公开(公告)号：EP3619748B1

公开(公告)日：2024-04-17

申请号：EP18794585.2

申请日：2018-05-07

IPC: H01L21/683 ,  H01L23/00 ,  H01L33/00 ,  H01S5/02 ,  H01L21/02 ,  H01S5/343 ,  H01L33/46 ,  H01L33/32 ,  H01L33/20

CPC classification number: H01L33/0075 ,  H01L33/20 ,  H01S5/0217 ,  H01S5/34333 ,  H01S2304/1220130101 ,  H01L33/0093 ,  H01L21/02389 ,  H01L21/0254 ,  H01L21/02647 ,  H01L21/02458 ,  H01L2224/3224520130101 ,  H01L2224/8319220130101 ,  H01L2224/8389520130101 ,  H01L2224/3222520130101 ,  H01L2224/8344420130101 ,  H01L2224/8320320130101 ,  H01L2224/0561120130101 ,  H01L2224/0564420130101 ,  H01L2924/1574720130101 ,  H01L2924/103320130101 ,  H01L2224/0402620130101 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/8380520130101 ,  H01L24/83 ,  H01L2224/8301320130101 ,  H01L2224/8302220130101 ,  H01L2224/2911120130101 ,  H01L2224/2914420130101 ,  H01L2224/8344720130101 ,  H01L2224/8044420130101 ,  H01L2224/8001320130101 ,  H01L2224/8020320130101 ,  H01L2224/8089520130101 ,  H01L24/80 ,  H01L2224/0824520130101 ,  H01L2224/0822520130101 ,  H01L24/08 ,  H01L2224/0420130101 ,  H01L2224/034520130101 ,  H01L24/03 ,  H01L2224/8000620130101 ,  H01L2224/8300520130101 ,  H01L2224/0823820130101 ,  H01L2224/0825820130101 ,  H01L2224/0555820130101 ,  H01L21/6835 ,  H01L24/06 ,  H01L2224/0618120130101 ,  H01L2924/1204220130101 ,  H01L2224/920220130101 ,  H01L2224/9420130101 ,  H01L24/94 ,  H01L24/92 ,  H01L2224/9214220130101 ,  H01L2224/921220130101 ,  H01L2221/6838120130101 ,  H01L2221/6831820130101 ,  H01L2221/683520130101 ,  H01L2221/6836320130101 ,  H01L2224/80420130101 ,  H01L2224/804920130101 ,  H01L2224/051820130101 ,  H01L2224/0514420130101 ,  H01L2224/0566920130101 ,  H01L2224/0518420130101 ,  H01L2224/0513920130101 ,  H01L2224/0566420130101 ,  H01L2224/0565520130101 ,  H01L2224/0563920130101 ,  H01L2224/0516420130101 ,  H01L2224/0516620130101 ,  H01L2224/0516920130101 ,  H01L2224/056820130101 ,  H01L2224/0568420130101 ,  H01L2224/0566620130101 ,  H01L2224/0515520130101 ,  H01S5/0203 ,  H01L2224/29120130101

公开(公告)号：EP3935668B1

公开(公告)日：2024-07-10

申请号：EP20767064.7

申请日：2020-02-28

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/68 ,  H01L21/687 ,  H01L23/00

CPC classification number: H01L21/6836 ,  H01L2221/6836320130101 ,  H01L2221/6830920130101 ,  H01L21/67236 ,  H01L21/68778 ,  H01L2924/1204120130101 ,  H01L24/75 ,  H01L2224/759820130101 ,  H01L2224/7530520130101 ,  H01L2224/7590120130101 ,  H01L2224/9720130101 ,  H01L24/97 ,  H01L24/80 ,  H01L2224/0822520130101 ,  H01L2224/0823820130101 ,  H01L2224/8038520130101 ,  H01L24/08 ,  H01L2224/7570220130101 ,  H01L2224/7582420130101 ,  H01L2224/8000620130101 ,  H01L2224/7580220130101 ,  H01L2224/7580420130101 ,  H01L2221/6832220130101 ,  H01L21/67132 ,  H01L2224/8012120130101 ,  H01L21/67259 ,  H01L21/681

公开(公告)号：EP4411843A2

公开(公告)日：2024-08-07

申请号：EP24169398.5

申请日：2018-05-07

Applicant: The Regents of the University of California

Inventor： KAMIKAWA, Takeshi ,  GANDROTHULA, Srinivas ,  LI, Hongjian ,  COHEN, Daniel A.

IPC: H01L33/20

CPC classification number: H01L33/0075 ,  H01L33/20 ,  H01S5/0217 ,  H01S5/34333 ,  H01S2304/1220130101 ,  H01L33/0093 ,  H01L21/02389 ,  H01L21/0254 ,  H01L21/02647 ,  H01L21/02458 ,  H01L2224/3224520130101 ,  H01L2224/8319220130101 ,  H01L2224/8389520130101 ,  H01L2224/3222520130101 ,  H01L2224/8344420130101 ,  H01L2224/8320320130101 ,  H01L2224/0561120130101 ,  H01L2224/0564420130101 ,  H01L2924/1574720130101 ,  H01L2924/103320130101 ,  H01L2224/0402620130101 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/8380520130101 ,  H01L24/83 ,  H01L2224/8301320130101 ,  H01L2224/8302220130101 ,  H01L2224/2911120130101 ,  H01L2224/2914420130101 ,  H01L2224/8344720130101 ,  H01L2224/8044420130101 ,  H01L2224/8001320130101 ,  H01L2224/8020320130101 ,  H01L2224/8089520130101 ,  H01L24/80 ,  H01L2224/0824520130101 ,  H01L2224/0822520130101 ,  H01L24/08 ,  H01L2224/0420130101 ,  H01L2224/034520130101 ,  H01L24/03 ,  H01L2224/8000620130101 ,  H01L2224/8300520130101 ,  H01L2224/0823820130101 ,  H01L2224/0825820130101 ,  H01L2224/0555820130101 ,  H01L21/6835 ,  H01L24/06 ,  H01L2224/0618120130101 ,  H01L2924/1204220130101 ,  H01L2224/920220130101 ,  H01L2224/9420130101 ,  H01L24/94 ,  H01L24/92 ,  H01L2224/9214220130101 ,  H01L2224/921220130101 ,  H01L2221/6838120130101 ,  H01L2221/6831820130101 ,  H01L2221/683520130101 ,  H01L2221/6836320130101 ,  H01L2224/80420130101 ,  H01L2224/804920130101 ,  H01L2224/051820130101 ,  H01L2224/0514420130101 ,  H01L2224/0566920130101 ,  H01L2224/0518420130101 ,  H01L2224/0513920130101 ,  H01L2224/0566420130101 ,  H01L2224/0565520130101 ,  H01L2224/0563920130101 ,  H01L2224/0516420130101 ,  H01L2224/0516620130101 ,  H01L2224/0516920130101 ,  H01L2224/056820130101 ,  H01L2224/0568420130101 ,  H01L2224/0566620130101 ,  H01L2224/0515520130101 ,  H01S5/0203 ,  H01L2224/29120130101

Abstract: A method of removing a substrate, comprising: forming a growth restrict mask with a plurality of striped opening areas directly or indirectly upon a GaN-based substrate; and growing a plurality of semiconductor layers upon the GaN-based substrate using the growth restrict mask, such that the growth extends in a direction parallel to the striped opening areas of the growth restrict mask, and growth is stopped before the semiconductor layers coalesce, thereby resulting in island-like semiconductor layers. A device is processed for each of the island-like semiconductor layers. Etching is performed until at least a part of the growth restrict mask is exposed. The devices are then bonded to a support substrate. The GaN-based substrate is removed from the devices by a wet etching technique that at least partially dissolves the growth restrict mask. The GaN substrate that is removed then can be recycled.

公开(公告)号：EP3391409B1

公开(公告)日：2024-05-22

申请号：EP16876775.4

申请日：2016-12-16

IPC: H01L23/485 ,  H01L21/48 ,  H01L21/60 ,  H01L25/065

CPC classification number: H01L25/0657 ,  H01L2225/0655520130101 ,  H01L25/50 ,  H01L2225/0651320130101 ,  H01L2225/0659320130101 ,  H01L2224/0823820130101 ,  H01L2224/0823720130101 ,  H01L24/05 ,  H01L24/08 ,  H01L24/80 ,  H01L2224/0554120130101 ,  H01L2224/0555120130101 ,  H01L2224/0555220130101 ,  H01L2224/0557120130101 ,  H01L2224/0557320130101 ,  H01L2224/0557820130101 ,  H01L2224/05620130101 ,  H01L2224/0563920130101 ,  H01L2224/0564420130101 ,  H01L2224/0564720130101 ,  H01L2224/0565520130101 ,  H01L2224/0568420130101 ,  H01L2224/080720130101 ,  H01L2224/0814620130101 ,  H01L2224/8089520130101 ,  H01L2224/8089620130101 ,  H01L2224/0811120130101 ,  H01L2224/0812120130101 ,  H01L2224/0814820130101 ,  H01L2224/8003520130101 ,  H01L2224/8093520130101 ,  H01L2224/0420130101 ,  H01L2224/0566420130101 ,  H01L2224/8001320130101 ,  H01L2224/0512420130101 ,  H01L2224/0507320130101 ,  H01L2224/8001120130101 ,  H01L2224/0560920130101 ,  H01L2224/0561120130101 ,  H01L2224/8081520130101 ,  H01L2224/0568720130101 ,  H01L2224/0568820130101 ,  H01L2224/0341620130101 ,  H01L2224/03520130101 ,  H01L24/03 ,  H01L2224/0360220130101 ,  H01L2224/0361620130101 ,  H01L2224/0346420130101 ,  H01L2224/0361220130101 ,  H01L2224/0515520130101 ,  H01L2924/38120130101 ,  H01L2924/351220130101 ,  H01L2224/0566920130101 ,  H01L2224/0514420130101 ,  H01L2224/803420130101 ,  H01L2224/8098620130101 ,  H01L2224/0556920130101 ,  H01L2224/0814520130101