专利检索 cpc:"H01L2924/1204120130101" 第 1 页

1.

发明授权
Method for fabricating printable semiconductor elements 有权

公开(公告)号：EP2650906B1

公开(公告)日：2024-10-09

申请号：EP13003427.5

申请日：2005-06-02

IPC分类号： H01L21/308 , H01L21/208 , H01L21/326 , H01L21/4763 , H01L23/48 , H01L27/01 , H01L29/06 , H01L29/08 , H01L23/00 , H01L29/786 , H01L27/12 , H01L31/18 , H01L21/683

CPC分类号： B81C2201/018520130101 , B82Y10/00 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/1804 , H01L2924/1204120130101 , Y10S977/724 , Y10S977/707 , Y02E10/547 , H01L2224/8300520130101 , H01L2224/0361420130101 , H01L2224/8086220130101 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L21/6835 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L2221/6836820130101 , H01L2221/6838120130101 , H01L2224/033220130101 , H01L2224/034520130101 , H01L2224/036220130101 , H01L2224/0507320130101 , H01L2224/0508220130101 , H01L2224/0512420130101 , H01L2224/0514420130101 , H01L2224/0515520130101 , H01L2224/0516620130101 , H01L2224/0555220130101 , H01L2224/0555320130101 , H01L2224/0555420130101 , H01L2224/0555520130101 , H01L2224/0564420130101 , H01L2224/0566620130101 , H01L2224/0822520130101 , H01L2224/291920130101 , H01L2224/3222520130101 , H01L2224/8000620130101 , H01L2224/8012120130101 , H01L2224/8089520130101 , H01L2224/8312120130101 , H01L2224/8319220130101 , H01L2224/8319320130101 , H01L2224/838520130101 , H01L2224/8386220130101 , H01L2224/920220130101 , H01L2224/9420130101 , H01L2224/9720130101 , H01L2924/1025320130101 , H01L2924/1032920130101 , H01L2924/1515920130101 , H01L2924/1516220130101 , H01L2924/157920130101 , H01L27/1285 , H01L27/1292 , H01L2924/1309120130101 , H01L2924/130620130101 , H01L2924/146120130101 , H01L21/02628 , H01L2924/130520130101 , H01L2924/1203220130101 , H01L2924/1578820130101 , H01L31/03926 , H01L31/1864 , H01L31/1896 , H01L2924/1204220130101 , H01L2924/1204420130101 , H01L2924/1203620130101 , H01L2924/1204320130101 , H01L2224/9520130101 , H01L2924/1306320130101 , H01L2924/1420130101 , H01L2924/1305520130101 , H01L21/02603 , Y02P70/50

2.

发明授权
METHOD FOR MANUFACTURING METAL POWDER 有权转让

公开(公告)号：EP3134221B1

公开(公告)日：2024-05-22

申请号：EP15718258.5

申请日：2015-04-10

IPC分类号： B22F1/10 , B22F1/17 , B22F9/24 , C09C1/62 , B22F1/052 , B22F1/107 , H01L23/00

CPC分类号： C09C1/62 , C09C1/622 , C01P2004/2020130101 , C01P2004/3220130101 , C01P2004/5120130101 , C01P2004/6120130101 , C01P2006/1120130101 , C01P2006/1220130101 , C01P2006/8020130101 , H01L2224/838420130101 , H01L2224/294920130101 , H01L2224/27120130101 , H01L2224/293920130101 , H01L2224/1349920130101 , H01L2224/2943920130101 , H01L2224/111120130101 , H01L2224/133920130101 , H01L24/81 , H01L24/83 , H01L2224/113120130101 , H01L2224/1131220130101 , H01L2224/113220130101 , H01L2224/1150520130101 , H01L2224/1329420130101 , H01L2224/1333920130101 , H01L2224/1334420130101 , H01L2224/1334720130101 , H01L2224/1335520130101 , H01L2224/1614520130101 , H01L2224/1622720130101 , H01L2224/2731220130101 , H01L2224/273220130101 , H01L2224/2901120130101 , H01L2224/2933920130101 , H01L2224/2934420130101 , H01L2224/2934720130101 , H01L2224/2935520130101 , H01L2224/2938720130101 , H01L2224/2949920130101 , H01L2224/3214520130101 , H01L2224/3222720130101 , H01L2224/8119120130101 , H01L2224/8119220130101 , H01L2224/8120320130101 , H01L2224/812120130101 , H01L2224/818420130101 , H01L2224/8319120130101 , H01L2224/8319220130101 , H01L2224/8320320130101 , H01L2224/832120130101 , H01L2224/9420130101 , H01L2224/2743820130101 , H01L2224/11120130101 , H01L2224/1143820130101 , H01L2924/1204120130101 , H01L2224/2929420130101 , H01L2224/273120130101 , H01L2224/271120130101 , H01L2224/114420130101 , H01L2224/1338720130101 , H01L2224/1343920130101 , H01L2224/134920130101 , H01L2224/274420130101 , B22F9/24 , H01L24/27 , H01L24/29 , H01L2224/2750520130101 , B22F1/052 , B22F1/107 , B22F1/17 , B22F1/10

3.

发明公开
METHOD OF MANUFACTURING A PLURALITY OF LIGHT EMITTING DEVICES AND RESULTING LIGHT EMITTING DEVICE 审中-公开

公开(公告)号：EP4427906A2

公开(公告)日：2024-09-11

申请号：EP24184101.4

申请日：2009-08-27

申请人： Nichia Corporation

发明人： ICHIKAWA, Hirofumi , HAYASHI, Masaki , SASAOKA, Shimpei , MIKI, Tomohide

IPC分类号： B29C45/14

CPC分类号： B29C45/0055 , B29C45/14655 , B29C2793/00920130101 , H01L33/60 , H01L2224/4809120130101 , H01L2224/4824720130101 , H01L2933/003320130101 , H01L2933/006620130101 , H01L24/97 , H01L2924/302520130101 , H01L2924/1204120130101 , H01L2924/18120130101 , H01L2924/1203520130101 , H01L2924/1204220130101 , H01L2224/4825720130101 , H01L33/0095 , H01L33/641 , H01L33/486 , H01L33/62

摘要： Provided is a simple and low-cost method for manufacturing, in a short time, many light emitting devices wherein adhesiveness between a leadframe and a thermosetting resin composition is high. The method for manufacturing the light emitting device having a resin package (20) wherein the optical reflectivity at a wavelength of 350-800 nm after thermal curing is 70% or more and a resin section (25) and a lead (22) are formed on substantially a same surface on an outer surface (20b) has: a step of sandwiching a leadframe (21) provided with a notched section (21a) by an upper molding die (61) and a lower molding die (62); a step of transfer-molding a thermosetting resin (23) containing a light-reflecting substance (26), in a molding die (60) sandwiched by the upper molding die (61) and the lower molding die (62) and forming a resin-molded body (24) on the leadframe (21); and a step of cutting the resin-molded body (24) and the leadframe (21) along the notched section (21a).