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公开(公告)号：US20110055616A1
公开(公告)日：2011-03-03
申请号：US12805689
申请日：2010-08-13
申请人： Yoji Nishio , Takao Ono
发明人： Yoji Nishio , Takao Ono
CPC分类号： G11C5/04 , G06F13/1673
摘要： A memory buffer mounted on a memory module includes a pre-launch function of advancing outputs of address/command signal and a post-launch function of delaying outputs of control signal. A time step increment for pre/post-launch time adjustment is set to be equal to or finer than tCK/32 where tCK is one clock cycle.
摘要翻译： 安装在存储器模块上的存储器缓冲器包括推进地址/命令信号输出的预启动功能和延迟控制信号输出的发射后功能。 预启动/启动后时间调整的时间步长增量设置为等于或更小于tCK / 32，其中tCK是一个时钟周期。
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公开(公告)号：US20100238695A1
公开(公告)日：2010-09-23
申请号：US12727008
申请日：2010-03-18
申请人： Takao ONO
发明人： Takao ONO
CPC分类号： G11C5/063
摘要： To provide a module substrate, memory chips mounted on the module substrate, and data input/output wirings that are connected respectively to the memory chips and read data or write data is transmitted thereto. The number of memory chips is equal to the number of bits of read data or write data transmitted through the data input/output wirings at the same time. Because a plurality of data input/output wirings are connected to different memory chips, the load exerted upon each channel can be reduced without using memory buffers.
摘要翻译： 为了提供模块基板，安装在模块基板上的存储器芯片以及分别连接到存储器芯片和读取数据或写入数据的数据输入/输出布线被传送到其中。 存储器芯片的数量等于通过数据输入/输出布线同时传输的读取数据或写入数据的位数。 由于多个数据输入/输出布线连接到不同的存储器芯片，所以可以在不使用存储器缓冲器的情况下减少施加在每个通道上的负载。
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公开(公告)号：US07763971B2
公开(公告)日：2010-07-27
申请号：US12175574
申请日：2008-07-18
申请人： Takao Ono
发明人： Takao Ono
IPC分类号： H01L23/053
CPC分类号： H05K1/181 , H01L23/3114 , H01L23/3128 , H01L24/48 , H01L25/0657 , H01L25/105 , H01L2224/16 , H01L2224/48091 , H01L2225/0651 , H01L2225/06517 , H01L2225/06527 , H01L2225/06582 , H01L2225/06586 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H05K2201/09709 , H05K2201/10515 , Y02P70/611 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In an electrical component including a solid-state circuit portion and a substrate connecting portion, the solid-state circuit portion includes: a supporting surface faced to and supported by the substrate connecting portion; and an opposing surface which is widened outside the supporting surface and which has an area enough to be opposed to another solid-state circuit portion. This structure makes it possible to arrange, on a circuit board, a plurality of the electrical components in a staggered manner in a height direction.
摘要翻译： 在包括固态电路部分和基板连接部分的电气部件中，固态电路部分包括：面对并由基板连接部分支撑的支撑表面; 以及相对的表面，其在支撑表面的外侧加宽，并且具有足以与另一固态电路部分相对的面积。 这种结构使得可以在电路板上沿高度方向以交错的方式布置多个电气部件。
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公开(公告)号：US06726780B2
公开(公告)日：2004-04-27
申请号：US10384829
申请日：2003-03-10
申请人： Takao Ono , Mitsuru Iwabuchi , Kenji Fujimori , Hiroaki Koyahara
发明人： Takao Ono , Mitsuru Iwabuchi , Kenji Fujimori , Hiroaki Koyahara
IPC分类号： B23K3522
CPC分类号： C22C13/00 , B23K35/025 , B23K35/262 , H05K3/3463 , H05K3/3484
摘要： There is provided a lead-free solder which makes it possible to reliably and accurately perform the inspection of various kinds of defective soldering in the inspection using an image inspection apparatus after the reflow soldering. According to this lead-free solder, the delustering of the metallic luster of fillet is realized in order to minimize the probability of generating a dark portion at the area where no defective soldering is existed and instead to increase the area of whitish portion which can be generated through the irregular reflection of beam. Specifically, this invention provides a lead-free solder comprising an Sn—Ag—Cu-based lead-free solder containing a small quantity of Bi and Sb as an element which is capable of generating a delustering component for minimizing metallic luster of the fillet.
摘要翻译： 提供了一种无铅焊料，其使得可以在回流焊接之后使用图像检查装置可靠且准确地执行检查中的各种不良焊接。 根据这种无铅焊料，实现了圆角金属光泽的消光，以便在不存在有缺陷焊接的区域处产生暗部的可能性最小化，而是增加发白部分的面积 通过梁的不规则反射产生。 具体而言，本发明提供了一种无铅焊料，其包含含有少量Bi和Sb作为元素的Sn-Ag-Cu系无铅焊料，其能够产生用于使金属丝的金属光泽最小化的消光部件。
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公开(公告)号：US20110317356A1
公开(公告)日：2011-12-29
申请号：US13165305
申请日：2011-06-21
申请人： Takao ONO , Atsushi MORISHIMA
发明人： Takao ONO , Atsushi MORISHIMA
CPC分类号： H05K1/141 , G06F1/185 , H05K3/368 , H05K2201/041 , H05K2201/044 , H05K2201/10159 , H05K2201/10318
摘要： The present invention is adapted to a memory system that includes: a motherboard and a module board, wherein: the motherboard comprises a module socket mounted on the motherboard; and a plurality of pins two-dimensionally arranged on the module socket, and vertically erected with respect to the motherboard: and the module board comprises a plurality of device chips installed on the module board; and a contact portion mounted on the module board, and including a plurality of through holes two-dimensionally arranged thereon, the contact portion being electrically connected to the device chips: wherein each of the pins is inserted into each of the through holes to connect electrically to the contact portion.
摘要翻译： 本发明适用于包括：主板和模块板的存储器系统，其中：所述母板包括安装在所述母板上的模块插座; 以及二维地布置在模块插座上并相对于母板垂直竖立的多个销，并且模块板包括安装在模块板上的多个装置芯片; 以及安装在所述模块基板上的接触部分，并且包括二维地布置在其上的多个通孔，所述接触部分电连接到所述器件芯片：其中每个所述引脚插入到每个所述通孔中以电连接 到接触部分。
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公开(公告)号：US20050248010A1
公开(公告)日：2005-11-10
申请号：US11080545
申请日：2005-03-16
申请人： Takao Ono , Tomohiko Sato , Hironori Iwasaki
发明人： Takao Ono , Tomohiko Sato , Hironori Iwasaki
IPC分类号： H01L23/12 , H01L23/02 , H01L23/13 , H01L23/498 , H01L25/10 , H01L25/11 , H01L25/18 , H05K1/02 , H05K3/34
CPC分类号： H01L23/49816 , H01L23/13 , H01L25/105 , H01L2225/1023 , H01L2225/1058 , H01L2924/0002 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H05K1/0271 , H05K3/3436 , H05K2201/09172 , H05K2201/10159 , H05K2201/10515 , Y02P70/613 , H01L2924/00
摘要： A thermal expansion coefficient of a module substrate 8 is different from that of a package substrate. There is not any place where stresses generated in Interfaces between soldering balls 5 and the substrate are released. These stresses are largely applied to soldering bond, the soldering balls are strained, deformed, or cracked, and there has been a problem in long-time reliability. Slits are disposed on opposite sides of each soldering ball in a vertical direction to a side in an outer peripheral side of the package substrate, accordingly the stresses applied to the soldering balls are weakened, and the soldering balls are prevented from being strained, deformed, or cracked. When soldering strains are reduced in this manner, there can be provided a surface mounting type semiconductor package and system module having high reliability, low cost, and satisfactory electric characteristics such as low capacitance and low inductance.
摘要翻译： 模块基板8的热膨胀系数与封装基板的热膨胀系数不同。 没有任何地方在焊球5和基板之间的接口中产生应力释放。 这些应力主要用于焊接，焊球变形，变形或破裂，长时间的可靠性存在问题。 在每个焊球的相对侧，在与封装基板的外周侧的一侧的垂直方向上配置有狭缝，因此施加于焊球的应力变弱，防止焊球发生变形， 或破裂。 当以这种方式减小焊接应变时，可以提供具有高可靠性，低成本和令人满意的电特性如低电容和低电感的表面安装型半导体封装和系统模块。
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公开(公告)号：US06756166B2
公开(公告)日：2004-06-29
申请号：US10252200
申请日：2002-09-23
申请人： Takao Ono , Ichiro Miura
发明人： Takao Ono , Ichiro Miura
IPC分类号： G03F7038
摘要： Disclosed is a photosensitive resin composition which can be developed using a dilute aqueous alkaline solution after ultraviolet ray exposure, is excellent in pot life, capable of preventing deposits from being generated in a cured coated film, capable of widening heat control tolerance, and is excellent in sensitivity, in heat resistance, in chemical resistance and in electric insulating properties, thereby rendering the composition suitable for use as a solder resist for producing a printed wiring board. This photosensitive resin composition comprises (A) an active energy ray-curable resin having at least two ethylenic unsaturated linkages per molecule thereof, (B) at least one kind material selected from acid salts of N-substituted melamine compound and acid salts of guanamine compound, (C) a photopolymerization initiator, (D) a diluent, and (E) a thermosetting compound. There is also disclosed a printed wiring board where this photosensitive resin composition is employed.
摘要翻译： 公开了一种感光性树脂组合物，其可以在紫外线照射后使用稀碱水溶液显影，具有优异的适用期，能够防止在固化涂膜中产生沉积物，能够扩大耐热耐受性，并且优异 敏感性，耐热性，耐化学性和电绝缘性，从而使组合物适合用作制造印刷线路板的阻焊剂。 该感光性树脂组合物包含（A）每分子具有至少2个烯键式不饱和键的活性能量射线固化性树脂，（B）选自N-取代三聚氰胺化合物的酸式盐和胍胺化合物的酸盐中的至少一种 ，（C）光聚合引发剂，（D）稀释剂和（E）热固化性化合物。 还公开了使用该感光性树脂组合物的印刷电路板。
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公开(公告)号：US6036214A
公开(公告)日：2000-03-14
申请号：US987248
申请日：1997-12-09
申请人： Takao Ono , Masahiro Ito , Hiroshi Nakano , Atsushi Kohama , Takehiro Miyoshi , Masashi Kawasaki , Hideki Yamamoto , Hiroshi Iwamoto , Mitsuo Suzuri , Futoyoshi Morimoto
发明人： Takao Ono , Masahiro Ito , Hiroshi Nakano , Atsushi Kohama , Takehiro Miyoshi , Masashi Kawasaki , Hideki Yamamoto , Hiroshi Iwamoto , Mitsuo Suzuri , Futoyoshi Morimoto
IPC分类号： E05B71/00 , B62H1/02 , B62H1/12 , B62H5/00 , B62H5/04 , B62H5/06 , B62H5/08 , B62H5/12 , B62H5/14 , B62H5/16 , B62H5/18 , B62H7/00 , B62J1/04 , B62J1/08 , B62K19/36 , B62K25/02 , B62H1/00
摘要： The present invention provides a bicycle equipped with an antitheft device of the type which suspends the function of the bicycle as by locking the saddle in unridable form and which requires a fewer number of operating steps for parking the bicycle. The bicycle is characterized in that it is provided with a key device for locking the saddle in the parked state, a stand locking device for locking the stand in the erected state, and a connecting rod which is adapted to be pulled up in operative connection with the turning movement of the saddle from the in-service state to the parked state and whose lower end is connected to the stand locking device. When the saddle is turned to the parked state, the connecting rod is pulled and the stand is locked by the stand locking device. When the saddle is turned to the in-service state, the connecting rod is depressed to cancel the locked state.
摘要翻译： 本发明提供了一种配备有防盗装置的自行车，该防盗装置通过将鞍座以不可避免的形式锁定并且需要较少数量的用于停放自行车的操作步骤来悬挂自行车的功能。 该自行车的特征在于，其具有用于将鞍座锁定在停放状态的关键装置，用于将支架锁定在竖立状态的支架锁定装置，以及连接杆，该连杆适于与 鞍座从使用状态到停放状态的转动运动，并且其下端连接到支架锁定装置。 当鞍座转到停放状态时，连杆被拉动，支架被支架锁定装置锁定。 当鞍座转到使用状态时，连杆被按下以取消锁定状态。
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公开(公告)号：US5255001A
公开(公告)日：1993-10-19
申请号：US627455
申请日：1990-12-14
申请人： Yoshiharu Tamura , Takao Ono
发明人： Yoshiharu Tamura , Takao Ono
摘要： An antenna for a portable radio apparatus has a first antenna construction connected to the casing of the apparatus and a second antenna construction affixed to a base plate or earth plate which is incorporated in the casing. The first antenna construction has a movable joint which allows the first antenna construction to move between a first position where it is regarded as forming a part of the contour of the casing and a second position where it is protruded from the contour and regarded as being located in free space. The second antenna construction corrects the matching state of the first antenna construction such that adequate antenna radiation characteristics are set up in the first position. Optimal antenna characteristics are, therefore, achievable when the first antenna construction is in any one of the first and second positions.
摘要翻译： 用于便携式无线电设备的天线具有连接到设备的壳体的第一天线结构和固定到底板或接地板的第二天线结构，其结合在壳体中。 第一天线结构具有可动接头，其允许第一天线结构在其被认为形成壳体的轮廓的一部分的第一位置和从轮廓突出并被认为位于的第二位置之间移动 在自由空间。 第二天线结构校正第一天线结构的匹配状态，使得在第一位置设置足够的天线辐射特性。 因此，当第一天线结构处于第一和第二位置中的任何一个时，最佳天线特性是可实现的。
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公开(公告)号：US5148181A
公开(公告)日：1992-09-15
申请号：US624599
申请日：1990-12-10
申请人： Yukio Yokoyama , Takao Ono
发明人： Yukio Yokoyama , Takao Ono
CPC分类号： H01Q9/0421 , H01Q1/243 , H01Q9/42
摘要： A mobile radio communication apparatus with an improved antenna for promoting easy manual operations, insuring desirable acoustic characteristics, and preventing the antenna gain from being lowered by user's head or hand during communication. An antenna is mounted on the upper surface of a casing and made up of a rectangular first conductive plate parallel to and spaced apart from the upper surface by a predetermined distance and having a length L.sub.1, a rectangular second conductive plate extending perpendicularly from the first conductive plate and having a height H.sub.2, and a rectangular third conductive plate extending perpendicularly from the second conductive plate and in parallel to the first conductive plate. A short-circuiting plate extending perpendicularly from one side of the first conductive plate by a height H.sub.1 and has a length M as measured in a direction parallel to the length L.sub.1. The short-circuiting plate has the end thereof connected and affixed to the upper end of a particular surface of the casing where the earpiece, mouthpiece and operation secton are arranged. The height H.sub.1 of the short-circuiting plate is greater than said height H.sub.2 of the second conductive plate, while the length M of the short-circuiting plate is equal to or smaller than the length L.sub.1 of the first conductive plate.
摘要翻译： 一种具有改进的天线的移动无线电通信装置，用于促进便于手动操作，确保期望的声学特性，并且防止在通信期间用户的头部或手部降低天线增益。 天线安装在壳体的上表面上，由平行于上表面并与之隔开预定距离的矩形第一导电板构成，并具有长度L1，从第一导电层垂直延伸的矩形第二导电板 并且具有高度H2，以及从第二导电板垂直延伸并平行于第一导电板的矩形第三导电板。 从第一导电板的一侧垂直地延伸高度H1的短路板，并且具有沿与长度L1平行的方向测量的长度M. 短路板的端部连接并固定到壳体的特定表面的上端，其中耳机，接口管和操作构造被布置。 短路板的高度H1大于第二导电板的高度H2，而短路板的长度M等于或小于第一导电板的长度L1。
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