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    Connection method, connection structure, and electronic device
    66.
    发明公开
    Connection method, connection structure, and electronic device 审中-公开
    Verbindungsverfahren，Verbindungsstruktur und elektronische Vorrichtung

    公开(公告)号：EP2453726A1

    公开(公告)日：2012-05-16

    申请号：EP11192441.1

    申请日：2010-05-18

    Applicant: Sumitomo Electric Industries, Ltd. ,  Sumitomo Electric Printed Circuits, Inc.

    Inventor： Yamamoto, Masamichi ,  Nakatsugi, Kyouichirou ,  Yamaguchi, Takashi ,  Kawakami, Shigeki ,  Kimura, Michihiro

    IPC: H05K3/32 ,  H05K3/36 ,  H05K3/34 ,  H05K3/28

    CPC classification number: H05K3/361 ,  C23F11/149 ,  H01L2924/0002 ,  H05K3/282 ,  H05K3/305 ,  H05K3/323 ,  H05K3/3431 ,  H05K3/4007 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/094 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/308 ,  Y10T156/10 ,  H01L2924/00

    Abstract: [Object] Provided are a connection method and an electronic device, in which the manufacturing process can be simplified, and a connection structure using an adhesive can be produced at low cost.
    [Solution] A connection method according to the present invention includes a step (a2) of preparing a base material including an electrode (22) for connection using an adhesive (30) and an electrode (26) for connection using solder (50); a step (b2) of covering only the electrode (26) for connection using solder with an organic film (15) formed by OSP treatment or a noble metal plating film, the electrode for connection using solder being arranged on the base material; a step (c2) of joining the electrode (26) for connection using solder to a connection conductor (42) using solder by solder reflow treatment in a non-oxidizing atmosphere; and after the step (c2), a step (d2) of bonding the electrode (22) for connection using an adhesive to a connection conductor (12) with an adhesive (30) mainly containing a thermosetting resin to establish electrical connection.

    Abstract translation: 提供了一种连接方法和电子设备，其中可以简化制造过程，并且可以以低成本生产使用粘合剂的连接结构。 [解决方案]根据本发明的连接方法包括制备包括用于使用粘合剂（30）连接的电极（22）和用于使用焊料（50）连接的电极（26）的基材的步骤（a2）。 仅使用焊料与OSP处理形成的有机膜（15）或贵金属电镀膜覆盖用于连接的电极（26）的工序（b2），使用焊料的连接用电极配置在基材上; 在非氧化气氛中通过焊料回流处理使用焊料将用于使用焊料连接的电极（26）连接到连接导体（42）的步骤（c2） 在步骤（c2）之后，用主要包含热固性树脂的粘合剂（30）将用粘合剂连接的电极（22）与连接导体（12）接合以建立电连接的步骤（d2）。

    METHOD FOR PRODUCING TRANSFERRED STRUCTURE AND MOTHER DIE FOR USE IN THE METHOD
    67.
    发明公开
    METHOD FOR PRODUCING TRANSFERRED STRUCTURE AND MOTHER DIE FOR USE IN THE METHOD 有权
    制造用于使用传输的结构和VORLAGENMATRIZE的程序

    公开(公告)号：EP2330876A1

    公开(公告)日：2011-06-08

    申请号：EP09811600.7

    申请日：2009-09-07

    Applicant: Tokyo University Of Science Educational Foundation Administrative Organization

    Inventor： TANIGUCHI, Jun ,  YOSHINO, Norio

    IPC: H05K3/20 ,  B29C33/56 ,  B29C59/02

    CPC classification number: B29C33/56 ,  B29C33/424 ,  B29C33/60 ,  B29C37/0053 ,  H05K3/025 ,  H05K3/20 ,  H05K2201/0239 ,  H05K2201/0373 ,  H05K2203/1152 ,  Y10T428/24479 ,  Y10T428/24612 ,  Y10T428/24802 ,  Y10T428/24926 ,  Y10T428/31663

    Abstract: There are provided a method for producing a transfer structure, in which detachment between a transfer-receiving material and a matrix can be easily achieved without destroying the fine pattern, the transfer pattern of the matrix is satisfactorily transferred to the transfer-receiving material, and the durability of the matrix is maintained for a long time during repeated transfer; and a matrix for use in the method. A film of a silane coupling agent represented by the following formula (I) is formed on a surface of a matrix having a transfer pattern formed on the surface thereof, a transfer-receiving material is applied thereon to transfer the pattern on the surface of the matrix, and the transfer-receiving material is detached from the matrix to obtain a transfer structure formed of the transfer-receiving material. In formula (I), n represents an integer of 8, 10, 12 or 14; m represents an integer of 3 or 4; and X, Y and Z each independently represent a hydrolyzable group that is a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, or a halogen atom.

    Abstract translation: 本发明提供一种方法，用于产生传递结构，在转印接收材料和基体之间的哪个分离可以在不破坏微细图案，矩阵的转印图案良好地转印到转印接收材料可以容易地实现，并且 基质的耐久性维持重复传送期间很长的时间; 和用于该方法中使用的矩阵。 由下式（I）表示的硅烷偶联剂的电影被形成，具有形成在其表面上的转印图案的基质的表面上，转印接收材料被施加在其上以的表面上的图案转移 矩阵，并且转印接收材料从基质分离以获得所形成的转印接收材料的转印结构。 在式（I）中，n为8，10，12或14的整数darstellt; 的3或4整数的米darstellt; 且X，Y和Z各自独立地表示可水解基团是甲氧基一样，在乙氧基，丙氧基，异丙氧基，或者卤原子。

    Heat radiator and power module
    68.
    发明公开
    Heat radiator and power module 有权
    Kühlkörperund Leistungsmodul

    公开(公告)号：EP2306512A2

    公开(公告)日：2011-04-06

    申请号：EP11150797.6

    申请日：2006-07-05

    Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI ,  SHOWA DENKO KABUSHIKI KAISHA

    Inventor： Otoshi, Kota ,  Kono, Eiji ,  Toh, Keiji ,  Tanaka, Katsufumi ,  Furukawa, Yuichi ,  Yamauchi, Shinobu ,  Hoshino, Ryoichi ,  Wakabayashi, Nobuhiro ,  Nakagawa, Shintaro

    IPC: H01L23/36 ,  H05K1/02 ,  H01L23/367

    CPC classification number: H05K3/0061 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/1028 ,  H05K2203/0405 ,  Y02P70/613 ,  H01L2924/00

    Abstract: A heat radiator (20) includes an insulating substrate (3) whose first side serves as a heat-generating-element-mounting side, and a heat sink (5) fixed to a second side of the insulating substrate. Two stress relaxation members (4) formed of a high-thermal-conduction material are disposed between the insulating substrate and the heat sink and include each a plate-like body (10) and a plurality of projections (11) formed on one side of the plate-like body. A side of the plate-like body of one stress relaxation member on which the projections are not formed is metal-bonded to the insulating substrate, whereas a side of the plate-like body of the other stress relaxation member on which the projections are not formed is metal-bonded to the heat sink. The projections of one stress relaxation member are positioned in respective gaps between the projections of the other stress relaxation member, and the end faces of the projections of one stress relaxation member being metal-bonded to the plate-like body of the other stress relaxation member, and vice versa.

    Abstract translation: 散热器（20）包括第一侧用作发热元件安装侧的绝缘基板（3）和固定在绝缘基板的第二面上的散热片（5）。 在绝热基板和散热器之间设置由高导热材料形成的两个应力松弛部件（4），并且包括：板状体（10）和形成在该散热片的一侧的多个突起（11） 板状体。 没有形成有突起的一个应力松弛部件的板状体的一侧金属接合到绝缘基板，而另一个应力松弛部件的板状体的不具有突起的侧面 形成的金属结合到散热器。 一个应力缓和构件的突起位于另一个应力松弛构件的突起之间的相应间隙中，并且一个应力松弛构件的突起的端面金属接合到另一个应力松弛构件的板状体 ，反之亦然。

    An arrangement for electrically and mechanically connecting electronic components to each other
    70.
    发明公开
    An arrangement for electrically and mechanically connecting electronic components to each other 审中-公开
    安排到每个其他电子部件的电和机械连接

    公开(公告)号：EP2175704A1

    公开(公告)日：2010-04-14

    申请号：EP08166206.6

    申请日：2008-10-09

    Applicant: 3M Innovative Properties Company

    Inventor： Van Meijl, Frank ,  Brandt, Konrad ,  Ploehn, Guenther

    IPC: H05K3/32 ,  H01R12/04 ,  H05K3/36 ,  H05K3/40

    CPC classification number: H05K3/325 ,  H05K3/36 ,  H05K3/368 ,  H05K3/4007 ,  H05K2201/0373 ,  H05K2201/209

    Abstract: The invention relates to an arrangement for electrically and mechanically connecting electronic components to each other comprising a first part 1 and second part 22, the two parts each comprise a mechanical reclosable fastener component 11 configured to mate with the mechanical reclosable fastener component 11 of the other part, the fastener components 11 are having a first side 3 providing fastening elements 2 for making a mechanical connection and a second side 4, wherein the first side 3 of the fastener components 11 provides a surface that is made out of an electrically conductive material 5 for making an electrical connection and wherein a conductive path 6, 13 is provided that electrically connects the first side 3 with the second side 4 of the reclosable fastener components 11.

    Abstract translation: 本发明在用于电和机械连接的电子元件的海誓山盟包括第一部分1和第二部分22布置涉及，所述两个部分的每个包括被配置成与其他的机械可再封闭的紧固件部件11配合的可再封闭的机械扣件组件11 部分，所述紧固件部件11具有第一侧3提供紧固元件2制造的机械连接和一个第二侧4，worin所述扣件组件11的第一侧3提供表面没做出来的导电材料5的 用于电连接到和worin的导电路径6中，提供了13做电性可再封闭的扣件组件的第二侧4的第一侧3连接。11

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