公开(公告)号：EP1481424B1

公开(公告)日：2013-09-25

申请号：EP03742896.8

申请日：2003-02-21

Applicant: Legacy Electronics, Inc.

Inventor： KLEDZIK, Kenneth ,  ENGLE, Jason, C.

IPC: H01L25/065 ,  H01L25/10

CPC classification number: H05K1/141 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/0268 ,  H05K1/0298 ,  H05K1/144 ,  H05K1/182 ,  H05K1/183 ,  H05K3/3436 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09036 ,  H05K2201/09954 ,  H05K2201/10515 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/01005

公开(公告)号：EP1792529A2

公开(公告)日：2007-06-06

申请号：EP05790200.9

申请日：2005-08-24

Applicant: Cisco Technology, Inc.

Inventor： VASAVDA, Samir ,  EDWARDS, Williams F., Jr. ,  KORNPROBST, Michael ,  NELSON, David

IPC: H05K7/14 ,  H05K7/10

CPC classification number: G06F1/185 ,  G02B6/4246 ,  G02B6/4284 ,  G02B6/4292 ,  G06F1/184 ,  G06F1/186 ,  H01R12/716 ,  H01R12/724 ,  H01R2201/04 ,  H05K1/141 ,  H05K7/142 ,  H05K7/1428 ,  H05K2201/045 ,  H05K2201/10189 ,  H05K2201/10515 ,  H05K2203/1572

Abstract: A system for providing dual 10 GB uplinks in the front side of a single rack unit switch that stacks two MSA X2 I/O devices in a limited space. In one embodiment the two X2 I/O devices are mounted on opposite sides of a single circuit board positioned above the motherboard.

公开(公告)号：EP1481424A2

公开(公告)日：2004-12-01

申请号：EP03742896.8

申请日：2003-02-21

Applicant: Legacy Electronics, Inc.

Inventor： KLEDZIK, Kenneth ,  ENGLE, Jason, C.

IPC: H01L25/065 ,  H01L25/10

CPC classification number: H05K1/141 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/0268 ,  H05K1/0298 ,  H05K1/144 ,  H05K1/182 ,  H05K1/183 ,  H05K3/3436 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09036 ,  H05K2201/09954 ,  H05K2201/10515 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/01005

Abstract: An apparatus and method is disclosed that allows for the arranging in a three dimensional array semiconductor chips on a circuit board. A unique chip carrier is disclosed on which any IC chip can be positioned on above the other on a circuit board. Additionally, the carrier allows for the testing of IC chips on the carrier and underneath it without having to remote the carrier and chips from the system even if they are of the BGA or CSP type. The carrier includes exposed test points to allow an on site test.

公开(公告)号：EP2587471B1

公开(公告)日：2018-01-10

申请号：EP11797747.0

申请日：2011-04-11

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： NOBORI, Kazuhiro

IPC: G09F9/00 ,  G02F1/1345 ,  H01L21/60

CPC classification number: H05K7/00 ,  G02F1/13452 ,  H01L2924/0002 ,  H05K1/147 ,  H05K3/323 ,  H05K3/361 ,  H05K13/00 ,  H05K2201/045 ,  H05K2201/055 ,  H05K2201/09445 ,  Y10T29/49124 ,  H01L2924/00

Abstract: In a display device (100), a row of protruding electrodes (115) and a row of protruding electrodes (116) are formed on the connecting surface of a terminal section (112), the row of the protruding electrodes (116) is disposed between the row of the protruding electrodes (115) and a display section (111), one end of a flexible printed board (150) is connected to the row of the protruding electrodes (115), one end of a flexible printed board (160) is connected to the row of the protruding electrodes (116), the row of the protruding electrodes (115) is adjacent to the row of the protruding electrodes (116), and the one end of the flexible printed board (150) and the one end of the flexible printed board (160) are opposed to each other.

公开(公告)号：EP1998603A4

公开(公告)日：2011-03-09

申请号：EP07713764

申请日：2007-02-01

Applicant: IBIDEN CO LTD

Inventor： YOKOMAKU TOSHIHIKO

IPC: H05K3/34 ,  H05K3/46

CPC classification number: H05K3/3463 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16251 ,  H05K1/0262 ,  H05K1/141 ,  H05K3/341 ,  H05K3/3415 ,  H05K3/3457 ,  H05K3/4602 ,  H05K2201/045 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10674 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2224/05599

公开(公告)号：EP1965615A4

公开(公告)日：2009-11-11

申请号：EP06811275

申请日：2006-10-05

Applicant: MURATA MANUFACTURING CO

Inventor： NOMURA MASATO ,  IEKI TSUTOMU

IPC: H05K1/14 ,  H05K3/46 ,  H05K9/00

CPC classification number: H05K1/141 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K1/144 ,  H05K1/181 ,  H05K1/183 ,  H05K3/20 ,  H05K3/284 ,  H05K3/3442 ,  H05K2201/045

Abstract: [Object] To provide a component-containing module capable of reducing cost and improving yield. [Solving Means] A component-containing module A includes a module substrate 1 having first wiring lines 2 formed on the top surface of the module substrate; a first circuit component 7 mounted on the first wiring lines of the module substrate; a submodule substrate 10 having an area smaller than the area of the module substrate and mounted on the first wiring lines of the module substrate at a position where the first circuit component is not mounted; a second circuit component 15 mounted on second wiring lines 11 formed on the top surface of the submodule substrate; and an insulating resin layer 20 formed on the entire top surface of the module substrate so as to encompass the first circuit component, the second circuit component, and the submodule substrate. Application of a substrate having a wiring accuracy higher than that of the module substrate 1 to the submodule substrate 10 allows an integrated-circuit element 15a to be mounted on the submodule substrate, and realizes a highly reliable and low-cost component-containing module.

公开(公告)号：EP1804248B1

公开(公告)日：2009-03-04

申请号：EP06256534.6

申请日：2006-12-22

Applicant: Funai Electric Co., Ltd.

Inventor： Sugamura, Tomokazu, c/o Funai Electric Co., Ltd. ,  Ogawa, Masuo c/o Funai Electric Co., Ltd.

IPC: G11B31/00 ,  H04N5/76 ,  G06F1/18 ,  G11B33/10

CPC classification number: H04N5/64 ,  B82Y20/00 ,  G11B31/00 ,  G11B33/10 ,  G11B33/12 ,  H04N21/42646 ,  H05K1/14 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0052 ,  H05K3/366 ,  H05K2201/045 ,  H05K2201/048

公开(公告)号：EP1804248A3

公开(公告)日：2007-12-05

申请号：EP06256534.6

申请日：2006-12-22

Applicant: Funai Electric Co., Ltd.

Inventor： Sugamura, Tomokazu, c/o Funai Electric Co., Ltd. ,  Ogawa, Masuo c/o Funai Electric Co., Ltd.

IPC: G11B31/00 ,  H04N5/76 ,  G06F1/18 ,  G11B33/10

CPC classification number: H04N5/64 ,  B82Y20/00 ,  G11B31/00 ,  G11B33/10 ,  G11B33/12 ,  H04N21/42646 ,  H05K1/14 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0052 ,  H05K3/366 ,  H05K2201/045 ,  H05K2201/048

Abstract: A disk unit-integrated display capable of increase in conveyance efficiency and reduce in conveyance cost of a disk unit, a holding member and a first circuit board unitized with each other can be obtained. This disk unit-integrated display (1) includes the disk unit (7) having a drive portion (73), the holding member (5) for supporting the disk unit (7), the first circuit board (6) arranged between the disk unit (7) and the holding member (5) and having an opening (6a) at a position corresponding to the drive portion (73) of the disk unit (7).

公开(公告)号：EP0642166A2

公开(公告)日：1995-03-08

申请号：EP94113641.8

申请日：1994-08-31

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Kalivas, Vassilios ,  Nitsch, Alois ,  Peters, Heinz

IPC: H01L25/16 ,  H05K1/18

CPC classification number: H01L25/165 ,  H01L23/24 ,  H01L23/3121 ,  H01L24/48 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/0317 ,  H05K2201/045 ,  H05K2201/10287 ,  H05K2201/10734 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: Das Keramik-Substrat (13) ist auf einer ersten Seite einer zum Modul gehörenden, Schaltungsstrukturen aufweisenden Leiterplatte (12) mittels eines flexiblen Klebers (2) befestigt und mittels Bondverbindungen (11) an die Schaltungsstrukturen kontaktiert, und die Anschlußelemente sind durch auf der Rückseite der Leiterplatte (12) angebrachte, annähernd kugelförmige Lotballungen (10) gebildet, die über Durchkontaktierungen mit den Schaltungsstrukturen auf der ersten Seite der Leiterplatte (12) verbunden sind.

Abstract translation: 陶瓷基板（13）通过柔性粘合剂（2）固定在印刷电路板（12）的第一面上，属于该模块并具有电路结构，并通过粘合与电路结构接触 连接件（11），并且端子元件由施加到印刷电路板（12）的后侧上的近似球形的焊球（10）形成，这些球通过电镀通孔（通孔）连接到电路 在印刷电路板（12）的第一侧上的结构。

公开(公告)号：EP3007343A1

公开(公告)日：2016-04-13

申请号：EP15186377.6

申请日：2015-09-23

Applicant: International Rectifier Corporation

Inventor： Cho, Eung San ,  Ribarich, Thomas J. ,  Fernando, Dean ,  Park, Dae Keun ,  Cheah, Chuan ,  Moody, Kevin

IPC: H02M3/145 ,  H05K1/14 ,  H01L23/48

CPC classification number: H05K7/1092 ,  H01L23/49531 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/40137 ,  H01L2224/40225 ,  H01L2224/40245 ,  H01L2224/41113 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10254 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/1032 ,  H01L2924/13091 ,  H01L2924/181 ,  H01R12/7076 ,  H02M3/145 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/045 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/37099

Abstract: In one implementation, a power unit for plugging into a mother board includes a power module situated on a substrate. The substrate is situated on conductive slats, each having an extended end away from the power module. Each of the conductive slats provides a mounting contact of the power unit. Each mounting contact is electrically coupled to the power module by electrical routing in the substrate. The mounting contacts are configured to provide electrical connection between the power module and the mother board.

Abstract translation: 在一个实施方式中，用于插入母板的功率单元包括位于基板上的功率模块。 基板位于导电板条上，每个导电板条具有远离电源模块的延伸端。 每个导电板条提供动力单元的安装接触。 每个安装触头通过在衬底中的电路径电耦合到功率模块。 安装触头被配置为在电源模块和母板之间提供电连接。