公开(公告)号：US20150329740A1

公开(公告)日：2015-11-19

申请号：US14810631

申请日：2015-07-28

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kohichiro Kawate ,  Hiroko Akiyama ,  Naota Sugiyama ,  Brant U. Kolb ,  Eric G. Larson

IPC: C09D163/00 ,  C08K3/36 ,  H01L23/29

CPC classification number: H01L23/296 ,  C08K3/36 ,  C08K9/06 ,  C08L63/00 ,  H01L21/563 ,  H01L23/10 ,  H01L23/293 ,  H01L23/295 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.

Abstract translation: 本发明的半导体封装树脂组合物包括环氧树脂，固化剂，无机颗粒，用含有光聚合官能团的硅烷表面处理的纳米颗粒和光聚合引发剂。

公开(公告)号：US20140217622A1

公开(公告)日：2014-08-07

申请号：US14131827

申请日：2012-07-09

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kohichiro Kawate ,  Hiroko Akiyama ,  Naota Sugiyama ,  Brant U. Kolb ,  Eric G. Larson

IPC: H01L21/56 ,  H01L23/29

CPC classification number: H01L23/296 ,  C08K3/36 ,  C08K9/06 ,  C08L63/00 ,  H01L21/563 ,  H01L23/10 ,  H01L23/293 ,  H01L23/295 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.

Abstract translation: 本发明的半导体封装树脂组合物包括环氧树脂，固化剂，无机颗粒，用含有光聚合官能团的硅烷表面处理的纳米颗粒和光聚合引发剂。

公开(公告)号：US11124646B2

公开(公告)日：2021-09-21

申请号：US16320639

申请日：2017-07-24

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kohichiro Kawate

IPC: C09J163/00 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/373 ,  C08G59/18 ,  C08L63/04 ,  C08K5/00 ,  C08L33/06

Abstract: To provide a heat-dissipating resin composition, and cured product thereof, which can effectively transmit heat generated from a heat-generating part such as a semiconductor element or the like with a high heating value to an object such as a substrate, heat sink, shield can lid, housing, or the like, and reduce defects such as contact failure of a relay or connector, or the like. A heat-dissipating resin composition of an embodiment of the present disclosure includes: component (A): epoxy resin; component (B): curing agent for epoxy resin; component (C): (meth)acrylic oligomer with weight average molecular weight of 10,000 or less; and component (D): heat conductive particles.

公开(公告)号：US20210193099A1

公开(公告)日：2021-06-24

申请号：US17051873

申请日：2019-04-23

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kohichiro Kawate

IPC: G10K11/165 ,  C08K5/521 ,  C08K5/524 ,  C08L101/00 ,  C08K3/013 ,  C08K3/22

Abstract: An object of the present invention is to provide a vibration absorbing material having an improved followingness for an object to be applied and an improved convenience during use. The vibration absorbing material of the present invention is a pseudoplastic fluid comprising 40 parts by weight of a basic inorganic filler particle, a phosphate ester or a phosphite ester, and a binder.

公开(公告)号：US09281255B2

公开(公告)日：2016-03-08

申请号：US14435460

申请日：2013-10-29

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kohichiro Kawate

IPC: H01L23/488 ,  H01L23/29 ,  H01L21/30 ,  C08F2/46 ,  H01L21/56 ,  H01L25/00 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L21/78 ,  C09K5/14 ,  C08K3/22

CPC classification number: H01L23/293 ,  C08G59/226 ,  C08K3/22 ,  C08K2003/2227 ,  C08L63/00 ,  C08L2205/02 ,  C09K5/14 ,  H01L21/561 ,  H01L21/563 ,  H01L21/78 ,  H01L23/3157 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/29036 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: To provide a solid preapplication underfill material that has excellent workability, has a high degree of freedom for solder bonding processes, and enables the formation of a solder bond with high reliability. (Resolution Means) The underfill composition of the present disclosure contains a hardened epoxy resin and has a viscosity of 1000 Pa·s or more at 30° C. The hardening epoxy resin includes a crystalline epoxy resin at not less than 50 wt % relative to an entire resin composition.

Abstract translation: 为了提供具有优异的可加工性的固体预应用底层填充材料，具有焊接接合工艺的高自由度，并且能够以高可靠性形成焊料接合。 （分辨率）本发明的底部填充剂组合物含有硬化环氧树脂，在30℃下的粘度为1000Pa·s以上。硬化型环氧树脂包含结晶性环氧树脂，相对于 整个树脂组合物。

公开(公告)号：US20200181393A1

公开(公告)日：2020-06-11

申请号：US16320639

申请日：2017-07-24

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kohichiro Kawate

IPC: C08L63/04 ,  C08L33/06 ,  C08K5/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/373

Abstract: To provide a heat-dissipating resin composition, and cured product thereof, which can effectively transmit heat generated from a heat-generating part such as a semiconductor element or the like with a high heating value to an object such as a substrate, heat sink, shield can lid, housing, or the like, and reduce defects such as contact failure of a relay or connector, or the like. A heat-dissipating resin composition of an embodiment of the present disclosure includes: component (A): epoxy resin; component (B): curing agent for epoxy resin; component (C): (meth)acrylic oligomer with weight average molecular weight of 10,000 or less; and component (D): heat conductive particles.

公开(公告)号：US09773714B2

公开(公告)日：2017-09-26

申请号：US14810631

申请日：2015-07-28

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kohichiro Kawate ,  Hiroko Akiyama ,  Naota Sugiyama ,  Brant U. Kolb ,  Eric G. Larson

IPC: H01L23/29 ,  C08L63/00 ,  H01L23/10 ,  H01L21/56 ,  C08K3/36 ,  C08K9/06 ,  H01L33/56

CPC classification number: H01L23/296 ,  C08K3/36 ,  C08K9/06 ,  C08L63/00 ,  H01L21/563 ,  H01L23/10 ,  H01L23/293 ,  H01L23/295 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.

公开(公告)号：US20160007453A1

公开(公告)日：2016-01-07

申请号：US14770143

申请日：2014-02-25

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kohichiro Kawate

IPC: H05K1/03 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0366 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/0215 ,  H05K2201/0275 ,  H05K2201/029 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: Problem: To prepare a prepreg having high thermal conductivity and a low thermal expansion coefficient. Resolution Means: The prepreg of the present disclosure is composed of a composite layer including an alumina-containing cloth including ceramic fibers and a thermosetting resin composition impregnated into the alumina-containing cloth and having a thermal conductivity coefficient greater than or equal to 1.0 W/(mK).

Abstract translation: 问题：制备具有高热导率和低热膨胀系数的预浸料。 分解方法：本公开的预浸料由包含含有陶瓷纤维的含氧化铝布和浸渍在含氧化铝的布中的热固性树脂组合物的复合层构成，其导热系数大于或等于1.0W / （mK）。

公开(公告)号：US20150332984A1

公开(公告)日：2015-11-19

申请号：US14435460

申请日：2013-10-29

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kohichiro Kawate

IPC: H01L23/29 ,  H01L25/00 ,  H01L23/31 ,  C08K3/22 ,  H01L25/065 ,  H01L21/78 ,  C09K5/14 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/293 ,  C08G59/226 ,  C08K3/22 ,  C08K2003/2227 ,  C08L63/00 ,  C08L2205/02 ,  C09K5/14 ,  H01L21/561 ,  H01L21/563 ,  H01L21/78 ,  H01L23/3157 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/29036 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: To provide a solid preapplication underfill material that has excellent workability, has a high degree of freedom for solder bonding processes, and enables the formation of a solder bond with high reliability. (Resolution Means) The underfill composition of the present disclosure contains a hardened epoxy resin and has a viscosity of 1000 Pa·s or more at 30° C. The hardening epoxy resin includes a crystalline epoxy resin at not less than 50 wt % relative to an entire resin composition.

Abstract translation: 为了提供具有优异的可加工性的固体预应用底层填充材料，具有焊接接合工艺的高自由度，并且能够以高可靠性形成焊料接合。 （分辨率）本发明的底部填充剂组合物含有硬化环氧树脂，在30℃下的粘度为1000Pa·s以上。硬化型环氧树脂包含结晶性环氧树脂，相对于 整个树脂组合物。