公开(公告)号：EP2751852A1

公开(公告)日：2014-07-09

申请号：EP12766151.0

申请日：2012-07-30

Applicant: Koninklijke Philips N.V.

Inventor： BASIN, Grigoriy ,  EPLER, John Edward ,  MARTIN, Paul Scott

IPC: H01L33/00 ,  H01L33/22 ,  H01L33/50

CPC classification number: H01L33/48 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/22 ,  H01L33/50 ,  H01L33/501 ,  H01L33/505 ,  H01L33/507 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/27436 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/83005 ,  H01L2224/8309 ,  H01L2224/83097 ,  H01L2224/83191 ,  H01L2224/83209 ,  H01L2224/94 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2224/27 ,  H01L2224/83 ,  H01L2924/01074 ,  H01L2924/00

Abstract: A method according to embodiments of the invention includes positioning a flexible film (48) over a wafer of semiconductor light emitting devices, each semiconductor light emitting device including a semiconductor structure (13) including a light emitting layer sandwiched between an n-type region and a p-type region. The wafer of semiconductor light emitting devices is bonded to a substrate (50) via the flexible film (48). After bonding, the flexible film (48) is in direct contact with the semiconductor structures (13). The method further includes dividing the wafer after bonding the wafer to the substrate (50).

公开(公告)号：EP2053647A2

公开(公告)日：2009-04-29

申请号：EP08253453.8

申请日：2008-10-23

Applicant: Omron Corporation

Inventor： Yoshida, Kazutaka ,  Kawai, Wakahiro

IPC: H01L21/60 ,  H01L21/48

CPC classification number: H01L24/92 ,  H01L21/4857 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32238 ,  H01L2224/33 ,  H01L2224/73204 ,  H01L2224/81205 ,  H01L2224/81424 ,  H01L2224/8183 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2224/83906 ,  H01L2224/9211 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H05K1/09 ,  H05K3/305 ,  H05K3/328 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0285 ,  H05K2203/1189 ,  Y02P70/613 ,  H01L2924/20105 ,  H01L2924/20303 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: A method of producing a wiring board on which a semiconductor chip is to be mounted, includes: adhering an aluminum foil to one surface of a resin substrate; providing a heat-hardening resin layer having a predetermined shape on the aluminum foil; removing a part of the aluminum foil which is exposed from the heat-hardening resin layer to form a wiring circuit; and providing a thermoplastic resin layer on the wiring circuit. The heat-hardening resin layer has strength that enables the wiring board to prevent short between the semiconductor chip and the wiring circuit and has a crosslinking degree that is so reduced as to enable the bump to remove the heat-hardening resin layer to reach the wiring circuit, when the heat is applied to the wiring board and the bump to which the ultrasonic wave is applied is pressed to the wiring board.

Abstract translation: 制作布线板的方法在其上的半导体芯片要被安装，包括：坚持铝箔的树脂基板的一个表面上; 提供具有在铝箔上预定形状的热硬化树脂层; 去除铝箔的一部分的所有其从所述热硬化树脂层暴露于形成布线电路; 以及提供所述布线电路上的热塑性树脂层。 的热硬化树脂层具有强度没有启用布线板，以防止半导体芯片和所述布线电路之间短路和具有交联度没有被如此减少以使得凸块，以除去所述热硬化树脂层以到达所述布线 电路，当热施加到布线板与凸块的哪个施加超声波被挤压到电路板。

公开(公告)号：EP0982385B1

公开(公告)日：2004-01-28

申请号：EP98919557.3

申请日：1998-05-11

Applicant: FUJITSU LIMITED

Inventor： DATE, Hiroaki Fujitsu Limited 1-1, Kamikodanaka ,  MOTOYAMA, Yuko Fujitsu Limited ,  TOKUHIRA, Hidesi Fujitsu Limited ,  USUI, Makoto Fujitsu Limited ,  IMAIZUMI, Nobuhiro Fujitsu Limited

IPC: C09J163/00 ,  C09J4/02 ,  C09J5/04 ,  C09J5/06 ,  H01B1/20 ,  H01L21/52

CPC classification number: H01L24/28 ,  H01L21/563 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29373 ,  H01L2224/29386 ,  H01L2224/2949 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83097 ,  H01L2224/83099 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/303 ,  H05K3/386 ,  Y10T156/1011 ,  Y10T156/1018 ,  Y10T156/1026 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A two-part adhesive, characterized by being essentially composed of an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and being separated into agent (A) containing one or two components selected from among an acrylic monomer, a peroxide and a reducing agent and agent (B) containing the other components that have not been selected for agent (A). This adhesive can constantly give a highly reliable bonding which is free from heat stress and excellent in heat resistance.

公开(公告)号：EP0982385A1

公开(公告)日：2000-03-01

申请号：EP98919557.3

申请日：1998-05-11

Applicant: FUJITSU LIMITED

Inventor： DATE, Hiroaki Fujitsu Limited 1-1, Kamikodanaka ,  MOTOYAMA, Yuko Fujitsu Limited ,  TOKUHIRA, Hidesi Fujitsu Limited ,  USUI, Makoto Fujitsu Limited ,  IMAIZUMI, Nobuhiro Fujitsu Limited

IPC: C09J163/00 ,  C09J4/02 ,  C09J5/04 ,  C09J5/06 ,  H01B1/20 ,  H01L21/52

CPC classification number: H01L24/28 ,  H01L21/563 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29373 ,  H01L2224/29386 ,  H01L2224/2949 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83097 ,  H01L2224/83099 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/303 ,  H05K3/386 ,  Y10T156/1011 ,  Y10T156/1018 ,  Y10T156/1026 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present invention is characterized by comprising a two-pack adhesive of an A agent selected from components, an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and containing at least one or two of the acrylic monomer, the peroxide and the reducing agent, and a B agent containing all of the remaining components which are not selected in the A agent. The use of this adhesive makes it possible to stably obtain the bonding free from a thermal stress with the excellent heat resistance and the good reliability.

Abstract translation: 本发明的特征在于包括选自组分，丙烯酸类单体，过氧化物，还原剂，环氧树脂前体和固化剂的A试剂的双组分粘合剂，并且含有至少一种或两种丙烯酸类单体 ，过氧化物和还原剂，以及含有在A剂中未选择的所有剩余组分的B剂。 通过使用该粘合剂，能够以良好的耐热性和良好的可靠性稳定地获得不受热应力的结合。

公开(公告)号：EP2772328A1

公开(公告)日：2014-09-03

申请号：EP12843695.3

申请日：2012-10-09

Applicant: Bando Chemical Industries, Ltd.

Inventor： TAKESUE, Masafumi ,  YAMADA , Mitsuru, ,  SHIMOYAMA ,Kenji ,  WATANABE,Tomofumi

IPC: B22F1/02 ,  B22F1/00 ,  H05K1/14

CPC classification number: C09J9/02 ,  B22F1/0018 ,  B22F1/0022 ,  B22F1/0062 ,  B82Y30/00 ,  C08K3/08 ,  C08K9/04 ,  C09J11/04 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29369 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83075 ,  H01L2224/83092 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83444

Abstract: Provided is a composition for bonding, in particular, a composition for bonding which contains metal particles, said composition for bonding enabling the achievement of high bonding strength by bonding at a relatively low temperature and having such heat resistance that a decrease in the bonding strength does not easily occur due to decomposition, deterioration or the like of a resin component when service temperature is increased. This composition for bonding is characterized by containing inorganic particles and an organic material that contains an amine and/or a carboxylic acid and adheres to at least a part of the surface of each inorganic particle, and is also characterized in that the weight loss rate when heated from room temperature to 200°C is 33-69% and the weight loss rate when heated from 200°C to 300°C is 24-50% as determined by thermal analysis.

Abstract translation: 本发明提供了一种用于粘合的组合物，特别是用于粘合的组合物，其包含金属颗粒，所述用于粘合的组合物能够在相对低的温度下通过粘合获得高的结合强度，并且具有这样的耐热性，使得结合强度降低 当使用温度升高时，不容易因树脂成分的分解，劣化等而发生。 这种用于粘合的组合物的特征在于含有无机颗粒和含有胺和/或羧酸的有机材料并粘附到每个无机颗粒的至少一部分表面上，其特征还在于，当 从室温加热至200℃为33-69％，通过热分析测定，从200℃加热至300℃时的重量损失率为24-50％。

公开(公告)号：EP2053647A3

公开(公告)日：2012-08-01

申请号：EP08253453.8

申请日：2008-10-23

Applicant: Omron Corporation

Inventor： Yoshida, Kazutaka ,  Kawai, Wakahiro

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L24/92 ,  H01L21/4857 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32238 ,  H01L2224/33 ,  H01L2224/73204 ,  H01L2224/81205 ,  H01L2224/81424 ,  H01L2224/8183 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2224/83906 ,  H01L2224/9211 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H05K1/09 ,  H05K3/305 ,  H05K3/328 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0285 ,  H05K2203/1189 ,  Y02P70/613 ,  H01L2924/20105 ,  H01L2924/20303 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: A method of producing a wiring board on which a semiconductor chip is to be mounted, includes: adhering an aluminum foil to one surface of a resin substrate; providing a heat-hardening resin layer having a predetermined shape on the aluminum foil; removing a part of the aluminum foil which is exposed from the heat-hardening resin layer to form a wiring circuit; and providing a thermoplastic resin layer on the wiring circuit. The heat-hardening resin layer has strength that enables the wiring board to prevent short between the semiconductor chip and the wiring circuit and has a crosslinking degree that is so reduced as to enable the bump to remove the heat-hardening resin layer to reach the wiring circuit, when the heat is applied to the wiring board and the bump to which the ultrasonic wave is applied is pressed to the wiring board.

公开(公告)号：EP1865550A1

公开(公告)日：2007-12-12

申请号：EP06729267.2

申请日：2006-03-16

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： KARASHIMA, Seiji c/o Matsushita Industrial Co., Ltd. IP Development Center ,  KITAE, Takashi c/o Matsushita Industrial Co., Ltd. IP Development Center ,  NAKATANI, Seiichi c/o Matsushita Industrial Co., Ltd. IP Development Center

IPC: H01L21/60

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/83047 ,  H01L2224/83091 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2225/06513 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/30105 ,  H01L2924/381 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2203/087 ,  Y10T156/1744 ,  H01L2924/00011 ,  H01L2924/066 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a method for connecting substrates are provided. A circuit board 10 having a plurality of connecting terminals 11 and a semiconductor chip 20 having a plurality of electrode terminals 21 are disposed in mutually facing relation and a resin 13 containing conductive particles 12 and a gas bubble generating agent is supplied into the space therebetween. In this state, the resin 13 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the resin 13. The resin 13 is pushed toward the outside of the generated gas bubbles 30 by the growth thereof. The resin 13 pushed to the outside is self-assembled in the form of columns between the respective terminals of the circuit board 10 and the semiconductor chip 20. In this state, by pressing the semiconductor chip 20 against the circuit board 10, the conductive particles 12 contained in the resin 13 self-assembled between the facing terminals are brought into contact with each other to provide electrical connection between the terminals.

Abstract translation: 提供了可应用于下一代LSI的倒装芯片安装并且生产率和可靠性高的倒装芯片安装方法以及用于连接基板的方法。 具有多个连接端子11的电路板10和具有多个电极端子21的半导体芯片20以相互面对的关系设置，并且将含有导电粒子12和气泡生成剂的树脂13供给到它们之间的空间中。 在这种状态下，树脂13被加热，从包含在树脂13中的气泡产生剂产生气泡30.树脂13通过其生长被推向产生的气泡30的外部。 被推到外面的树脂13以电路板10的各个端子和半导体芯片20之间的列的形式自组装。在这种状态下，通过将半导体芯片20压靠在电路板10上，导电颗粒 包含在自组装在相对端子之间的树脂13中的12彼此接触以提供端子之间的电连接。

公开(公告)号：EP1865549A1

公开(公告)日：2007-12-12

申请号：EP06729266.4

申请日：2006-03-16

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： KARASHIMA, Seiji, c/o MATSUSHITA ELECTRIC INDUSTRIAL Co. Ltd ,  KITAE, Takashi, c/o MATSUSHITA ELECTRIC INDUSTRIAL Co. Ltd ,  NAKATANI, Seiichi, c/o MATSUSHITA ELECTRIC INDUSTRIAL Co. Ltd

IPC: H01L21/60 ,  H05K3/34

CPC classification number: H05K3/3484 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/742 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11001 ,  H01L2224/11005 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/16505 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/29347 ,  H01L2224/294 ,  H01L2224/29411 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83211 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/301 ,  H01L2924/30105 ,  H01L2924/381 ,  H05K3/323 ,  H05K2201/10977 ,  H05K2203/0425 ,  H05K2203/087 ,  H05K2203/1178 ,  Y10T156/1744 ,  H01L2924/00011 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a bump forming method are provided. After a resin 14 containing a solder powder 16 and a gas bubble generating agent is supplied to a space between a circuit board 21 having a plurality of connecting terminals 11 and a semiconductor chip 20 having a plurality of electrode terminals 12, the resin 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the resin 14. The resin 14 is pushed toward the outside of the generated gas bubbles 30 by the growth thereof and self-assembled between the connecting terminals 11 and the electrode terminals 12. By further heating the resin 14 and melting the solder powder 16 contained in the resin 14 self-assembled between the terminals, connectors 22 are formed between the terminals to complete a flip chip mounting body.

Abstract translation: 提供了适用于下一代LSI的倒装芯片安装以及高生产率和可靠性以及凸块形成方法的倒装芯片安装方法。 在将含有焊料粉末16和气泡发生剂的树脂14供给到具有多个连接端子11的电路板21和具有多个电极端子12的半导体芯片20之间的空间的同时，加热树脂14 从包含在树脂14中的气泡生成剂产生气泡30.树脂14通过其生长被推向产生的气泡30的外部，并且在连接端子11和电极端子12之间自组装。 通过进一步加热树脂14并熔化包含在端子之间自组装的树脂14中的焊料粉末16，在端子之间形成连接器22以完成倒装芯片安装体。

公开(公告)号：EP2772328A4

公开(公告)日：2015-08-05

申请号：EP12843695

申请日：2012-10-09

Applicant: BANDO CHEMICAL IND

Inventor： TAKESUE MASAFUMI ,  YAMADA MITSURU ,  SHIMOYAMA KENJI ,  WATANABE TOMOFUMI

IPC: B22F1/02 ,  B22F1/00 ,  H05K1/14

CPC classification number: C09J9/02 ,  B22F1/0018 ,  B22F1/0022 ,  B22F1/0062 ,  B82Y30/00 ,  C08K3/08 ,  C08K9/04 ,  C09J11/04 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29369 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83075 ,  H01L2224/83092 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83444

Abstract: Provided is a composition for bonding, in particular, a composition for bonding which contains metal particles, said composition for bonding enabling the achievement of high bonding strength by bonding at a relatively low temperature and having such heat resistance that a decrease in the bonding strength does not easily occur due to decomposition, deterioration or the like of a resin component when service temperature is increased. This composition for bonding is characterized by containing inorganic particles and an organic material that contains an amine and/or a carboxylic acid and adheres to at least a part of the surface of each inorganic particle, and is also characterized in that the weight loss rate when heated from room temperature to 200°C is 33-69% and the weight loss rate when heated from 200°C to 300°C is 24-50% as determined by thermal analysis.

公开(公告)号：EP2739428A1

公开(公告)日：2014-06-11

申请号：EP12780077.9

申请日：2012-07-26

Applicant: Hesse GmbH

Inventor： HESSE, Hans-Jürgen ,  BRÖKELMANN, Michael

IPC: B23K20/10 ,  B06B1/06

CPC classification number: B23K20/10 ,  B06B1/0607 ,  H01L2224/83097 ,  H01L2224/83099 ,  H01L2224/83206 ,  H01L2224/83207 ,  H01L2224/83208 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention relates to a method for ultrasonic bonding, wherein two longitudinal ultrasonic waves propagating in a common working plane oriented parallel to a substrate are induced in one or more ultrasonic transducers and are passed through ultrasound-conducting arms from different spatial directions onto a common connection point of the arms, and at the connection point cause an ultrasonic tool arranged directly or indirectly at said connection point to oscillate in two or three dimensions, wherein at least one ultrasonic transducer induces an ultrasonic wave with a first harmonic oscillation component and a second oscillation component.