Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, method for manufacturing electronic device, electronic device, and compound
    95.
    发明专利
    Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, method for manufacturing electronic device, electronic device, and compound 有权
    图案形成方法,抗紫外线敏感性或辐射敏感性树脂组合物,电阻膜,制造电子器件的方法,电子器件和化合物

    公开(公告)号:JP2014194534A

    公开(公告)日:2014-10-09

    申请号:JP2014030830

    申请日:2014-02-20

    摘要: PROBLEM TO BE SOLVED: To provide a pattern forming method, a photosensitive or radiation-sensitive resin composition, a resist film and a compound, a method for manufacturing an electronic device, and an electronic device, which exhibit high roughness performance and defocusing performance in the formation of an ultrafine pattern (particularly a trench pattern or a hole pattern in a size of 50 nm or less), and excellent resolution and exposure latitude.SOLUTION: The pattern forming method includes steps of (1) forming a film comprising the following photosensitive or radiation-sensitive resin composition, (2) exposing the film, and (3) developing the film with an organic solvent-containing developer to form a negative pattern. The photosensitive or radiation-sensitive resin composition comprises a compound (A) expressed by general formula (I-1), a compound (B) which is different from the compound (A) and generates an acid by irradiation with actinic rays or radiation, and a resin (P) which does not react with an acid generated from the compound (A) but shows decrease in the solubility with an organic solvent-containing developer by an action of an acid from the compound (B). Also disclosed are the photosensitive or radiation-sensitive resin composition, a resist film, the compound (A), a method for manufacturing an electronic device, and an electronic device.

    摘要翻译: 要解决的问题:为了提供图案形成方法,感光性或辐射敏感性树脂组合物,抗蚀剂膜和化合物,电子器件的制造方法和电子器件,其具有高的粗糙度性能和散焦性能 超细图案(特别是50nm以下的沟槽图案或孔图案)的形成,以及优异的分辨率和曝光宽容度。图案形成方法包括以下步骤:(1)形成包含以下 感光或辐射敏感性树脂组合物,(2)曝光该膜,和(3)用含有机溶剂的显影剂显影该膜以形成负型图案。 光敏或辐射敏感性树脂组合物包含由通式(I-1)表示的化合物(A),与化合物(A)不同的化合物(B)),并通过用光化射线或辐射照射产生酸, 和不与化合物(A)产生的酸反应的树脂(P),但是通过化合物(B)的酸作用,与含有机溶剂的显影剂的溶解度降低。 还公开了光敏或辐射敏感性树脂组合物,抗蚀剂膜,化合物(A),电子器件的制造方法和电子器件。