公开(公告)号：EP2501209A1

公开(公告)日：2012-09-19

申请号：EP12159201.8

申请日：2012-03-13

Applicant: Fujitsu Limited

Inventor： Nakamura, Naoki ,  Sugane, Mitsuhiko ,  Matsui, Akiko ,  Yamada, Tetsuro ,  Mukoyama, Takahide ,  Hiroshima, Yoshiyuki ,  Ooi, Takahiro

IPC: H05K3/42 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K3/429 ,  H05K1/115 ,  H05K3/0047 ,  H05K2201/09581 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49126

Abstract: A printed wiring board is disclosed that includes insulating layers (11,12,13,14,15), conductive layers (21,22,23,24,25) stacked with the insulating layers alternately, a through hole (60) penetrating the insulating layers and the conductive layers, a first plate resist part (50) formed on a first portion of an inner wall of the through hole, the first portion being located from one end of the through hole to one of the conductive layers stacked between one pair of the insulating layers, and a plated part (40) formed on a second portion of the inner wall of the through hole other than the first portion.

Abstract translation: 的印刷布线板是盘没有游离缺失包括绝缘层（11,12,13,14,15）导电层（21,22,23,24,25）层叠或者，所述绝缘层，通孔（60）贯穿 绝缘层和导电层，第一抗镀剂部分（50），形成在孔的在贯通的内壁的第一部分，所述第一部分从所述通孔的一个端部位于一个堆叠之间的导电层中的一个 对绝缘层，和形成在比该第一部分以外的通孔的内壁的第二部分的电镀部（40）。

公开(公告)号：EP1656006B1

公开(公告)日：2008-01-30

申请号：EP05256299.8

申请日：2005-10-10

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Yamano, Takaharu

IPC: H05K3/42 ,  H05K3/40

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H05K1/0306 ,  H05K3/007 ,  H05K3/205 ,  H05K3/423 ,  H05K3/4605 ,  H05K3/4661 ,  H05K2201/0236 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0723 ,  H05K2203/0733 ,  H05K2203/1105 ,  H05K2203/1383 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A disclosed substrate (50) is composed of a base member (51) having a through-hole (52), a penetrating via (54) provided in the through-hole, and a wiring (68) connected to the penetrating via. The penetrating via includes a penetrating part (55) having two ends on both sides of the base member, which is provided in the through-hole, a first protrusion (56) protruding from the base member, which is formed on a first end of the penetrating part so as to be connected to the wiring, and a second protrusion protruding (57) from the base member, which is formed on a second end of the penetrating part. The first protrusion and second protrusion are wider than a diameter (R1) of the through-hole.

公开(公告)号：EP1408726A4

公开(公告)日：2007-09-19

申请号：EP02749309

申请日：2002-07-17

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： NISHII TOSHIHIRO

IPC: H05K3/40 ,  C08J5/24 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K3/4626 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/002 ,  H05K3/0032 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4632 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/029 ,  H05K2201/0355 ,  H05K2201/09581 ,  H05K2203/0191 ,  H05K2203/065 ,  H05K2203/083 ,  H05K2203/1461 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49146 ,  Y10T428/24917

Abstract: A method of manufacturing a circuit-formed substrate capable of increasing the reliability of an interlayer connection on the circuit-formed substrate and a material for manufacturing a circuit-formed substrate, the method comprising the steps of A) limiting resin flow in a hot press process, B) fusing or sticking reinforcement fibers to each other, C) reducing the thickness of substrate material after a filling process, and D) forming a low fluidized-layer with fillers mixed in the substrate material, the material comprising volatile components capable of providing physical properties to control the resin fluidity in the hot press process or efficiently reducing the thickness of the substrate material after the filling process.

公开(公告)号：EP1408726A1

公开(公告)日：2004-04-14

申请号：EP02749309.7

申请日：2002-07-17

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： NISHII, Toshihiro

IPC: H05K3/40 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  C08J5/24

CPC classification number: H05K3/4626 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/002 ,  H05K3/0032 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4632 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/029 ,  H05K2201/0355 ,  H05K2201/09581 ,  H05K2203/0191 ,  H05K2203/065 ,  H05K2203/083 ,  H05K2203/1461 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49146 ,  Y10T428/24917

Abstract: For the purpose of achieving enhanced reliability with respect to interlayer connections of printed wiring boards, a manufacturing method of printed wiring boards of the present invention comprises any one of the steps of A) restricting the resin flowing in hot press processing, B) joining fiber reinforcements together by fusion or adhesion, C) having the thickness of a board material reduced after a filling process and D) forming a low fluidity layer via a filler mixed in a board material. Such properties as allowing the resin flowing in hot press processing to be controlled are provided to a material for manufacturing printed wiring boards of the present invention or a volatile ingredient is contained therein to allow the thickness of a board material to be reduced efficiently after a filling process.

Abstract translation: 制造电路形成基板的方法包括：（1）限制热压过程中的树脂流动; （2）将增强纤维彼此熔合或粘合; （3）填充后减少基材的厚度; 和（4）在衬底材料中形成具有填料混合的低流化层。 制造电路形成基板的方法包括：（1）限制热压过程中的树脂流动; （2）将增强纤维彼此熔合或粘合; （3）填充后减少基材的厚度; 和（4）在衬底材料中形成具有填料混合的低流化层。 该材料包括能够提供物理性能以控制热压过程中的树脂流动性或在填充过程之后有效降低基底材料的厚度的挥发性组分。

公开(公告)号：EP1122781A3

公开(公告)日：2003-05-02

申请号：EP00308076.9

申请日：2000-09-18

Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA

Inventor： Okada, Masaaki, c/o Mitsubishi Denki

IPC: H01L23/498

CPC classification number: H05K3/321 ,  H01L23/3677 ,  H01L23/49827 ,  H01L2224/2929 ,  H01L2224/29347 ,  H01L2224/29399 ,  H01L2924/09701 ,  H05K2201/09581 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00014

Abstract: An adhesive sheet (6) is interposed between a wiring board (1) and a semiconductor device (3). The adhesive sheet has a sheet-like adhesive base member (60) and a plurality of conductive sections (61) provided at predetermined pitches. The conductive sections (61) are electrically insulated from each other, preferably by insulation (62), and extend from one side of the base member (60) to the other, enabling electrical connection between electrode terminals (2) of the wiring board (1) and electrode terminals (5) of the semiconductor device (3). The conductive sections (61) provide heat conduction paths between the wiring board (1) and the semiconductor device (3).

公开(公告)号：EP1147905A1

公开(公告)日：2001-10-24

申请号：EP99954377.0

申请日：1999-11-05

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  ARRAY AB

Inventor： AIZAWA, Masahiro ,  TSUJIMOTO, Takahiro ,  MIURA, Masayoshi ,  TATEKAWA, Masaichiro

IPC: B41J2/385 ,  H05K3/28 ,  H05K3/00

CPC classification number: H05K3/28 ,  B41J2/08 ,  B41J2/09 ,  B41J2/4155 ,  H05K1/116 ,  H05K3/0017 ,  H05K3/005 ,  H05K2201/09581 ,  H05K2203/0554 ,  H05K2203/0597

Abstract: A control electrode (14) and a deflecting electrode (16) are respectively formed on both faces of an insulating substrate (25), and an insulating protection layer (28) is formed thereon. A holing process for forming a passing hole (13) is carried out through the protection layer (28) formed on the top face of the insulating substrate (25) by using a punch (50) with a diameter d2 larger than the inner diameter d0 of the control electrode (14). Thereafter, exposed portions (19) of the control electrode (14) and the deflecting electrode (16) are etched in a radial direction of the passing hole (13). Then, opening edges (18) of the protection layer (28) are bent toward the insulating substrate (25), so as to cover the control electrode (14) and the deflecting electrode (16).

Abstract translation: 的控制电极（14）和一个偏转电极（16）分别形成在一个绝缘衬底（25），和在绝缘保护层（28）的两面形成于其上。 用于形成通孔（13）一种入座过程是通过形成在绝缘基板（25）的顶面的保护层（28）通过使用一冲头（50）的直径D2比的内径d 0大开展 控制电极（14）的。 控制电极（14）和偏转电极（16）的后，暴露部分（19）被蚀刻在通孔（13）的径向方向。 然后，保护层（28）的开口缘（18）朝向所述绝缘基板（25）弯曲，以覆盖所述控制电极（14）和偏转电极（16）。

公开(公告)号：EP0660649B1

公开(公告)日：2000-02-09

申请号：EP94120343.2

申请日：1994-12-21

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Tonegawa, Ken, c/o Murata Manufacturing Co.Ltd. ,  Mandai, Harufumi, c/o Murata Manufacturing Co.Ltd. ,  Tsuru, Teruhisa, c/o Murata Manufacturing Co.Ltd. ,  Katou, Mitsuhide, c/o Murata Manufacturing Co.Ltd. ,  Furutani, Koji, c/o Murata Manufacturing Co.Ltd.

IPC: H05K1/18

CPC classification number: H05K1/0243 ,  H05K1/0239 ,  H05K1/18 ,  H05K1/181 ,  H05K1/183 ,  H05K3/28 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09581 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09909 ,  H05K2201/1006 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611

公开(公告)号：EP0528311B1

公开(公告)日：1997-01-08

申请号：EP92113566.1

申请日：1992-08-08

Applicant: SPECTROLAB, INC.

Inventor： Cavicchi, Bruce T. ,  Mason, Anne V.

IPC: H01L31/0224 ,  H01L31/18

CPC classification number: H01L31/022425 ,  H05K3/0032 ,  H05K3/0055 ,  H05K2201/0154 ,  H05K2201/09581 ,  Y02E10/50 ,  Y10S428/901

公开(公告)号：EP0660649A3

公开(公告)日：1996-10-23

申请号：EP94120343.2

申请日：1994-12-21

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Tonegawa, Ken, c/o Murata Manufacturing Co.Ltd. ,  Mandai, Harufumi, c/o Murata Manufacturing Co.Ltd. ,  Tsuru, Teruhisa, c/o Murata Manufacturing Co.Ltd. ,  Katou, Mitsuhide, c/o Murata Manufacturing Co.Ltd. ,  Furutani, Koji, c/o Murata Manufacturing Co.Ltd.

IPC: H05K1/18

CPC classification number: H05K1/0243 ,  H05K1/0239 ,  H05K1/18 ,  H05K1/181 ,  H05K1/183 ,  H05K3/28 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09581 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09909 ,  H05K2201/1006 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611

Abstract: An electronic component (11) which is employed in the frequency range in the microwave band or above is mounted on a circuit board (17). The circuit board (17) comprises two linear transmission line members (19, 20), a ground electrode (21), and an electric insulating substrate (18) provided with the transmission line members and the ground electrode on its major surface. The electronic component (11) comprises external electrodes (12 to 15) which are formed on its side surfaces. Holding patches (16) which are formed on the lower surface of the electronic component (11) are bonded to the ground electrode (21) by solder members (23), thereby fixing the electronic component (11) to the circuit board (17). At this time, small clearances (24) are defined between the electronic component (11) and the circuit board (17) through the solder members (23), whereby the external electrodes (12 to 15) are electromagnetically coupled with the transmission line members (19, 20) and the ground electrode (21) through the clearances (24) respectively. Thus, it is possible to obtain a mounting structure for an electronic component, which can suppress development of unnecessary inductance components.

Abstract translation: 在微波波段以上的频率范围内使用的电子部件（11）安装在电路基板（17）上。 电路板（17）包括在其主表面上设置有传输线构件和接地电极的两个线性传输线构件（19,20），接地电极（21）和电绝缘基板（18）。 电子部件（11）包括在其侧表面上形成的外部电极（12至15）。 形成在电子部件（11）的下表面上的保持片（16）通过焊料（23）与接地电极（21）接合，由此将电子部件（11）固定在电路基板（17）上， 。 此时，通过焊料构件（23）在电子部件（11）和电路基板（17）之间形成小的间隙（24），由此外部电极（12〜15）与传输线部件电磁耦合 （19,20）和接地电极（21）分别通过间隙（24）。 因此，可以获得能够抑制不必要的电感成分的发展的电子部件的安装结构。

公开(公告)号：EP0534598B1

公开(公告)日：1996-05-08

申请号：EP92307294.6

申请日：1992-08-10

Applicant: ORC MANUFACTURING CO., LTD.

Inventor： Watanuki, Minoru

IPC: G03F7/20

CPC classification number: G03F7/7005 ,  G03F7/2032 ,  G03F7/70425 ,  H05K3/0082 ,  H05K3/0094 ,  H05K3/064 ,  H05K2201/09581 ,  H05K2203/135 ,  H05K2203/1572