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    Chip part mounting body, and semiconductor device
    11.
    发明专利
    Chip part mounting body, and semiconductor device 审中-公开
    芯片部分安装体和半导体器件

    公开(公告)号：JP2005353731A

    公开(公告)日：2005-12-22

    申请号：JP2004171049

    申请日：2004-06-09

    Applicant: Nec Compound Semiconductor Devices Ltd ,  Nec化合物デバイス株式会社

    Inventor： NAKAZAWA HIROMI

    IPC: H01L21/60 ,  H01L23/48 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32

    CPC classification number: H05K1/111 ,  H01L2924/0002 ,  H05K3/321 ,  H05K2201/09745 ,  H05K2201/10484 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a chip part mounting body wherein the occurrence of short circuits is suppressed between a neighboring pad and chip when the amount of the conductive adhesive is increased and the area of contact of the conductive adhesive with the chip is enlarged, and to provide a semiconductor device.
    SOLUTION: In this chip mounting body, a chip 2 is mounted on a printed circuit board 1 with a conductive adhesive 3 in-between. The chip 2 has a corner 2b, and the ridgeline of the corner 2b is arranged to face the pad 1a of the printed circuit board 1. The chip 2 is mounted on the pad 1a so that acute angles α are formed between the faces of the chip 2 neighboring the ridgeline of the corner 2b and the surface of the pad 1a.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种芯片部件安装体，其中当导电粘合剂的量增加并且导电粘合剂与芯片的接触面积在相邻的焊盘和芯片之间抑制短路的发生时 并且提供半导体器件。 解决方案：在该芯片安装体中，芯片2安装在印刷电路板1上，导电粘合剂3在其间。 芯片2具有角部2b，并且角部2b的棱线布置成面对印刷电路板1的焊盘1a。芯片2安装在焊盘1a上，使得锐角α形成在 芯片2与拐角2b的脊线和垫1a的表面相邻。 版权所有（C）2006，JPO＆NCIPI

    Current-switching circuit device and circuit device for electric power steering
    12.
    发明专利
    Current-switching circuit device and circuit device for electric power steering 审中-公开
    电流转换器的电流切换电路和电路装置

    公开(公告)号：JP2003309384A

    公开(公告)日：2003-10-31

    申请号：JP2002115252

    申请日：2002-04-17

    Applicant: Denso Corp ,  株式会社デンソー

    Inventor： KAWADA HIROYUKI

    IPC: B62D5/04 ,  H05K1/02 ,  H05K1/18 ,  H05K7/14 ,  H05K7/20

    CPC classification number: H05K1/0203 ,  B62D5/0406 ,  H05K7/1432 ,  H05K2201/10166 ,  H05K2201/10484 ,  H05K2201/1056

    Abstract: PROBLEM TO BE SOLVED: To provide a current-switching circuit device and a circuit device for electric power steering with little heat generation, and small wiring impedances at a lead part of a switching element. SOLUTION: This circuit device is provided with a printed board 61 mounting various circuit elements; and a housing 81 as a heat sink, having a switching element mounting part 82 formed an inclined surface 82a with the distance with the printed board 61 being gradually extended. Switching transistors 31 to 34 are arranged on the inclined surface 82a of the mounting part 82, while arranging leads 31b to 34b toward the side close to the printed board 61. Main bodies 31a to 34a are fixed on the inclined surface 82a in an almost close contact state. The leads 31b to 34b are connected directly and electrically to the printed board 61. COPYRIGHT: (C)2004,JPO

    Abstract translation: 要解决的问题：提供一种用于电力转向的电流切换电路装置和电路装置，其中几乎没有发热，并且在开关元件的引线部分具有小的布线阻抗。 解决方案：该电路装置设置有安装各种电路元件的印刷电路板61; 和作为散热器的壳体81，具有形成有与印刷电路板61的距离逐渐延伸的倾斜面82a的开关元件安装部82。 开关晶体管31至34布置在安装部分82的倾斜表面82a上，同时将引线31b至34b朝向靠近印刷电路板61的一侧排列。主体31a至34a以几乎接近的方式固定在倾斜表面82a上 接触状态 引线31b至34b直接和电连接到印刷电路板61.版权所有（C）2004，JPO

    照明装置
    19.
    发明专利
    照明装置 有权

    公开(公告)号：JPWO2006123421A1

    公开(公告)日：2008-12-25

    申请号：JP2007516175

    申请日：2005-05-20

    Applicant: 株式会社メガトレード

    Inventor： 昌年 笹井 ,  昌年 笹井

    IPC: G01N21/84 ,  F21S2/00 ,  F21S8/04 ,  F21Y101/02 ,  G01N21/956 ,  H01L31/12

    CPC classification number: G01N21/8806 ,  F21K9/00 ,  F21V19/0055 ,  F21Y2115/10 ,  H05K1/18 ,  H05K3/301 ,  H05K2201/10106 ,  H05K2201/10424 ,  H05K2201/10484 ,  H05K2201/10522

    Abstract: ブラケットの内径寸法を小さくした場合であっても、効率よくその中心部分に集光することができ、しかも、細かな作業を要することなく、効率的に照明基板を取り付けることができるような照明装置を提供する。このために、検査対象物7に対して複数の方向から光を照射する照明装置100に、複数のLED11を保持する照明基板1と、この照明基板1を保持するための半円筒状のブラケット3とを備え、当該ブラケット3の半円筒状の外側側面に前記LED11を収納するための貫通孔30を設ける。この貫通孔30は、LED11の発光部をほぼ密着させるような大きさに設定され、この貫通孔30にLED11を収納した状態で照明基板1をブラケット3に押し付ける。そして、LED11の脚端子を屈曲させてLED11の光軸をブラケット3の中心方向に向ける。

    Mounting structure of sfp module
    20.
    发明专利
    Mounting structure of sfp module 有权
    SFP模块的安装结构

    公开(公告)号：JP2006269348A

    公开(公告)日：2006-10-05

    申请号：JP2005088825

    申请日：2005-03-25

    Applicant: Fujitsu Ltd ,  富士通株式会社

    Inventor： INOUE TAKASHI ,  TAKAWA HIROSHI ,  TEJIMA YASUHIRO ,  IZUHARA NOBORU

    IPC: H01R13/516

    CPC classification number: H05K3/301 ,  H01R12/7047 ,  H01R12/716 ,  H01R12/83 ,  H01R43/205 ,  H05K9/0058 ,  H05K2201/10189 ,  H05K2201/10484 ,  H05K2201/10606

    Abstract: PROBLEM TO BE SOLVED: To provide a simple structure for a holder 3 and to reduce the unmountable area of other components, in a mounting structure of an SFP module 4 made so as to keep the SFP module 4 connected to a connector 2 mounted on a PT board 1 with the holder 3. SOLUTION: The holder 3 includes both side surfaces 3a supporting the SFP module 4 on both sides, turn-back parts 3b provided to the upper edge of each side surface 3a, enabling the SFP module 4 to be inserted and pulled off in an oblique direction and preventing the SFP module 4 from coming off upwardly, and a bottom surface 3c fixing the both side surfaces 3a on the PT board 1. The connector 2 is equipped with an electrode, having return elastic force capable of keeping the SFP module 4 inserted into the holder 3 from an oblique upward direction and turning the SFP module 4 up to a state that is parallel with the PT board 1. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：为了在保持SFP模块4连接到连接器2的SFP模块4的安装结构中提供用于保持器3的简单结构并且减小其他部件的不可装卸区域 安装在具有保持器3的PT板1上。解决方案：保持器3包括两侧支撑SFP模块4的两个侧表面3a，设置在每个侧表面3a的上边缘的折返部3b，使得能够 SFP模块4沿倾斜方向插入和拉出，并防止SFP模块4向上脱落;以及底面3c将两个侧表面3a固定在PT板1上。连接器2装备有电极 具有能够将SFP模块4从倾斜向上方向插入保持器3的返回弹力，并将SFP模块4转动到与PT板1平行的状态。版权所有（C）2007 ，JPO＆INPIT

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