公开(公告)号：EP2907159A4

公开(公告)日：2016-06-01

申请号：EP13845644

申请日：2013-10-09

Applicant: MC10 INC

Inventor： RAFFERTY CONOR ,  DALAL MITUL

IPC: H01L23/13 ,  H01L23/16

CPC classification number: H01L23/4985 ,  H01L21/56 ,  H01L21/6836 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/82 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/02379 ,  H01L2224/03436 ,  H01L2224/036 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15153 ,  H05K1/0283 ,  H05K1/185 ,  H05K1/189 ,  H05K2203/1469 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Systems and methods are provided for the embedding of thin chips. A well region is generated in a substrate that includes a conductive material disposed on a flexible polymer. The standoff well region can be generated by pattern the conductive material, where the thin chip is embedded in the standoff well region. A cavity can be generated in the polymer layer to form a polymer well region, where the thin chip is embedded in the polymer well region.

Abstract translation: 提供了用于嵌入薄芯片的系统和方法。 在包括设置在柔性聚合物上的导电材料的基板中产生阱区。 间隙阱区域可以通过导电材料的图案产生，其中薄的芯片嵌入在隔离阱区域中。 可以在聚合物层中产生空腔以形成聚合物阱区域，其中薄芯片嵌入聚合物阱区域。

公开(公告)号：EP3201946A4

公开(公告)日：2018-08-01

申请号：EP15847196

申请日：2015-10-02

Applicant: MC10 INC

Inventor： DALAL MITUL ,  GUPTA SANJAY

IPC: H01L23/538

CPC classification number: H01L23/5389 ,  H01L21/2885 ,  H01L21/486 ,  H01L21/56 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/42 ,  H01L23/481 ,  H01L23/49866 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5387 ,  H01L24/83 ,  H01L2224/48137 ,  H01L2224/8385 ,  H01L2924/0635 ,  H01L2924/07025

Abstract: Flexible integrated circuit (IC) modules, flexible IC devices, and methods of making and using flexible IC modules are presented herein. A flexible integrated circuit module is disclosed which includes a flexible substrate and a semiconductor die attached to the flexible substrate. An encapsulating layer, which is attached to the flexible substrate, includes a thermoplastic resin and/or a polyimide adhesive encasing therein the semiconductor die. The encapsulating layer may be an acrylic-based thermally conductive and electrically isolating polyimide adhesive. Optionally, the encapsulating layer may be a B-stage FR-4 glass-reinforced epoxy thermoplastic polymer or copolymer or blend. The die may be embedded between two flexible substrates, each of which includes a layer of flexible polymer, such as a polyimide sheet, with two layers of conductive material, such as copper cladding, disposed on opposing sides of the layer of flexible polymer.

公开(公告)号：EP3204963A4

公开(公告)日：2018-03-21

申请号：EP15848328

申请日：2015-10-02

Applicant: MC10 INC

Inventor： DALAL MITUL ,  GUPTA SANJAY

IPC: H01L23/538 ,  H01L23/13 ,  H01L23/528 ,  H05K1/14

CPC classification number: H01L25/0655 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5387 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/86 ,  H01L24/92 ,  H01L24/95 ,  H01L25/50 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48157 ,  H01L2224/48499 ,  H01L2224/49176 ,  H01L2224/50 ,  H01L2224/73219 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/85005 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85801 ,  H01L2224/86005 ,  H01L2224/86801 ,  H01L2224/92244 ,  H01L2224/92247 ,  H01L2224/92248 ,  H01L2224/95 ,  H01L2224/95001 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K1/147 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/19 ,  H01L2224/85 ,  H01L2224/86 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: Flexible interconnects, flexible integrated circuit systems and devices, and methods of making and using flexible integrated circuitry are presented herein. A flexible integrated circuit system is disclosed which includes first and second discrete devices that are electrically connected by a discrete flexible interconnect. The first discrete devices includes a first flexible multi-layer integrated circuit (IC) package with a first electrical connection pad on an outer surface thereof. The second discrete device includes a second flexible multi-layer integrated circuit (IC) package with a second electrical connection pad on an outer surface thereof. The discrete flexible interconnect is attached to and electrically connects the first electrical connection pad of the first discrete device to the second electrical connection pad of the second discrete device.

公开(公告)号：EP3198638A4

公开(公告)日：2018-05-30

申请号：EP15843188

申请日：2015-09-21

Applicant: MC10 INC

Inventor： GARLOCK DAVID G ,  LI XIA ,  GUPTA SANJA ,  DALAL MITUL

IPC: H01L23/49 ,  G06K19/077

CPC classification number: H01L24/48 ,  G06K19/07779 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45118 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/4516 ,  H01L2224/45164 ,  H01L2224/45166 ,  H01L2224/45169 ,  H01L2224/45171 ,  H01L2224/4809 ,  H01L2224/48092 ,  H01L2224/48137 ,  H01L2224/48463 ,  H01L2224/48511 ,  H01L2224/78252 ,  H01L2224/78301 ,  H01L2224/78349 ,  H01L2224/78611 ,  H01L2224/85207 ,  H01L2224/85947 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A capillary tool for use in feeding, bending, and attaching a bonding wire between a pair of bond pads includes a body and a heating element. The body has an internal tube that extends from a first surface of the capillary tool to a second surface of the capillary tool. In some implementations, the internal tube has a portion with a generally helical shape that includes at least a portion of one complete revolution about a central axis of the body. The heating element is coupled to the body to provide a heat affected zone along a portion of the internal tube that heats the bonding wire as the bonding wire is fed through the internal tube.

公开(公告)号：EP3164905A4

公开(公告)日：2018-01-03

申请号：EP14896498

申请日：2014-10-27

Applicant: MC10 INC

Inventor： LI XIA ,  DALAL MITUL ,  HUPPERT GILBERT LEE ,  GUPTA SANJAY

IPC: H01Q1/22 ,  G06K19/02 ,  G06K19/077 ,  H01Q1/24 ,  H01Q1/27 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q7/00 ,  H05K1/02

CPC classification number: H01Q7/00 ,  G06K19/025 ,  G06K19/027 ,  G06K19/07777 ,  G06K19/0779 ,  H01Q1/2208 ,  H01Q1/248 ,  H01Q1/273 ,  H01Q1/38 ,  H05K1/0283 ,  H05K1/189 ,  H05K2201/09263 ,  H05K2201/10098

Abstract: The present invention relates to a flexible antenna that can harvest energy for short-range wireless communication such as near-field communication. The flexible antenna comprises a plurality of metal loops arranged in a concentric manner and disposed on a flexible base substrate. In some embodiments the flexible antenna can be stretchable. In some embodiments, the flexible antenna can be conformal. A flexible device comprising a chip or an integrated circuit electrically connected to the antenna can be used to perform one or more desirable functions (including user authentication, mobile payments, and/or location tracking) The flexible device can adhere to a surface such as the skin of a user.