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23 条记录 (耗时 0.025 秒)

    Lead-free solder, and paste solder composition
    1.
    发明授权
    Lead-free solder, and paste solder composition 有权
    无铅焊料和焊膏组成

    公开(公告)号：US06726780B2

    公开(公告)日：2004-04-27

    申请号：US10384829

    申请日：2003-03-10

    申请人： Takao Ono ,  Mitsuru Iwabuchi ,  Kenji Fujimori ,  Hiroaki Koyahara

    发明人： Takao Ono ,  Mitsuru Iwabuchi ,  Kenji Fujimori ,  Hiroaki Koyahara

    IPC分类号： B23K3522

    CPC分类号： C22C13/00 ,  B23K35/025 ,  B23K35/262 ,  H05K3/3463 ,  H05K3/3484

    摘要： There is provided a lead-free solder which makes it possible to reliably and accurately perform the inspection of various kinds of defective soldering in the inspection using an image inspection apparatus after the reflow soldering. According to this lead-free solder, the delustering of the metallic luster of fillet is realized in order to minimize the probability of generating a dark portion at the area where no defective soldering is existed and instead to increase the area of whitish portion which can be generated through the irregular reflection of beam. Specifically, this invention provides a lead-free solder comprising an Sn—Ag—Cu-based lead-free solder containing a small quantity of Bi and Sb as an element which is capable of generating a delustering component for minimizing metallic luster of the fillet.

    摘要翻译： 提供了一种无铅焊料，其使得可以在回流焊接之后使用图像检查装置可靠且准确地执行检查中的各种不良焊接。 根据这种无铅焊料，实现了圆角金属光泽的消光，以便在不存在有缺陷焊接的区域处产生暗部的可能性最小化，而是增加发白部分的面积 通过梁的不规则反射产生。 具体而言，本发明提供了一种无铅焊料，其包含含有少量Bi和Sb作为元素的Sn-Ag-Cu系无铅焊料，其能够产生用于使金属丝的金属光泽最小化的消光部件。

    Memory module
    2.
    发明授权
    Memory module 有权
    内存模块

    公开(公告)号：US08347057B2

    公开(公告)日：2013-01-01

    申请号：US12805689

    申请日：2010-08-13

    申请人： Yoji Nishio ,  Takao Ono

    发明人： Yoji Nishio ,  Takao Ono

    IPC分类号： G06F12/00

    CPC分类号： G11C5/04 ,  G06F13/1673

    摘要： A memory buffer mounted on a memory module includes a pre-launch function of advancing outputs of address/command signal and a post-launch function of delaying outputs of control signal. A time step increment for pre/post-launch time adjustment is set to be equal to or finer than tCK/32 where tCK is one clock cycle.

    摘要翻译： 安装在存储器模块上的存储器缓冲器包括推进地址/命令信号输出的预启动功能和延迟控制信号输出的发射后功能。 预启动/启动后时间调整的时间步长增量设置为等于或更小于tCK / 32，其中tCK是一个时钟周期。

    DC brushless motor
    4.
    发明申请
    DC brushless motor 审中-公开
    直流无刷电机

    公开(公告)号：US20050001502A1

    公开(公告)日：2005-01-06

    申请号：US10868792

    申请日：2004-06-17

    申请人： Hiroyuki Yamazaki ,  Takao Ono

    发明人： Hiroyuki Yamazaki ,  Takao Ono

    IPC分类号： H02K1/22 ,  H02K1/27 ,  H02K15/03 ,  H02K29/00 ,  H02K29/03 ,  H02K21/12

    CPC分类号： H02K29/03

    摘要： The DC brushless motor is capable of increasing an output power and reducing vibrations and noise. The DC brushless motor comprises: a magnet rotor, in which magnetic poles are polar-anisotropically oriented, wherein the magnetic poles are skewed with respect to an axial line of the magnet rotor.

    摘要翻译： 直流无刷电机能够增加输出功率，减少振动和噪音。 DC无刷电动机包括：磁极，其中磁极是极各向异性取向的，其中磁极相对于磁体转子的轴线倾斜。

    Memory module
    5.
    发明申请
    Memory module 有权
    内存模块

    公开(公告)号：US20110055616A1

    公开(公告)日：2011-03-03

    申请号：US12805689

    申请日：2010-08-13

    申请人： Yoji Nishio ,  Takao Ono

    发明人： Yoji Nishio ,  Takao Ono

    IPC分类号： G06F1/04 ,  G06F12/00 ,  G06F1/12

    CPC分类号： G11C5/04 ,  G06F13/1673

    摘要： A memory buffer mounted on a memory module includes a pre-launch function of advancing outputs of address/command signal and a post-launch function of delaying outputs of control signal. A time step increment for pre/post-launch time adjustment is set to be equal to or finer than tCK/32 where tCK is one clock cycle.

    摘要翻译： 安装在存储器模块上的存储器缓冲器包括推进地址/命令信号输出的预启动功能和延迟控制信号输出的发射后功能。 预启动/启动后时间调整的时间步长增量设置为等于或更小于tCK / 32，其中tCK是一个时钟周期。

    Semiconductor package and system module
    7.
    发明申请
    Semiconductor package and system module 审中-公开
    半导体封装和系统模块

    公开(公告)号：US20050248010A1

    公开(公告)日：2005-11-10

    申请号：US11080545

    申请日：2005-03-16

    申请人： Takao Ono ,  Tomohiko Sato ,  Hironori Iwasaki

    发明人： Takao Ono ,  Tomohiko Sato ,  Hironori Iwasaki

    IPC分类号： H01L23/12 ,  H01L23/02 ,  H01L23/13 ,  H01L23/498 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H05K1/02 ,  H05K3/34

    CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L25/105 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H05K1/0271 ,  H05K3/3436 ,  H05K2201/09172 ,  H05K2201/10159 ,  H05K2201/10515 ,  Y02P70/613 ,  H01L2924/00

    摘要： A thermal expansion coefficient of a module substrate 8 is different from that of a package substrate. There is not any place where stresses generated in Interfaces between soldering balls 5 and the substrate are released. These stresses are largely applied to soldering bond, the soldering balls are strained, deformed, or cracked, and there has been a problem in long-time reliability. Slits are disposed on opposite sides of each soldering ball in a vertical direction to a side in an outer peripheral side of the package substrate, accordingly the stresses applied to the soldering balls are weakened, and the soldering balls are prevented from being strained, deformed, or cracked. When soldering strains are reduced in this manner, there can be provided a surface mounting type semiconductor package and system module having high reliability, low cost, and satisfactory electric characteristics such as low capacitance and low inductance.

    摘要翻译： 模块基板8的热膨胀系数与封装基板的热膨胀系数不同。 没有任何地方在焊球5和基板之间的接口中产生应力释放。 这些应力主要用于焊接，焊球变形，变形或破裂，长时间的可靠性存在问题。 在每个焊球的相对侧，在与封装基板的外周侧的一侧的垂直方向上配置有狭缝，因此施加于焊球的应力变弱，防止焊球发生变形， 或破裂。 当以这种方式减小焊接应变时，可以提供具有高可靠性，低成本和令人满意的电特性如低电容和低电感的表面安装型半导体封装和系统模块。

    Photosensitive resin composition and printed wiring board
    8.
    发明授权
    Photosensitive resin composition and printed wiring board 失效
    感光树脂组合物和印刷线路板

    公开(公告)号：US06756166B2

    公开(公告)日：2004-06-29

    申请号：US10252200

    申请日：2002-09-23

    申请人： Takao Ono ,  Ichiro Miura

    发明人： Takao Ono ,  Ichiro Miura

    IPC分类号： G03F7038

    CPC分类号： G03F7/038 ,  H05K3/287

    摘要： Disclosed is a photosensitive resin composition which can be developed using a dilute aqueous alkaline solution after ultraviolet ray exposure, is excellent in pot life, capable of preventing deposits from being generated in a cured coated film, capable of widening heat control tolerance, and is excellent in sensitivity, in heat resistance, in chemical resistance and in electric insulating properties, thereby rendering the composition suitable for use as a solder resist for producing a printed wiring board. This photosensitive resin composition comprises (A) an active energy ray-curable resin having at least two ethylenic unsaturated linkages per molecule thereof, (B) at least one kind material selected from acid salts of N-substituted melamine compound and acid salts of guanamine compound, (C) a photopolymerization initiator, (D) a diluent, and (E) a thermosetting compound. There is also disclosed a printed wiring board where this photosensitive resin composition is employed.

    摘要翻译： 公开了一种感光性树脂组合物，其可以在紫外线照射后使用稀碱水溶液显影，具有优异的适用期，能够防止在固化涂膜中产生沉积物，能够扩大耐热耐受性，并且优异 敏感性，耐热性，耐化学性和电绝缘性，从而使组合物适合用作制造印刷线路板的阻焊剂。 该感光性树脂组合物包含（A）每分子具有至少2个烯键式不饱和键的活性能量射线固化性树脂，（B）选自N-取代三聚氰胺化合物的酸式盐和胍胺化合物的酸盐中的至少一种 ，（C）光聚合引发剂，（D）稀释剂和（E）热固化性化合物。 还公开了使用该感光性树脂组合物的印刷电路板。

    Antenna system for portable radio apparatus
    10.
    发明授权
    Antenna system for portable radio apparatus 失效
    便携式无线电设备天线系统

    公开(公告)号：US5255001A

    公开(公告)日：1993-10-19

    申请号：US627455

    申请日：1990-12-14

    申请人： Yoshiharu Tamura ,  Takao Ono

    发明人： Yoshiharu Tamura ,  Takao Ono

    IPC分类号： H01Q1/08 ,  H01Q1/24 ,  H01Q1/50

    CPC分类号： H01Q1/242 ,  H01Q1/084 ,  H01Q1/243

    摘要： An antenna for a portable radio apparatus has a first antenna construction connected to the casing of the apparatus and a second antenna construction affixed to a base plate or earth plate which is incorporated in the casing. The first antenna construction has a movable joint which allows the first antenna construction to move between a first position where it is regarded as forming a part of the contour of the casing and a second position where it is protruded from the contour and regarded as being located in free space. The second antenna construction corrects the matching state of the first antenna construction such that adequate antenna radiation characteristics are set up in the first position. Optimal antenna characteristics are, therefore, achievable when the first antenna construction is in any one of the first and second positions.

    摘要翻译： 用于便携式无线电设备的天线具有连接到设备的壳体的第一天线结构和固定到底板或接地板的第二天线结构，其结合在壳体中。 第一天线结构具有可动接头，其允许第一天线结构在其被认为形成壳体的轮廓的一部分的第一位置和从轮廓突出并被认为位于的第二位置之间移动 在自由空间。 第二天线结构校正第一天线结构的匹配状态，使得在第一位置设置足够的天线辐射特性。 因此，当第一天线结构处于第一和第二位置中的任何一个时，最佳天线特性是可实现的。