the alkyl groups; and (iii) a metallic catalyst is not substantially contained.
摘要:
The present invention is directed to an addition curable type silicone resin composition which comprises (a) an organopolysiloxane having an alkenyl group bonded to a silicon atom, (b) an organopolysiloxane represented by the formula, (R 1 R 2 2 SiO 1/2 ) m (R 1 R 2 SiO 2/2 ) n (R 2 2 SiO 2/2 ) p (R 1 SiO 3/2 ) q (R 2 (OR 3 )SiO 2/2 ) r (S iO 4/2 ) s , (c) an organohydrogen polysiloxane represented by R 4 a H b SiO (4-a-b)/2 , (d) a platinum group metal catalyst, and (e) a polyorganometallosiloxane containing an Si-O-Ce bond, and an Si-O-Ti bond, and contents of Ce and Ti of which are each 50 to 5,000 ppm, which cures by heating. According to this constitution, it is provided an addition curable type silicone resin composition which can provide a cured product excellent in transparency, and less change in hardness and weight loss under high temperature conditions.
摘要:
The present invention relates to a first protective film-forming sheet formed by stacking a first pressure-sensitive adhesive layer on a first base material and stacking a curable resin layer on the first pressure-sensitive adhesive layer, in which the curable resin layer is a layer to form a first protective film on a bump-provided surface of a semiconductor wafer by being attached to the surface and cured, a sum of a thickness of the curable resin layer and a thickness of a first pressure-sensitive adhesive layer is 110 µm or more, and the thickness of the curable resin layer is 20 µm to 100 µm.
摘要:
The present invention is a curable composition comprising a component (A), a component (B), a component (C), and a component (D), the curable composition comprising the component (A) and the component (B) in a mass ratio (component (A):component (B)) of 100:0.3 to 100:20, the component (A) being a silane compound (co)polymer that is represented by a formula (a-1) or a formula (a-2), €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ(CHR 1 X 0 -D-SiO 3/2 ) m (R 2 SiO 3/2 ) n (CHR 1 X 0 -D-SiZ 1 O 2/2 ) o (R 2 SiZ 2 O 2/2 ) p (CHR 1 X 0 -D-SiZ 3 2 O 1/2 ) q (R 2 SiZ 4 2 O 1/2 )r ···€ƒ€ƒ€ƒ€ƒ€ƒ(a-1) €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ(R 3 SiO 3/2 ) s (R 3 SiZ 5 O 2/2 ) t (R 3 SiZ 5 2 O 1/2 ) u ···€ƒ€ƒ€ƒ€ƒ€ƒ(a-2) the component (B) being fine particles having an average primary particle size of more than 0.04 µm and 8 µm or less, the component (C) being a silane coupling agent that comprises a nitrogen atom in its molecule, and the component (D) being a silane coupling agent that comprises an acid anhydride structure in its molecule, and an optical element-securing composition, and a cured product, and an optical element-securing material, and a method for using the curable composition, and an optical device.
摘要:
In a semiconductor device (100), a thinly-molded portion (8b) covering a whole of a heat dissipating surface (2b) portion of a lead frame (2) and a die pad space filled portion (8c, 8d) are integrally molded from a second mold resin (8), because of which adhesion between the thinly-molded portion (8b) and lead frame (2) improves owing to the die pad space filled portion (8c, 8d) adhering to a side surface of the lead frame (2). Also, as the thinly-molded portion (8b) is partially thicker owing to the die pad space filled portion (8c, 8d), strength of the thinly-molded portion (8b) increases, and a deficiency or cracking is unlikely to occur.
摘要:
The present invention is a curable polysilsesquioxane compound comprising one structural unit or two or more structural units represented by R 1 SiO 3/2 , the curable polysilsesquioxane compound having a 29 Si nuclear magnetic resonance spectrum that has a first peak top within a range of -60 ppm or more and less than -54 ppm, has a second peak top within a range of -70 ppm or more and less than -61 ppm, and substantially does not have a peak within a range of -53 ppm or more and less than -45 ppm, and a method for producing the curable polysilsesquioxane compound, and a curable composition comprising the curable polysilsesquioxane compound and a silane coupling agent, and a cured product obtained by heating the curable composition, and a method for using the curable polysilsesquioxane compound or the curable composition, as an optical device-securing material.
摘要:
In a semiconductor package, surfaces of a die pad, a semiconductor element, a connecting member, and a lead are subjected to a surface treatment with a silane coupling agent. A first surface of a plurality of surfaces of the semiconductor device includes a first region where an organic substance is exposed, and a second region where an inorganic substance is exposed, the first surface being bonded with the connecting member. A bonding strength between the first region and the sealing resin is weaker than a bonding strength between the second region and the sealing resin.
摘要:
An organosiloxane represented by the following general formula; a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; (C) an adhesion promoter containing the organosiloxane; and (D) a catalyst for hydrosilylation reaction; and a semiconductor device in which a semiconductor element is encapsulated with a cured product of the composition. A novel organosiloxane, a curable silicone composition that contains the novel organosiloxane as an adhesion promoter and that forms a cured product having excellent adhesion to various base materials, and a semiconductor device that is formed by using the composition and that has excellent reliability are provided.
摘要:
The present invention is a curable polysilsesquioxane compound comprising at least one structural unit represented by CHR 1 X 0 -D-SiO 3/2 , the curable polysilsesquioxane compound having a 29 Si nuclear magnetic resonance spectrum that has a first peak top within a range of -73 ppm or more and less than -65 ppm, has a second peak top within a range of -82 ppm or more and less than -73 ppm, and substantially does not have a peak within a range of -65 ppm or more and less than -55 ppm, and a method for producing the curable polysilsesquioxane compound, and a curable composition comprising the curable polysilsesquioxane compound and a silane coupling agent, and a cured product obtained by heating the curable composition, and a method for using the curable polysilsesquioxane compound or the curable composition , as an optical device-securing material.
摘要:
In a resin structure (1) including a resin molded body (5) and a plurality of electronic components (2) embedded in the resin molded body (5), (i) the resin molded body (5) has a plurality of exposed surfaces on which electrodes (3) of the plurality of electronic components (2) are exposed, (ii) the resin molded body (5) has a recess (7) formed therein, and (iii) the recess (7) has a bottom surface (13) which is at least one of the plurality of exposed surfaces.