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公开(公告)号：TW201532234A
公开(公告)日：2015-08-16
申请号：TW103145300
申请日：2014-12-24
发明人： 陳憲偉 , CHEN, HSIENWEI , 陳英儒 , CHEN, YINGJU , 邱銘彥 , CHIU, MINGYEN , 葉德強 , YEH, DERCHYANG
IPC分类号： H01L23/498 , H01L25/04 , H01L21/768
CPC分类号： H01L25/0657 , H01L21/565 , H01L23/12 , H01L23/13 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/49811 , H01L23/50 , H01L23/538 , H01L23/5384 , H01L23/5386 , H01L23/5389 , H01L23/562 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/27 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/97 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/1132 , H01L2224/11334 , H01L2224/1145 , H01L2224/11462 , H01L2224/11849 , H01L2224/12105 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16225 , H01L2224/1703 , H01L2224/17181 , H01L2224/2518 , H01L2224/27015 , H01L2224/32145 , H01L2224/32225 , H01L2224/32258 , H01L2224/32502 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73259 , H01L2224/73265 , H01L2224/81815 , H01L2224/92125 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06568 , H01L2225/06572 , H01L2225/06586 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/12042 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/1431 , H01L2924/1432 , H01L2924/1434 , H01L2924/15153 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/351 , H01L2924/00012 , H01L2224/82 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： 本揭露的實施例包括半導體封裝與其形成方法。某一實施例為半導體封裝，包括了包含有一或多個晶粒的第一封裝，以及透過第一組連接件接合至第一封裝第一側的封裝基板。此半導體封裝還包括配裝在第一封裝第一側的表面配裝裝置，此表面配裝裝置實質上是由一或多個被動元件所組成。
简体摘要： 本揭露的实施例包括半导体封装与其形成方法。某一实施例为半导体封装，包括了包含有一或多个晶粒的第一封装，以及透过第一组连接件接合至第一封装第一侧的封装基板。此半导体封装还包括配装在第一封装第一侧的表面配装设备，此表面配装设备实质上是由一或多个被动组件所组成。
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公开(公告)号：TWI550795B
公开(公告)日：2016-09-21
申请号：TW103145299
申请日：2014-12-24
发明人： 陳憲偉 , CHEN, HSIENWEI , 陳英儒 , CHEN, YINGJU
CPC分类号： H01L25/0657 , H01L21/565 , H01L23/12 , H01L23/13 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/49811 , H01L23/50 , H01L23/538 , H01L23/5384 , H01L23/5386 , H01L23/5389 , H01L23/562 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/27 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/97 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/1132 , H01L2224/11334 , H01L2224/1145 , H01L2224/11462 , H01L2224/11849 , H01L2224/12105 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16225 , H01L2224/1703 , H01L2224/17181 , H01L2224/2518 , H01L2224/27015 , H01L2224/32145 , H01L2224/32225 , H01L2224/32258 , H01L2224/32502 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73259 , H01L2224/73265 , H01L2224/81815 , H01L2224/92125 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06568 , H01L2225/06572 , H01L2225/06586 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/12042 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/1431 , H01L2924/1432 , H01L2924/1434 , H01L2924/15153 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/351 , H01L2924/00012 , H01L2224/82 , H01L2924/00 , H01L2224/45015 , H01L2924/207
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公开(公告)号：TWI548053B
公开(公告)日：2016-09-01
申请号：TW103145300
申请日：2014-12-24
发明人： 陳憲偉 , CHEN, HSIENWEI , 陳英儒 , CHEN, YINGJU , 邱銘彥 , CHIU, MINGYEN , 葉德強 , YEH, DERCHYANG
IPC分类号： H01L23/498 , H01L25/04 , H01L21/768
CPC分类号： H01L25/0657 , H01L21/565 , H01L23/12 , H01L23/13 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/49811 , H01L23/50 , H01L23/538 , H01L23/5384 , H01L23/5386 , H01L23/5389 , H01L23/562 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/27 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/97 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/1132 , H01L2224/11334 , H01L2224/1145 , H01L2224/11462 , H01L2224/11849 , H01L2224/12105 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16225 , H01L2224/1703 , H01L2224/17181 , H01L2224/2518 , H01L2224/27015 , H01L2224/32145 , H01L2224/32225 , H01L2224/32258 , H01L2224/32502 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73259 , H01L2224/73265 , H01L2224/81815 , H01L2224/92125 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06568 , H01L2225/06572 , H01L2225/06586 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/12042 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/1431 , H01L2924/1432 , H01L2924/1434 , H01L2924/15153 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/351 , H01L2924/00012 , H01L2224/82 , H01L2924/00 , H01L2224/45015 , H01L2924/207
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公开(公告)号：TWI531034B
公开(公告)日：2016-04-21
申请号：TW103145291
申请日：2014-12-24
发明人： 余振華 , YU, CHENHUA , 鄭心圃 , JENG, SHINPUU , 葉德強 , YEH, DERCHYANG , 陳憲偉 , CHEN, HSIENWEI
CPC分类号： H01L23/5386 , H01L23/3114 , H01L23/49811 , H01L23/49838 , H01L23/5383 , H01L23/5384 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/48 , H01L25/105 , H01L2224/0401 , H01L2224/05552 , H01L2224/05555 , H01L2224/06051 , H01L2224/06135 , H01L2224/06136 , H01L2224/06179 , H01L2224/13147 , H01L2224/16052 , H01L2224/16055 , H01L2224/16227 , H01L2224/17051 , H01L2224/17135 , H01L2224/17136 , H01L2224/17179 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/10162 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
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公开(公告)号：TWI506711B
公开(公告)日：2015-11-01
申请号：TW102126500
申请日：2013-07-24
发明人： 陳憲偉 , CHEN, HSIENWEI , 蔡豪益 , TSAI, HAOYI , 李明機 , LII, MIRNGJI , 余振華 , YU, CHENHUA , 于宗源 , YU, TSUNGYUAN
IPC分类号： H01L21/60
CPC分类号： H01L24/02 , H01L21/486 , H01L21/52 , H01L21/565 , H01L21/566 , H01L21/76877 , H01L23/3192 , H01L23/525 , H01L23/53214 , H01L23/53228 , H01L23/53242 , H01L23/53257 , H01L23/53295 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/02311 , H01L2224/02371 , H01L2224/02373 , H01L2224/0239 , H01L2224/0401 , H01L2224/05008 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05548 , H01L2224/05572 , H01L2224/05573 , H01L2224/05611 , H01L2224/05616 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/10125 , H01L2224/1181 , H01L2224/11849 , H01L2224/1191 , H01L2224/13026 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/81815 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/3512 , H01L2924/00014 , H01L2924/00015 , H01L2924/00
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公开(公告)号：TWI546894B
公开(公告)日：2016-08-21
申请号：TW103144580
申请日：2014-12-19
发明人： 陳潔 , CHEN, JIE , 陳憲偉 , CHEN, HSIENWEI
IPC分类号： H01L21/768 , H01L23/00 , H01L23/528
CPC分类号： H01L24/13 , H01L21/768 , H01L23/293 , H01L23/3114 , H01L23/3192 , H01L23/485 , H01L23/525 , H01L23/53295 , H01L24/03 , H01L24/05 , H01L24/11 , H01L2224/02255 , H01L2224/0231 , H01L2224/02333 , H01L2224/0235 , H01L2224/02351 , H01L2224/0236 , H01L2224/0239 , H01L2224/0382 , H01L2224/05008 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05548 , H01L2224/05555 , H01L2224/05568 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/05649 , H01L2224/05655 , H01L2224/10145 , H01L2224/11015 , H01L2224/11334 , H01L2224/11849 , H01L2224/13014 , H01L2224/13022 , H01L2224/13023 , H01L2224/13024 , H01L2224/13027 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/05042 , H01L2924/05442 , H01L2924/059 , H01L2924/05994 , H01L2924/06 , H01L2924/0665 , H01L2924/07025 , H01L2924/2064 , H01L2924/00014 , H01L2924/014
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公开(公告)号：TWI533406B
公开(公告)日：2016-05-11
申请号：TW103145546
申请日：2014-12-25
发明人： 陳憲偉 , CHEN, HSIENWEI
IPC分类号： H01L21/768 , H01L23/544 , H01L23/48
CPC分类号： H01L25/105 , H01L21/76898 , H01L23/3128 , H01L23/481 , H01L23/544 , H01L23/585 , H01L24/06 , H01L24/11 , H01L24/17 , H01L24/19 , H01L24/20 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2223/54406 , H01L2223/54433 , H01L2223/54486 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05025 , H01L2224/11334 , H01L2224/11849 , H01L2224/12105 , H01L2224/16113 , H01L2224/16145 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/73267 , H01L2224/81815 , H01L2225/0651 , H01L2225/06513 , H01L2225/06548 , H01L2225/06568 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2225/1082 , H01L2225/1094 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
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公开(公告)号：TWI512927B
公开(公告)日：2015-12-11
申请号：TW102146971
申请日：2013-12-18
发明人： 賴昱嘉 , LAI, YUCHIA , 杜賢明 , TU, HSIENMING , 邵棟樑 , SHAO, TUNGLIANG , 陳憲偉 , CHEN, HSIENWEI , 黃章斌 , HUANG, CHANGPIN , 楊慶榮 , YANG, CHINGJUNG
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L24/11 , H01L21/563 , H01L23/3192 , H01L24/02 , H01L24/05 , H01L24/13 , H01L2224/02235 , H01L2224/0225 , H01L2224/02255 , H01L2224/02313 , H01L2224/0233 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/05548 , H01L2224/10125 , H01L2224/11015 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/13111 , H01L2924/01029 , H01L2924/181 , H01L2924/01082 , H01L2924/01047 , H01L2924/00012 , H01L2924/014 , H01L2924/00
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公开(公告)号：TW201539656A
公开(公告)日：2015-10-16
申请号：TW103144580
申请日：2014-12-19
发明人： 陳潔 , CHEN, JIE , 陳憲偉 , CHEN, HSIENWEI
IPC分类号： H01L21/768 , H01L23/00 , H01L23/528
CPC分类号： H01L24/13 , H01L21/768 , H01L23/293 , H01L23/3114 , H01L23/3192 , H01L23/485 , H01L23/525 , H01L23/53295 , H01L24/03 , H01L24/05 , H01L24/11 , H01L2224/02255 , H01L2224/0231 , H01L2224/02333 , H01L2224/0235 , H01L2224/02351 , H01L2224/0236 , H01L2224/0239 , H01L2224/0382 , H01L2224/05008 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05548 , H01L2224/05555 , H01L2224/05568 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/05649 , H01L2224/05655 , H01L2224/10145 , H01L2224/11015 , H01L2224/11334 , H01L2224/11849 , H01L2224/13014 , H01L2224/13022 , H01L2224/13023 , H01L2224/13024 , H01L2224/13027 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/05042 , H01L2924/05442 , H01L2924/059 , H01L2924/05994 , H01L2924/06 , H01L2924/0665 , H01L2924/07025 , H01L2924/2064 , H01L2924/00014 , H01L2924/014
摘要： 一種用於製造半導體裝置的方法，其包括一導電墊和一金屬凸起圖案形成於金屬層上。一鈍化層保形地沉積於金屬層上，而保護層保形地沉積在鈍化層上。此外，一後鈍化互連結構(PPI)保形地形成在保護層上，而此PPI結構包括一接著墊區，一凸起圖案於接著墊區的至少一個部分上及一連接線電連接至導電墊。一焊料凸塊然後放置於接著墊區上與PPI結構的凸起圖案接觸。另外也揭露一種具有凸塊擋止結構的半導體裝置。
简体摘要： 一种用于制造半导体设备的方法，其包括一导电垫和一金属凸起图案形成于金属层上。一钝化层保形地沉积于金属层上，而保护层保形地沉积在钝化层上。此外，一后钝化互链接构(PPI)保形地形成在保护层上，而此PPI结构包括一接着垫区，一凸起图案于接着垫区的至少一个部分上及一连接线电连接至导电垫。一焊料凸块然后放置于接着垫区上与PPI结构的凸起图案接触。另外也揭露一种具有凸块挡止结构的半导体设备。
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公开(公告)号：TW201530708A
公开(公告)日：2015-08-01
申请号：TW103145291
申请日：2014-12-24
发明人： 余振華 , YU, CHENHUA , 鄭心圃 , JENG, SHINPUU , 葉德強 , YEH, DERCHYANG , 陳憲偉 , CHEN, HSIENWEI
CPC分类号： H01L23/5386 , H01L23/3114 , H01L23/49811 , H01L23/49838 , H01L23/5383 , H01L23/5384 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/48 , H01L25/105 , H01L2224/0401 , H01L2224/05552 , H01L2224/05555 , H01L2224/06051 , H01L2224/06135 , H01L2224/06136 , H01L2224/06179 , H01L2224/13147 , H01L2224/16052 , H01L2224/16055 , H01L2224/16227 , H01L2224/17051 , H01L2224/17135 , H01L2224/17136 , H01L2224/17179 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/10162 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： 一種封裝體包含邊角區域、元件晶粒、複數個重分佈線以及複數個非焊料電性連接元件。複數個重分佈線形成於元件晶粒下方。複數個非焊料電性連接元件形成在重分佈線下方，且電性連接重分佈線。非焊料電性連接元件包含邊角電性連接元件。邊角電性連接元件是長條形的。電性連接元件距離邊角區域的距離較邊角電性連接元件遠，電性連接元件為非長條形的。
简体摘要： 一种封装体包含边角区域、组件晶粒、复数个重分布线以及复数个非焊料电性连接组件。复数个重分布线形成于组件晶粒下方。复数个非焊料电性连接组件形成在重分布线下方，且电性连接重分布线。非焊料电性连接组件包含边角电性连接组件。边角电性连接组件是长条形的。电性连接组件距离边角区域的距离较边角电性连接组件远，电性连接组件为非长条形的。
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