公开(公告)号：US20220072664A1

公开(公告)日：2022-03-10

申请号：US17309818

申请日：2019-12-26

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Ranjit PANDHER ,  Niveditha NAGARAJAN ,  Anil KUMAR ,  Morgana de Avila RIBAS ,  Gyan DUTT ,  Siuli SARKAR ,  Carl BILGRIEN

IPC: B23K35/26 ,  C22C13/00

Abstract: A lead-free solder alloy comprising: from 1 to 9 wt. % copper, at least one of: from greater than 0 to 1 wt. % nickel, from greater than 0 to 10 wt. % germanium, from greater than 0 to 10 wt. % manganese, from greater than 0 to 10 wt. % aluminium, from greater than 0 to 10 wt. % silicon, from greater than 0 to 9 wt. % bismuth, from greater than 0 to 5 wt. % indium, from greater than 0 to 1 wt. % titanium, from greater than 0 to 2 wt. % lanthanum, from greater than 0 to 2 wt. % neodymium, optionally one or more of: up to 1 wt. % for chromium, gallium, cobalt, iron, phosphorous, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium; up to 5 wt. % silver, up to 1 wt. % zinc, up to 2 wt. % rare earth metals, excluding lanthanum and neodymium, and the balance tin together with any unavoidable impurities.

公开(公告)号：US20240198460A1

公开(公告)日：2024-06-20

申请号：US18555829

申请日：2022-04-14

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Ranjit PANDHER ,  Niveditha NAGARAJAN ,  Girard SIDONE ,  Carl BILGRIEN

IPC: B23K35/02 ,  B23K1/19 ,  B23K35/26 ,  B23K35/30

CPC classification number: B23K35/0238 ,  B23K1/19 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/3093

Abstract: A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.

公开(公告)号：US20220371089A1

公开(公告)日：2022-11-24

申请号：US17754125

申请日：2020-09-24

Applicant: Alpha Assembly Solutions Inc.

Inventor： Shamik GHOSHAL ,  Nirmalya Kumar CHAKI ,  Remya CHANDRAN ,  Manoharan VENODH ,  Bawa SINGH ,  Barun DAS ,  Niveditha NAGARAJAN ,  Rahul RAUT ,  Oscar KHASELEV ,  Ranjit PANDHER ,  Supriya DEVARAJAN ,  Anubhav RUSTOGI

IPC: B22F7/04 ,  B22F1/107 ,  B22F9/30 ,  H05K1/09 ,  H05K3/12 ,  H01B13/012 ,  H05K3/34 ,  H01L23/00 ,  H01B1/02 ,  B23K35/30

Abstract: A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.

公开(公告)号：US20230374289A1

公开(公告)日：2023-11-23

申请号：US18247996

申请日：2021-10-07

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Nirmalya Kumar CHAKI ,  Chetan Pravinchandra SHAH ,  Bawa SINGH ,  Rahul RAUT ,  Vasuki Srinivas KAUSHIK ,  Ranjit PANDHER ,  Niveditha NAGARAJAN ,  Sandeesh M KUMAR ,  Anubhav RUSTOGI

IPC: C08L61/28 ,  C08K7/18 ,  C09D11/103 ,  C09D11/104 ,  C09J183/04 ,  C09D11/033 ,  C09J11/08

CPC classification number: C08L61/28 ,  C08K7/18 ,  C09D11/103 ,  C09D11/104 ,  C09J183/04 ,  C09D11/033 ,  C09J11/08 ,  C08L2205/035 ,  C08L2312/00 ,  C08L2201/50 ,  C08L2201/52 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/006

Abstract: A composition for use in the manufacture of an in-mould electronic (IME) component, the composition containing a binder comprising: a cross-linking agent comprising melamine formaldehyde, a thermoplastic resin comprising a hydroxyl group, and a solvent.

公开(公告)号：US20230146579A1

公开(公告)日：2023-05-11

申请号：US17755193

申请日：2020-10-20

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Ranjit PANDHER ,  Niveditha NAGARAJAN ,  Girard SIDONE ,  Carl BILGRIEN

IPC: B23K35/30 ,  H01L23/00 ,  B23K1/00 ,  B23K35/40

CPC classification number: B23K35/302 ,  H01L24/29 ,  B23K1/0016 ,  B23K35/404 ,  B23K2101/40

Abstract: A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.