公开(公告)号：JP2013213864A

公开(公告)日：2013-10-17

申请号：JP2012082945

申请日：2012-03-30

Applicant: Dainippon Printing Co Ltd ,  大日本印刷株式会社 ,  Dnp Fine Chemicals Co Ltd ,  株式会社Dnpファインケミカル

Inventor： NASU SHINTARO ,  SHIODA SATOSHI ,  TAKEICHI HIROSHI

IPC: G03F7/075 ,  C08F290/06 ,  G03F7/004 ,  G03F7/027

CPC classification number: G06F3/041 ,  C08F230/08 ,  C08F283/12 ,  C08K5/34924 ,  G03F7/027 ,  G03F7/038 ,  G03F7/0757 ,  H05K1/0274 ,  H05K1/0326 ,  H05K1/0346 ,  H05K3/287 ,  H05K2201/0108 ,  H05K2201/0162 ,  C08L83/04

Abstract: PROBLEM TO BE SOLVED: To provide a resin composition which is capable of forming a resin film that has excellent hardness and heat resistance.SOLUTION: The present invention provides a resin composition which is characterized by containing a developable polysiloxane that has a developable group but does not substantially contain a radically polymerizable group, a polymerizable polysiloxane that has a radically polymerizable group but does not substantially contain a developable group, and a polyfunctional monomer.

Abstract translation: 要解决的问题：提供一种能够形成具有优异的硬度和耐热性的树脂膜的树脂组合物。本发明提供一种树脂组合物，其特征在于含有可显影组的可显影聚硅氧烷，但是 基本上不含有自由基聚合性基团，具有自由基聚合性基团但基本上不含显影性基团的聚合性聚硅氧烷，以及多官能单体。

公开(公告)号：JP2013062249A

公开(公告)日：2013-04-04

申请号：JP2012222864

申请日：2012-10-05

Applicant: Saint-Gobain Glass France ,  サン−ゴバン グラス フランス

Inventor： HAHN DIETER ,  JOSEF SWITALLA ,  RAINER KUMMUTAT ,  ANDRE BERULE ,  YANNICK LEBAIL

IPC: H01B13/00 ,  H01B5/14 ,  H05B3/84 ,  H05K1/09

CPC classification number: H05K1/092 ,  H01B1/16 ,  H01B1/22 ,  H05B3/84 ,  H05B2203/002 ,  H05B2203/017 ,  H05K1/0306 ,  H05K3/1216 ,  H05K2201/0108 ,  Y10T29/49155

Abstract: PROBLEM TO BE SOLVED: To provide a method of forming electrically conductive tracks on a transparent substrate, by screen printing with a conductive paste, and also provide the transparent substrate provided with the tracks.SOLUTION: Track conductors with a length less than or equal to 0.3 mm are formed by applying, with screen printing, a thixotropic conductive paste whose ratio of the viscosity without shear stress to the viscosity under shear stress under screen-printing conditions is at least 50, whose silver content is greater than 35% and whose at least 98% of constituent particles have a size smaller than 25 μm, by means of a screen having at least 90 threads per cm, the coating of the screen being provided with slots the narrowest width of which is equal to 0.25±0.05 mm, and by subjecting the tracks to baking.

Abstract translation: 要解决的问题：提供一种在透明基板上形成导电轨迹的方法，通过使用导电浆的丝网印刷，并且还提供设置有轨道的透明基板。 解决方案：使用丝网印刷法，在丝网印刷条件下，将不具有剪切应力的粘度与剪切应力下的粘度之比应用于触变导电膏，形成长度小于或等于0.3mm的轨道导体 至少50，其银含量大于35％，并且其至少98％的构成颗粒具有小于25μm的尺寸，通过具有至少90个螺纹/ cm的筛网，筛网的涂层被提供 槽的最窄宽度等于0.25±0.05mm，并且通过对轨道进行烘烤。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP5175779B2

公开(公告)日：2013-04-03

申请号：JP2009068353

申请日：2009-03-19

Applicant: 日東電工株式会社

Inventor： 敬史 竹村

IPC: H05K3/28 ,  H05K3/00 ,  H05K3/18

CPC classification number: H05K3/108 ,  H05K1/056 ,  H05K3/007 ,  H05K3/0082 ,  H05K3/28 ,  H05K3/44 ,  H05K2201/0108 ,  H05K2201/0919 ,  H05K2203/0156 ,  H05K2203/0597

公开(公告)号：JP5009907B2

公开(公告)日：2012-08-29

申请号：JP2008515964

申请日：2006-06-09

Applicant: シーマ ナノ テック イスラエル リミティド

Inventor： ガーバー，アーカディー ,  ラ ベガ，フェルナンド デ ,  ブロッド，ジョン ,  ロットマン，クラウディオ

IPC: H01B13/00 ,  B32B15/04 ,  H01B5/14

CPC classification number: C25D5/022 ,  B22F2998/00 ,  B22F2998/10 ,  C08K3/08 ,  C09D5/24 ,  C09D7/61 ,  C09D7/67 ,  C09D11/52 ,  C23C24/106 ,  C23C28/023 ,  C25D3/12 ,  C25D3/38 ,  C25D5/00 ,  C25D7/00 ,  H01B1/22 ,  H05K1/097 ,  H05K3/246 ,  H05K2201/0108 ,  H05K2203/1581 ,  B22F1/0018 ,  B22F1/0059 ,  B22F3/22

Abstract: Transparent conductive coated devices (films, three dimensional objects and others) produced through coating with a nano metal containing emulsion which forms a conductive pattern with enhanced electrical, optical and other properties.

公开(公告)号：JP4988698B2

公开(公告)日：2012-08-01

申请号：JP2008500815

申请日：2006-03-06

Applicant: スリーエム イノベイティブ プロパティズ カンパニー

Inventor： ウェッツェルズ，セルジュ ,  エイチ． カールソン，ダニエル ,  エフ． キング，グレゴリー ,  ダブリュ． キング，ビンセント ,  ティー． ストランド，ジョン ,  ブイ． ダウワー，ウィリアム ,  エヌ． ドブス，ジェイムズ ,  エス． フイツィンガ，ジョン

IPC: B29C59/04

CPC classification number: B29C35/0894 ,  B29C35/0888 ,  B29C35/10 ,  B29C59/046 ,  B29C2035/0827 ,  B29C2043/463 ,  H05K1/0393 ,  H05K3/0008 ,  H05K3/0079 ,  H05K3/101 ,  H05K2201/0108 ,  H05K2203/0113 ,  H05K2203/0143 ,  H05K2203/1545 ,  H05K2203/1572

公开(公告)号：JP2011258551A

公开(公告)日：2011-12-22

申请号：JP2011117192

申请日：2011-05-25

Applicant: Fraunhofer Ges Zur Foerderung Der Angewandten Forschung Ev ,  フラウンホーファー・ゲゼルシャフト・ツール・フェルデルング・デア・アンゲヴァンテン・フォルシュング・エー・ファウ

Inventor： JAN HESSE ,  CHRISTIAN KIRCHHOF ,  UDO BECHTOLF ,  KAI SCHMIEDEL

IPC: H05B33/04 ,  H01L51/50

CPC classification number: H01L51/5203 ,  H01L51/5243 ,  H01L2251/5361 ,  H05K1/112 ,  H05K3/321 ,  H05K2201/0108 ,  H05K2201/09072 ,  H05K2201/09363 ,  H05K2201/10106

Abstract: PROBLEM TO BE SOLVED: To realize improved sealing not to cause a non-light-emitting gap between elements and to prevent intrusion of moisture and oxygen.SOLUTION: At least one organic light-emitting diode 102 and an optical transparent substrate 301 are connected to a circuit board 101. An electrical contact part for connection to an electrode of the organic light-emitting diode is on a surface of the circuit board. On the surface of circuit board facing the organic light-emitting diode, a metal coating 104 as a permeation barrier is provided over its whole region. The metal coating is interrupted by an electrical insulator formed on a periphery of the contact part.

Abstract translation: 要解决的问题：为了实现改进的密封，不会在元件之间产生不发光的间隙，并且防止水分和氧气的侵入。 解决方案：至少一个有机发光二极管102和光学透明基板301连接到电路板101.用于连接到有机发光二极管的电极的电接触部分在 电路板。 在面向有机发光二极管的电路板的表面上，在其整个区域上设置有作为渗透屏障的金属涂层104。 金属涂层被形成在接触部件的周边上的电绝缘体中断。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2011119759A

公开(公告)日：2011-06-16

申请号：JP2011032341

申请日：2011-02-17

Applicant: Ube Industries Ltd ,  宇部興産株式会社

Inventor： NARUI KOJI ,  YAMAMOTO NORIYUKI ,  ABU TOSHIHIKO

IPC: H05K1/03 ,  B29C65/20 ,  B32B15/08 ,  H05K3/00 ,  H05K3/02 ,  H05K3/38

CPC classification number: B32B15/08 ,  H05K1/0346 ,  H05K3/022 ,  H05K3/389 ,  H05K2201/0108 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0355 ,  Y10T428/12438 ,  Y10T428/24355 ,  Y10T428/31667 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: PROBLEM TO BE SOLVED: To provide a copper-clad laminate preferable as an all-polyimide substrate material, which solves problems of low bonding strength and low transparency of a remaining polyimide film after etching-removal of a copper foil, the problems having been impossible to solve in a conventionally well-known copper-clad laminate for a substrate. SOLUTION: The copper-clad laminate includes a low roughness copper foil and a polyimide film laminated thereon, in which the film, after etching the copper foil, has light transmittance of 40% or higher at a wavelength of 600 nm and a haze of 30% or lower, and bonding strength therebetween is 500 N/m or higher. An alternative copper-clad laminate includes a copper layer and a polyimide film laminated thereon, in which the film, after etching the copper layer, has light transmittance of 40% or higher at a wavelength of 600 nm and a haze of 30% or lower, bonding strength therebetween is 500 N/m or higher and the bonding strength after heat-treatment for 1,000 hours at 150°C is 285 N/m or higher. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：为了提供优选作为全聚酰亚胺基板材料的覆铜层压板，其解决了在蚀刻去除铜箔之后残留的聚酰亚胺膜的低接合强度和低透明度的问题， 在用于基板的常规公知的覆铜层压板中已经不可能解决。 覆铜层压板包括低粗糙度铜箔和层叠在其上的聚酰亚胺膜，其中在蚀刻铜箔之后，膜在600nm的波长下的透光率为40％以上， 雾度为30％以下，粘接强度为500N / m以上。 替代的覆铜层压板包括铜层和层压在其上的聚酰亚胺膜，其中在蚀刻铜层之后，膜在600nm的波长和30％或更低的雾度下具有40％或更高的透光率 其结合强度为500N / m以上，150℃下热处理1000小时的接合强度为285N / m以上。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP4692544B2

公开(公告)日：2011-06-01

申请号：JP2007526852

申请日：2006-04-14

Applicant: パナソニック株式会社

Inventor： 法人 塚原 ,  秀規 宮川 ,  和宏 西川 ,  茂昭 酒谷

IPC: H01L21/60 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  H05K3/32

CPC classification number: H01L24/29 ,  C09J9/02 ,  H01L21/6835 ,  H01L24/83 ,  H01L24/95 ,  H01L2221/68354 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83859 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/323 ,  H05K2201/0108 ,  H05K2201/0281 ,  H05K2201/0373 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/1476 ,  Y02P70/611 ,  Y10T29/49147 ,  Y10T428/24372 ,  Y10T428/254 ,  H01L2924/00

公开(公告)号：JP2011001559A

公开(公告)日：2011-01-06

申请号：JP2010210626

申请日：2010-09-21

Applicant: Hitachi Ltd ,  Kyoto Univ ,  Mitsubishi Chemicals Corp ,  Nippon Telegr & Teleph Corp ,  Pioneer Electronic Corp ,  Rohm Co Ltd ,  パイオニア株式会社 ,  ローム株式会社 ,  三菱化学株式会社 ,  国立大学法人京都大学 ,  日本電信電話株式会社 ,  株式会社日立製作所

Inventor： YANO HIROYUKI ,  SUGIYAMA JUNJI ,  ATAGI MASAYA ,  IWAMOTO SHINICHIRO ,  KURIHARA TAKASHI ,  MATSUURA TORU ,  HANDA KEISHIN ,  NAGAI AKIRA ,  MIWA TAKAO ,  TAKEZAWA YOSHITAKA

IPC: C08J5/04 ,  C08J5/00 ,  C08K7/02 ,  C08L101/00 ,  G02B6/10 ,  G02B6/12 ,  G02B6/122 ,  G02B6/42 ,  H05K1/03

CPC classification number: G02B6/122 ,  B82Y30/00 ,  C08J5/005 ,  C08J5/04 ,  C08L101/00 ,  G02B6/10 ,  G02B6/4214 ,  G02B2006/12104 ,  G02B2006/12107 ,  H05K1/0366 ,  H05K2201/0108 ,  H05K2201/0251 ,  Y10T428/249924 ,  Y10T428/249928 ,  Y10T428/24994 ,  Y10T428/2965 ,  Y10T428/31518 ,  Y10T428/31525 ,  C08L2666/26

Abstract: PROBLEM TO BE SOLVED: To provide a fiber-reinforced composite material in which high transparency is always maintained without being affected by temperature conditions, wavelengths, and the like, and various types of functionality are imparted by forming a composite between fibers and a matrix material.SOLUTION: There is provided a fiber-reinforced composite material containing fibers having an average fiber diameter of 4 to 200 nm and a matrix material, and having a visible light transmittance of 60% or more at a wavelength of 400 to 700 nm, which is a conversion value based on a thickness of 50 μm. Since fibers having an average fiber diameter of shorter than the wavelength of visible light (380-800 nm) are used, the refraction of visible light by the fibers is hard to occur, and even if a temperature change and a wavelength variation occur, the scattering loss of visible light at the interface of fibers and the matrix material is hard to be generated. Therefore, a high transparency of a visible light transmittance of 60% or more in terms of 50 μm thickness can be held with stability.

Abstract translation: 要解决的问题：提供在不受温度条件，波长等影响的情况下始终保持高透明度的纤维增强复合材料，并且通过在纤维和基质材料之间形成复合材料来赋予各种官能度 解决方案：提供一种纤维增强复合材料，其含有平均纤维直径为4〜200nm的纤维和基体材料，并且在400〜700nm的波长下具有60％以上的可见光透射率，其中 是基于50μm的厚度的转换值。 由于使用平均纤维直径比可见光波长（380-800nm）短的纤维，难以发生可见光的折射，即使发生温度变化和波长变化， 难以产生纤维界面和基体材料的可见光的散射损失。 因此，可以稳定地保持50μm厚度的可见光透射率高达60％以上的高透明度。

公开(公告)号：JP2010267652A

公开(公告)日：2010-11-25

申请号：JP2009115442

申请日：2009-05-12

Applicant: Hitachi Cable Ltd ,  日立電線株式会社

Inventor： WAJIMA MINEO

IPC: H05K3/22

CPC classification number: H05K3/0082 ,  H05K3/108 ,  H05K3/243 ,  H05K3/246 ,  H05K2201/0108 ,  H05K2203/0551 ,  Y10T29/49155

Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board capable of correctly (highly precisely and unfailingly) forming a conductor pattern including a very fine wiring pattern etc.; and to provide a method for manufacturing the printed wiring board. SOLUTION: The conductor pattern 4 made by laminating a base metal pattern 2 and a plating metal pattern 3 is formed by the method including a step of forming a base metal pattern 2; a step of coating a negative photoresist 6 on one surface where the base metal pattern 2 is formed; a step of irradiating the photoresist 6 with a light 7 transmitting an insulative substrate 1 by using the base metal pattern 2 to expose the photoresist 6, thereby forming a plating resist pattern 8; and a step of plating, using the base metal pattern 2 as a seed layer, only on a portion where the plating resist pattern 8 is not formed by using the plating resist pattern 8, thereby selectively forming a plating metal pattern 3 on only the base metal pattern 2. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供能够正确（高度精确地和可靠地）形成包括非常精细的布线图案等的导体图案的印刷布线板; 并提供一种制造印刷电路板的方法。 解决方案：通过层压基底金属图案2和电镀金属图案3制成的导体图案4通过包括形成基底金属图案2的步骤的方法形成; 在形成基底金属图案2的一个表面上涂布负性光致抗蚀剂6的步骤; 通过使用母材金属图案2透射绝缘基板1的光7照射光致抗蚀剂6以暴露光致抗蚀剂6的步骤，从而形成电镀抗蚀剂图案8; 以及通过使用电镀抗蚀剂图案8仅在不形成电镀抗蚀剂图案8的部分上使用贱金属图案2作为籽晶层进行电镀的步骤，从而仅在基底上选择性地形成电镀金属图案3 金属图案2.版权所有（C）2011，JPO＆INPIT