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1.发明公开
公开(公告)号：EP2530786A4
公开(公告)日：2013-07-10
申请号：EP11736877
申请日：2011-01-18
申请人： SUMITOMO BAKELITE CO
发明人： KAGIMOTO TOMOHIRO , CHUMA TOSHIAKI
IPC分类号： H01R11/01 , B32B15/08 , C09D7/12 , C09D201/00 , H01B1/22 , H01B5/16 , H01L21/60 , H01R4/02 , H01R43/02 , H05K3/32
CPC分类号： H01L24/29 , B32B15/08 , B32B2311/14 , B32B2311/16 , C09D5/24 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L2224/11436 , H01L2224/11522 , H01L2224/13022 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/29 , H01L2224/29012 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/29311 , H01L2224/32225 , H01L2224/73204 , H01L2224/83101 , H01L2224/83203 , H01L2224/83205 , H01L2224/83222 , H01L2224/83224 , H01L2224/83815 , H01L2224/83886 , H01L2224/9201 , H01L2224/9211 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01059 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H01L2924/1579 , H01L2924/3025 , H05K3/3436 , H05K3/3478 , H05K3/3489 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , H01L2924/00 , H01L2924/01083 , H01L2924/00014 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199
摘要： A conductive connecting sheet (1) of the present invention is composed of a layered body including resin composition layers (11, 13) and a metal layer (12), and each resin composition layer (11, 13) satisfies the following requirement A: in the case where at least a part of metal ball(s) made of the metal material having low melting point is provided within each resin composition layer (11, 13), the metal ball(s) is heated at a temperature which is a melting temperature thereof or higher according to "test methods for soldering resin type fluxes" defined in JIS Z 3197, and then a wet extension of the metal ball (s) is measured, the wet extension is 37% or more. If the conductive connecting sheet is used for forming connection portions electrically connecting terminals to each other, the connection portions can be formed by selectively aggregating a heated and melted metal material between the terminals and a sealing layer constituted from a resin component can be formed so as to surround the connection portions. As a result, since peripheries of the connection portions can be covered by the resin component, the connection portions are fixed. Further, since an insulating property between the adjacent terminals can be secured by the sealing layer, generation of a leak current between the adjacent terminals can be reliably prevented.
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2.发明公开RESIN COMPOSITION FOR FLIP-CHIP PACKAGING AND RESIN COMPOSITION FOR FORMING BUMP 审中-公开树脂组合物为形成Beule的倒装芯片包封和树脂组分
公开(公告)号：EP1830399A4
公开(公告)日：2012-07-11
申请号：EP05816822
申请日：2005-12-14
申请人： PANASONIC CORP
发明人： KITAE TAKASHI , KARASHIMA SEIJI , HIRANO KOICHI , KOJIMA TOSHIYUKI , NAKATANI SEIICHI , KOMATSU SHINGO , YAMASHITA YOSHIHISA
CPC分类号： H05K3/323 , H01L21/6835 , H01L23/49838 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/05554 , H01L2224/06131 , H01L2224/06135 , H01L2224/11001 , H01L2224/11003 , H01L2224/1141 , H01L2224/11502 , H01L2224/11522 , H01L2224/13099 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/16058 , H01L2224/16225 , H01L2224/16227 , H01L2224/165 , H01L2224/2741 , H01L2224/27436 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/293 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/73204 , H01L2224/8121 , H01L2224/81815 , H01L2224/83097 , H01L2224/83192 , H01L2224/832 , H01L2224/83856 , H01L2224/83862 , H01L2224/8388 , H01L2224/83886 , H01L2224/83887 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01061 , H01L2924/01065 , H01L2924/01073 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/381 , H01L2924/3841 , H05K3/3436 , H05K2201/10674 , H05K2201/10977 , H05K2203/083 , H05K2203/087 , Y02P70/613 , H01L2924/00011 , H01L2924/066 , H01L2924/06 , H01L2924/0695 , H01L2924/062 , H01L2924/0615 , H01L2924/068 , H01L2924/0705 , H01L2924/0675 , H01L2924/07001 , H01L2924/0103 , H01L2924/01047 , H01L2924/01029 , H01L2924/01083 , H01L2924/00015 , H01L2924/00 , H01L2924/00014
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3.发明公开RESIN COMPOSITION FOR FLIP-CHIP PACKAGING AND RESIN COMPOSITION FOR FORMING BUMP 审中-公开HARZZUSAMMENSETZUNGFÜRFLIP-CHIP-KAPSELUNG UND HARZZUSAMMENSETZUNG ZUR BILDUNG EINER BEULE
公开(公告)号：EP1830399A1
公开(公告)日：2007-09-05
申请号：EP05816822.0
申请日：2005-12-14
发明人： KITAE, Takashi c/o Matsushita Electric Industrial Co., Ltd. , KARASHIMA, Seiji c/o Matsushita Electric Industrial Co., Ltd. , HIRANO, Koichi c/o Matsushita Electric Industrial Co., Ltd. , KOJIMA, Toshiyuki c/o Matsushita Electric Industrial Co., Ltd. , NAKATANI, Seiichi c/o Matsushita Electric Industrial Co., Ltd. , KOMATSU, Shingo c/o Matsushita Electric Industrial Co., Ltd. , YAMASHITA, Yoshihisa c/o Matsushita Electric Industrial Co., Ltd.
CPC分类号： H05K3/323 , H01L21/6835 , H01L23/49838 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/05554 , H01L2224/06131 , H01L2224/06135 , H01L2224/11001 , H01L2224/11003 , H01L2224/1141 , H01L2224/11502 , H01L2224/11522 , H01L2224/13099 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/16058 , H01L2224/16225 , H01L2224/16227 , H01L2224/165 , H01L2224/2741 , H01L2224/27436 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/293 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/73204 , H01L2224/8121 , H01L2224/81815 , H01L2224/83097 , H01L2224/83192 , H01L2224/832 , H01L2224/83856 , H01L2224/83862 , H01L2224/8388 , H01L2224/83886 , H01L2224/83887 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01061 , H01L2924/01065 , H01L2924/01073 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/381 , H01L2924/3841 , H05K3/3436 , H05K2201/10674 , H05K2201/10977 , H05K2203/083 , H05K2203/087 , Y02P70/613 , H01L2924/00011 , H01L2924/066 , H01L2924/06 , H01L2924/0695 , H01L2924/062 , H01L2924/0615 , H01L2924/068 , H01L2924/0705 , H01L2924/0675 , H01L2924/07001 , H01L2924/0103 , H01L2924/01047 , H01L2924/01029 , H01L2924/01083 , H01L2924/00015 , H01L2924/00 , H01L2924/00014
摘要： There is provided a flip-chip mounting resin composition which can be used for a flip-chip mounting process that is high in productivity and reliability and thus can be applicable to a flip-chip mounting of a next-generation LSI. This flip-chip mounting resin composition comprises a resin, metal particles and a convection additive 12 that boils upon heating the resin 13. Upon the heating of the resin 13, the metal particles melt and the boiling convection additive 12 convects within the resin 13. This flip-chip mounting resin composition is supplied between a circuit substrate 10 and a semiconductor chip 20, and subsequently the resin 13 is heated so that the molten metal particles self-assemble into the region between each electrode of the circuit substrate and each electrode of the semiconductor chip. As a result, an electrical connection is formed between each electrode of the circuit substrate and each electrode of the semiconductor chip. Finally, the resin 13 is allowed to cure so that the semiconductor chip 20 is secured to the circuit substrate 10, which leads to in a formation of a flip chip assembly.
摘要翻译： 提供了一种倒装芯片安装树脂组合物，其可用于生产率和可靠性高的倒装芯片安装工艺，因此可用于下一代LSI的倒装芯片安装。 这种倒装芯片安装树脂组合物包括树脂，金属颗粒和在加热树脂13时沸腾的对流添加剂12.在加热树脂13时，金属颗粒熔化，沸腾对流添加剂12在树脂13内对流。 将该倒装芯片安装树脂组合物供给在电路基板10和半导体芯片20之间，随后加热树脂13，使得熔融金属颗粒自组装成电路基板的每个电极和每个电极 半导体芯片。 结果，在电路基板的每个电极和半导体芯片的每个电极之间形成电连接。 最后，使树脂13固化，使得半导体芯片20固定到电路基板10，这导致形成倒装芯片组件。
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公开(公告)号：EP1865549A4
公开(公告)日：2012-07-11
申请号：EP06729266
申请日：2006-03-16
申请人： PANASONIC CORP
发明人： KARASHIMA SEIJI , KITAE TAKASHI , NAKATANI SEIICHI
CPC分类号： H05K3/3484 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/742 , H01L24/75 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11001 , H01L2224/11005 , H01L2224/1141 , H01L2224/11502 , H01L2224/11522 , H01L2224/11849 , H01L2224/13099 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/1601 , H01L2224/16058 , H01L2224/16225 , H01L2224/16227 , H01L2224/165 , H01L2224/16505 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/293 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/29347 , H01L2224/294 , H01L2224/29411 , H01L2224/32225 , H01L2224/73204 , H01L2224/742 , H01L2224/75 , H01L2224/83097 , H01L2224/83192 , H01L2224/83204 , H01L2224/83211 , H01L2224/83855 , H01L2224/83862 , H01L2224/83874 , H01L2224/8388 , H01L2224/83886 , H01L2224/83887 , H01L2924/00014 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01067 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15311 , H01L2924/301 , H01L2924/30105 , H01L2924/381 , H05K3/323 , H05K2201/10977 , H05K2203/0425 , H05K2203/087 , H05K2203/1178 , Y10T156/1744 , H01L2924/00011 , H01L2924/0103 , H01L2924/01051 , H01L2924/01083 , H01L2924/00015 , H01L2924/066 , H01L2924/00 , H01L2224/05599
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5.发明公开
公开(公告)号：EP1996002A4
公开(公告)日：2011-06-15
申请号：EP07715091
申请日：2007-02-22
申请人： PANASONIC CORP
发明人： TANIGUCHI YASUSHI , NAKATANI SEIICHI , KARASHIMA SEIJI , KITAE TAKAHASHI , MATSUOKA SUSUMU , KOYAMA MASAYOSHI
CPC分类号： H05K3/3484 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/742 , H01L24/81 , H01L2224/11003 , H01L2224/11005 , H01L2224/11522 , H01L2224/13099 , H01L2224/16 , H01L2224/81801 , H01L2224/83886 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H05K2203/0278 , H05K2203/043 , H05K2203/0776 , H05K2203/087 , Y10T29/49124 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/532 , Y10T29/53204 , H01L2924/00
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公开(公告)号：EP1873819A4
公开(公告)日：2012-07-11
申请号：EP06745367
申请日：2006-03-16
申请人： PANASONIC CORP
CPC分类号： H01L24/16 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11001 , H01L2224/11003 , H01L2224/1141 , H01L2224/11502 , H01L2224/11522 , H01L2224/13022 , H01L2224/13099 , H01L2224/13105 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/16225 , H01L2224/16227 , H01L2224/165 , H01L2224/2741 , H01L2224/27436 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/29299 , H01L2224/29305 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/83192 , H01L2224/832 , H01L2224/83856 , H01L2224/83862 , H01L2224/83874 , H01L2224/8388 , H01L2224/83885 , H01L2224/83886 , H01L2224/83887 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H01L2924/1579 , H01L2924/381 , H01L2924/3841 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/0264 , H05K2203/087 , H05K2203/1178 , Y02P70/613 , H01L2924/01031 , H01L2924/01049 , H01L2924/01051 , H01L2924/01083 , H01L2924/00011 , H01L2924/00015 , H01L2924/066 , H01L2924/06 , H01L2924/0675 , H01L2924/0695 , H01L2924/00 , H01L2224/05599
摘要： The invention involves mounting a solder resin composition (6) including a solder powder (5a) and a resin (4) on the first electronic component (2); arranging such that the connecting terminals (3) of the first electronic component (2) and the electrode terminals (7) of the second electronic component (8) are facing each other; ejecting a gas (9a) from a gas generation source (1) included in the first electronic component (2) by heating the first electronic component (2) and the solder resin composition; and inducing the flow of the solder powder (5a) in the solder resin composition (6) by inducing convection of the gas (9a) in the solder resin composition (6), and electrically connecting the connecting terminals (3) and the electrode terminals (7) by self-assembly on the connecting terminals (3) and the electrode terminals (7). Through this are provided a flip chip packaging method that enables connecting, with high connection reliability, electrode terminals of a semiconductor chip wired with narrow pitch and connecting terminals of a circuit board, and a bump formation method for packaging on a circuit board.
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公开(公告)号：EP1996002A1
公开(公告)日：2008-11-26
申请号：EP07715091.0
申请日：2007-02-22
发明人： TANIGUCHI, Yasushi, c/o Matsushita Electric Industrial Co., Ltd. , NAKATANI, Seiichi, c/o Matsushita Electric Industrial Co., Ltd. , KARASHIMA, Seiji, c/o Matsushita Electric Industrial Co., Ltd. , KITAE, Takahashi, c/o Matsushita Electric Industrial Co., Ltd. , MATSUOKA, Susumu, c/o Matsushita Electric Industrial Co., Ltd. , KOYAMA, Masayoshi, c/o Matsushita Electric Industrial Co., Ltd.
CPC分类号： H05K3/3484 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/742 , H01L24/81 , H01L2224/11003 , H01L2224/11005 , H01L2224/11522 , H01L2224/13099 , H01L2224/16 , H01L2224/81801 , H01L2224/83886 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H05K2203/0278 , H05K2203/043 , H05K2203/0776 , H05K2203/087 , Y10T29/49124 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/532 , Y10T29/53204 , H01L2924/00
摘要： In a method for forming bumps 19 on electrodes 32 of a wiring board 31, a fluid 14 containing conductive particles 16 and a gas bubble generating agent is supplied onto a first region 17 including the electrodes 32 on the wiring board 31. Then, a substrate 40 which has a protruding surface 13 having the same area as that of the first region 17 and formed on a main surface 18 of the substrate 40 having a larger area than that of the first region 17 is disposed so that the protruding surface 13 faces the first region 17 of the wiring board 31 . Then, the fluid 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.
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8.发明公开FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD 审中-公开FL EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN
公开(公告)号：EP1865549A1
公开(公告)日：2007-12-12
申请号：EP06729266.4
申请日：2006-03-16
发明人： KARASHIMA, Seiji, c/o MATSUSHITA ELECTRIC INDUSTRIAL Co. Ltd , KITAE, Takashi, c/o MATSUSHITA ELECTRIC INDUSTRIAL Co. Ltd , NAKATANI, Seiichi, c/o MATSUSHITA ELECTRIC INDUSTRIAL Co. Ltd
CPC分类号： H05K3/3484 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/742 , H01L24/75 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11001 , H01L2224/11005 , H01L2224/1141 , H01L2224/11502 , H01L2224/11522 , H01L2224/11849 , H01L2224/13099 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/1601 , H01L2224/16058 , H01L2224/16225 , H01L2224/16227 , H01L2224/165 , H01L2224/16505 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/293 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/29347 , H01L2224/294 , H01L2224/29411 , H01L2224/32225 , H01L2224/73204 , H01L2224/742 , H01L2224/75 , H01L2224/83097 , H01L2224/83192 , H01L2224/83204 , H01L2224/83211 , H01L2224/83855 , H01L2224/83862 , H01L2224/83874 , H01L2224/8388 , H01L2224/83886 , H01L2224/83887 , H01L2924/00014 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01067 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15311 , H01L2924/301 , H01L2924/30105 , H01L2924/381 , H05K3/323 , H05K2201/10977 , H05K2203/0425 , H05K2203/087 , H05K2203/1178 , Y10T156/1744 , H01L2924/00011 , H01L2924/0103 , H01L2924/01051 , H01L2924/01083 , H01L2924/00015 , H01L2924/066 , H01L2924/00 , H01L2224/05599
摘要： A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a bump forming method are provided. After a resin 14 containing a solder powder 16 and a gas bubble generating agent is supplied to a space between a circuit board 21 having a plurality of connecting terminals 11 and a semiconductor chip 20 having a plurality of electrode terminals 12, the resin 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the resin 14. The resin 14 is pushed toward the outside of the generated gas bubbles 30 by the growth thereof and self-assembled between the connecting terminals 11 and the electrode terminals 12. By further heating the resin 14 and melting the solder powder 16 contained in the resin 14 self-assembled between the terminals, connectors 22 are formed between the terminals to complete a flip chip mounting body.
摘要翻译： 提供了适用于下一代LSI的倒装芯片安装以及高生产率和可靠性以及凸块形成方法的倒装芯片安装方法。 在将含有焊料粉末16和气泡发生剂的树脂14供给到具有多个连接端子11的电路板21和具有多个电极端子12的半导体芯片20之间的空间的同时，加热树脂14 从包含在树脂14中的气泡生成剂产生气泡30.树脂14通过其生长被推向产生的气泡30的外部，并且在连接端子11和电极端子12之间自组装。 通过进一步加热树脂14并熔化包含在端子之间自组装的树脂14中的焊料粉末16，在端子之间形成连接器22以完成倒装芯片安装体。
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公开(公告)号：EP1996002B1
公开(公告)日：2017-07-05
申请号：EP07715091.0
申请日：2007-02-22
发明人： TANIGUCHI, Yasushi , NAKATANI, Seiichi , KARASHIMA, Seiji , KITAE, Takashi , MATSUOKA, Susumu , KOYAMA, Masayoshi
IPC分类号： H01L23/00 , H01L21/683 , H01L21/60 , H05K3/34 , H01L21/48
CPC分类号： H05K3/3484 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/742 , H01L24/81 , H01L2224/11003 , H01L2224/11005 , H01L2224/11522 , H01L2224/13099 , H01L2224/16 , H01L2224/81801 , H01L2224/83886 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H05K2203/0278 , H05K2203/043 , H05K2203/0776 , H05K2203/087 , Y10T29/49124 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/532 , Y10T29/53204 , H01L2924/00
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10.发明公开
公开(公告)号：EP2530786A1
公开(公告)日：2012-12-05
申请号：EP11736877.9
申请日：2011-01-18
发明人： KAGIMOTO Tomohiro , CHUMA Toshiaki
IPC分类号： H01R11/01 , C09D7/12 , C09D201/00 , H01B1/22 , H01B5/16 , H01L21/60 , H01R4/02 , H01R43/02 , H05K3/32
CPC分类号： H01L24/29 , B32B15/08 , B32B2311/14 , B32B2311/16 , C09D5/24 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L2224/11436 , H01L2224/11522 , H01L2224/13022 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/29 , H01L2224/29012 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/29311 , H01L2224/32225 , H01L2224/73204 , H01L2224/83101 , H01L2224/83203 , H01L2224/83205 , H01L2224/83222 , H01L2224/83224 , H01L2224/83815 , H01L2224/83886 , H01L2224/9201 , H01L2224/9211 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01059 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H01L2924/1579 , H01L2924/3025 , H05K3/3436 , H05K3/3478 , H05K3/3489 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , H01L2924/00 , H01L2924/01083 , H01L2924/00014 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199
摘要： A conductive connecting sheet (1) of the present invention is composed of a layered body including resin composition layers (11, 13) and a metal layer (12), and each resin composition layer (11, 13) satisfies the following requirement A: in the case where at least a part of metal ball(s) made of the metal material having low melting point is provided within each resin composition layer (11, 13), the metal ball(s) is heated at a temperature which is a melting temperature thereof or higher according to "test methods for soldering resin type fluxes" defined in JIS Z 3197, and then a wet extension of the metal ball (s) is measured, the wet extension is 37% or more. If the conductive connecting sheet is used for forming connection portions electrically connecting terminals to each other, the connection portions can be formed by selectively aggregating a heated and melted metal material between the terminals and a sealing layer constituted from a resin component can be formed so as to surround the connection portions. As a result, since peripheries of the connection portions can be covered by the resin component, the connection portions are fixed. Further, since an insulating property between the adjacent terminals can be secured by the sealing layer, generation of a leak current between the adjacent terminals can be reliably prevented.
摘要翻译： 的导电连接片（1）本发明的由层积体的包含树脂组合物层（11，13）和金属层（12），和各树脂组合物层（11，13）SATIS外资企业下面要求答： 在其中至少有由具有低熔点的金属材料的金属球（一个或多个）的一部分的各树脂组合物层（11，13）中提供的情况下，金属球（一个或多个）在一定温度下加热所有这是一个 其熔化温度以上gemäß到“测试方法用于焊接树脂型通量”在JIS Z 3197所定义，然后将金属球（一个或多个）的湿延伸测定，湿延伸是37％以上。 如果导电连接片被用于形成连接部分电连接端子海誓山盟，连接部分可以通过选择性地聚集在端子和密封层之间的加热熔融金属材料来形成由树脂成分构成，可以形成为 以围绕连接部。 其结果是，由于连接部份的边缘可以通过树脂成分所覆盖，所述连接部分被固定。 此外，由于在相邻的端子之间的绝缘性可以通过密封层被固定，产生相邻端子之间的漏电流可以被可靠地防止。
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