公开(公告)号：EP1258178A2

公开(公告)日：2002-11-20

申请号：EP01911109.5

申请日：2001-02-22

Applicant: PPG Industries Ohio, Inc.

Inventor： DANA, David, E. ,  VELPARI, Vedagiri ,  XU, Langqiu ,  KAHLE, Charles, F., II ,  NOVICH, Bruce, E.

IPC: H05K1/03 ,  C08K3/00 ,  C08K3/34

CPC classification number: H05K1/0373 ,  C03C25/47 ,  H05K1/036 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/029 ,  H05K2201/068 ,  H05K2201/0769 ,  H05K2203/127 ,  Y10T442/20 ,  Y10T442/30 ,  Y10T442/3455

Abstract: The present invention provides an electronic support comprising: (A) at least one woven fiber reinforcement material formed from at least one fiber free of basalt glass; and (B) at least one matrix material in contact with at least a portion of the at least one reinforcement material, the at least one matrix material comprising at least one non-fluorinated polymer and at least one inorganic filler, wherein the at least one inorganic filler comprises at least one non-hydratable, lamellar inorganic solid lubricant having a high electrical resistivity and wherein the at least one inorganic filler comprises at least 6 weight percent of a total combined weight of the at least one inorganic filler and the at least one matrix material on a total solids basis.

公开(公告)号：EP1124769A1

公开(公告)日：2001-08-22

申请号：EP99952920.9

申请日：1999-10-08

Applicant: PPG Industries Ohio, Inc. ,  Lawton, Ernest L. ,  Wu, Xiang ,  Rice, William B. ,  Novich, Bruce E.

Inventor： LAWTON, Ernest, L. ,  WU, Xiang ,  RICE, William, B. ,  NOVICH, Bruce, E.

IPC: C03C25/00

CPC classification number: H05K1/0366 ,  C03C25/47 ,  C08J5/08 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: The present invention provides a coated fiber strand comprising at least one fiber having a layer of a dried residue of a resin compatible coating composition on at least a portion of a surface of the at least one fiber, the resin compatible coating composition comprising: a) a plurality of discrete, dimensionally stable particles formed from materials selected from the group consisting of organic materials, polymeric materials, composite materials and mixtures thereof that provide an interstitial space between the at least one fiber and at least one adjacent fiber, the particles having an average particle size of about 0.1 to 5 micrometers; b) at least one lubricious material; c) at least one polymeric film former; and d) at least one coupling agent, and a fabric incorporating at least one of the fiber strands.

公开(公告)号：EP0805615A3

公开(公告)日：1999-08-11

申请号：EP97500004.3

申请日：1997-01-14

Applicant: Eurocir, S.A.

Inventor： Arola, Juan Llongueras

IPC: H05K3/28

CPC classification number: H05K1/0265 ,  H05K3/28 ,  H05K2201/0166 ,  H05K2201/098 ,  H05K2201/09881

Abstract: Over a base board (1) made of any appropriate electroinsulating material, such as a phenolic resin or an epoxy resin, are established the classic electroconductive track (2), characteristic in that said tracks (2) are covered by a dielectric layer of ink (4), such as a thermic, photopolymeric or ultraviolet ink, which furthermore fills the grooves or gaps (5) defined between the tracks, thereby increasing the dielectric coefficient existing within said grooves (5) up to levels which render the occurence of electric arcs between them impossible, particularly in adverse environments such as corrosive environment resulting from humid and saline conditions, etc.

公开(公告)号：EP0908559A2

公开(公告)日：1999-04-14

申请号：EP98118922.8

申请日：1998-10-07

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC. ,  Kuraray Co., Ltd.

Inventor： Gaku, Morio c/o Mitsubishi Gas Chemical Co., Inc. ,  Nozaki, Mitsuru c/o Mitsubishi Gas Chem. Co., Inc. ,  Saimen, Kenji c/o Kuraray Co., Ltd. ,  Esaki, Tamemaru c/o Kuraray Co., Ltd.

IPC: D21H13/24 ,  D21H17/53 ,  D21H25/06 ,  H05K1/00

CPC classification number: D21H13/24 ,  D21H17/53 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/24322 ,  Y10T442/2475

Abstract: There are disclosed a nonwoven reinforcement for a printed wiring base board which nonwoven reinforcement comprises a wet-system nonwoven fabric constituted of thermotropic cystalline polyester fiber having a melting point of 290°C or higher( component A ) and a thermotropic cystalline polyester binder which has a melting point of 290°C or higher and is in the form of a film having holes including at least 5 holes /mm 2 each with an area of opening of 400 to 10000 µm 2 ( component B ), the component A being fixed by the component B; a process for producing the above nonwoven reinforcement; a printed wiring base board produced from the above nonwoven reinforcement; and a printed wiring board produced from the above printed wiring base board. The nonwoven reinforcement and the printed wiring ( base) board are excellent in various performances such as uniformity, dimensional stability, heat resistance and electrical characteristics such as dielectric constasnt and dielectric loss tangent.

Abstract translation: 有圆盘游离缺失的印刷电路基板的非织造增强件的非织造增强件包括一个湿体系无纺布构成热嗜cystalline聚酯纤维的具有290℃或更高（A成分）的熔点，且具有热嗜cystalline聚酯粘合 的290℃或更高的熔点，是在具有通孔包括至少5个孔/毫米<2>各自具有在400至10000微米<2>（B成分）开口的面积的膜的形式，所述 A组分被固定由组分B; 生产上述非织造增强的工序; 从上述非织造增强所产生的印刷配线基板; 和印刷电路板由上述印刷布线基板制造。 非织造增强件和印刷电路（基极）板具有优异的各种性能：如均匀性，尺寸稳定性，耐热性和检查介电constasnt和介电损耗角正切的电特性。

公开(公告)号：EP0843219A2

公开(公告)日：1998-05-20

申请号：EP98101591.0

申请日：1992-09-15

Applicant: DYMAX CORPORATION

Inventor： Grosclaude, Gary V. ,  Bachmann, Andrew G.

IPC: G03F7/027 ,  C09D4/00 ,  H05K3/34 ,  B23K35/22 ,  B05D1/32

CPC classification number: H05K3/305 ,  B05D1/327 ,  B23K35/224 ,  C09D4/00 ,  G03F7/027 ,  H05K3/0076 ,  H05K3/3452 ,  H05K2201/0166 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/0769 ,  H05K2203/0773 ,  H05K2203/0786 ,  Y02P70/613 ,  C08F220/00

Abstract: A formulation for producing a water-soluble deposit upon a substrate includes a nonaqueous liquid substance comprised of: a cyclic vinyl amide monomer, an aliphatic acrylamide monomer, a water-soluble filler, and a radiation-responsive photoinitiator for effecting polymerization of the monomers. The monomers are copolymerizable to produce a water-soluble copolymer.

Abstract translation: 一种用于制造在一基片的水溶性存款制剂包括由非水液体物质：环状乙烯基酰胺单体，脂肪族的丙烯酰胺单体，水溶性的填料，以及用于实现单体的聚合辐射响应光引发剂。 单体共聚，以产生水溶性的共聚物。

公开(公告)号：EP0805615A2

公开(公告)日：1997-11-05

申请号：EP97500004.3

申请日：1997-01-14

Applicant: Eurocir, S.A.

Inventor： Arola, Juan Llongueras

IPC: H05K3/28

CPC classification number: H05K1/0265 ,  H05K3/28 ,  H05K2201/0166 ,  H05K2201/098 ,  H05K2201/09881

Abstract: Over a base board (1) made of any appropriate electroinsulating material, such as a phenolic resin or an epoxy resin, are established the classic electroconductive track (2), characteristic in that said tracks (2) are covered by a dielectric layer of ink (4), such as a thermic, photopolymeric or ultraviolet ink, which furthermore fills the grooves or gaps (5) defined between the tracks, thereby increasing the dielectric coefficient existing within said grooves (5) up to levels which render the occurence of electric arcs between them impossible, particularly in adverse environments such as corrosive environment resulting from humid and saline conditions, etc.

Abstract translation: 在由诸如酚醛树脂或环氧树脂的任何适当的电绝缘材料制成的基板（1）上建立了经典的导电轨道（2），其特征在于所述轨道（2）被墨水的介电层覆盖 （4），例如热敏，光聚合物或紫外线墨水，其还填充限定在轨道之间的凹槽或间隙（5），从而将存在于所述凹槽（5）内的介电系数增加到使得发生电 它们之间的弧线是不可能的，特别是在恶劣环境下，如潮湿和盐水条件等引起的腐蚀性环境下

公开(公告)号：EP0605567A1

公开(公告)日：1994-07-13

申请号：EP92920447.0

申请日：1992-09-15

Applicant: DYMAX CORPORATION

Inventor： GROSCLAUDE, Gary V. ,  BACHMANN, Andrew G.

IPC: B05D1 ,  B23K35 ,  C09D4 ,  C09D5 ,  C09D7 ,  G03F7 ,  H05K3

CPC classification number: H05K3/305 ,  B05D1/327 ,  B23K35/224 ,  C09D4/00 ,  G03F7/027 ,  H05K3/0076 ,  H05K3/3452 ,  H05K2201/0166 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/0769 ,  H05K2203/0773 ,  H05K2203/0786 ,  Y02P70/613 ,  C08F220/00

Abstract: Un revêtement ou autre dépôt hydrosoluble est produit à partir d'une formulation constituée d'une substance liquide polymérisable et d'un agent dispersé particulaire d'effervescence. La composition est particulièrement utile comme réserve de soudure dans la fabrication de cartes de circuits imprimés, et la composition préférée contient n-vinyle-2-pyrrolidone, N,N-diméthylacrylamide, et polyvinylpyrrolidone.

公开(公告)号：EP0573031A2

公开(公告)日：1993-12-08

申请号：EP93108925.4

申请日：1993-06-03

Applicant: Nippon Paint Co., Ltd.

Inventor： Yoshioka, Mitsuo ,  Yamagami, Yoshikazu ,  Kashihara, Akio ,  Sakurai, Kiyomi

IPC: H05K3/34

CPC classification number: H05K3/28 ,  G03F7/0035 ,  H05K2201/0166 ,  H05K2203/0582 ,  H05K2203/1105

Abstract: The present invention provides an improved method for forming a patterned solder mask having preferred electric insulating property, heat resistance and chemical resistance on a printed circuit board with high resolution.

Abstract translation: 本发明提供一种用于形成具有高分辨率的印刷电路板上具有优选的电绝缘性，耐热性和耐化学性的图案化焊料掩模的改进方法。

公开(公告)号：EP0283546B1

公开(公告)日：1993-07-14

申请号：EP87104580.3

申请日：1987-03-27

Applicant: IBM DEUTSCHLAND GMBH ,  International Business Machines Corporation

Inventor： Bartha, Johann, Dr. ,  Bayer, Thomas ,  Greschner, Johann, Dr. ,  Wittlinger, Jürgen

IPC: H01L21/48 ,  G03F1/00 ,  G03F7/00 ,  H01L21/66

CPC classification number: H05K3/0041 ,  B26F1/28 ,  G03F1/20 ,  G03F7/00 ,  G03F7/12 ,  G03F7/40 ,  H01L21/4803 ,  H01L21/4807 ,  H01L21/486 ,  H01L2924/0002 ,  H05K1/0326 ,  H05K1/0393 ,  H05K3/42 ,  H05K2201/0166 ,  Y10S438/928 ,  H01L2924/00

公开(公告)号：EP0527980A1

公开(公告)日：1993-02-24

申请号：EP92904744.0

申请日：1992-02-21

Applicant: DYCONEX PATENTE AG

Inventor： SCHMIDT, Walter ,  MARTINELLI, Marco ,  FREI, Alexandra

IPC: B01D39 ,  B01D67 ,  B01D69 ,  B07B1 ,  B81B1 ,  G02B6 ,  H05K3 ,  H05K1

CPC classification number: B07B1/4618 ,  B01D39/1692 ,  B01D67/0034 ,  B01D69/12 ,  B01D2323/345 ,  B07B1/4663 ,  G02B6/122 ,  G02B6/4228 ,  G02B6/423 ,  H05K1/0272 ,  H05K1/0393 ,  H05K3/0041 ,  H05K3/42 ,  H05K2201/0166 ,  H05K2201/0394 ,  H05K2201/064 ,  H05K2201/09509 ,  H05K2203/0554

Abstract: Afin de produire un microtamis déterminé ayant un grand nombre de passages de n'importe quelle forme voulue agencés de manière précise, on recouvre une feuille mince (2) en matière plastique d'une couche de matériau (2, 2') résistant à la morsure. On forme ensuite, par attaque, des évidements (4, 4') dans ladite couche (2, 2'), aux endroits où les passages doivent être formés. Pendant une autre étape du procédé, les passages (5) sont produits par un procédé d'attaque au plasma. En outre, on introduit des conduits (K, L) dans la couche de couverture (2, 2'), que ce soit sous forme de canaux (K) ou sous forme de pistes solides (L). On superpose plusieurs microtamis (S1, S2) afin de former un corps composite déterminé. Les couches superposées sont orientées en fonction des conduits (5, K, L), de sorte que ceux-ci soient réticulés dans les directions x, y et z. Des exemples d'application sont des diaphragmes de conduite de fluides, des multicouches conductrices d'électricité, des microsystèmes réticulés de guides d'ondes lumineuses.