公开(公告)号：US11784296B2

公开(公告)日：2023-10-10

申请号：US17564065

申请日：2021-12-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi Wu ,  Lu-Ming Lai ,  Yu-Ying Lee ,  Yung-Yi Chang

IPC: H01L33/62 ,  H01L33/48 ,  B81C1/00 ,  B81B7/00 ,  H01L33/60

CPC classification number: H01L33/62 ,  B81C1/00269 ,  H01L33/483 ,  B81B7/007 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2933/0066 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

公开(公告)号：US11565934B2

公开(公告)日：2023-01-31

申请号：US16734060

申请日：2020-01-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Hsuan Tsai ,  Lu-Ming Lai ,  Chien-Wei Fang ,  Ching-Han Huang

IPC: B81B7/00 ,  B81C1/00

Abstract: A semiconductor package structure includes a die paddle, a plurality of leads, an electronic component and a package body. Each of the plurality of leads is separated from the die paddle and has an inner side surface facing the die paddle. The electronic component is disposed on the die paddle. The package body covers the die paddle, the plurality of leads and the electronic component. The package body is in direct contact with a bottom surface of the die paddle and the inner side surface of the plurality of leads.

公开(公告)号：US11495511B2

公开(公告)日：2022-11-08

申请号：US17006664

申请日：2020-08-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Che Huang ,  Lu-Ming Lai ,  Ying-Chung Chen

IPC: H01L23/32 ,  H01L23/498 ,  H01L21/48

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a semiconductor package device, a first constraint structure and a second constraint structure. The first constraint structure is connected to the semiconductor package device. The second constraint structure is connected to the semiconductor package device and under a projection of the semiconductor package device.

公开(公告)号：US11296651B2

公开(公告)日：2022-04-05

申请号：US17074618

申请日：2020-10-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng Tseng ,  Lu-Ming Lai ,  Ching-Han Huang ,  Hui-Chung Liu ,  Kuo-Hua Lai ,  Cheng-Ling Huang

IPC: H03B5/04 ,  H01L23/13 ,  H01L23/00 ,  H01L23/36 ,  H03B5/30 ,  H01L23/14 ,  B81B7/00 ,  H03B5/36 ,  H03L1/04 ,  H03B1/02

Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.

公开(公告)号：US11276720B2

公开(公告)日：2022-03-15

申请号：US16670836

申请日：2019-10-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Chieh Tang ,  Lu-Ming Lai ,  Chia Yun Hsu

IPC: H01L27/146

Abstract: An optical package includes a substrate, an image sensor, a microlens, an optical filter layer, a constraining layer, and a buffer layer. The image sensor is disposed on the substrate. The microlens having a first Young's modulus is disposed on the image sensor. The optical filter layer having a second Young's modulus disposed on the microlens. The constraining layer is disposed between the optical filter layer and the microlens. The buffer layer having a third Young's modulus disposed on the constraining layer. The third Young's modulus is greater than the first Young's modulus and smaller than the second Young's modulus.

公开(公告)号：US10782184B2

公开(公告)日：2020-09-22

申请号：US15687090

申请日：2017-08-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Min Peng ,  Ching-Han Huang ,  Lu-Ming Lai

IPC: G01J1/04

Abstract: The present disclosure relates to an optical device. The optical device comprises an electronic component, a plurality of light conducting pillars and an opaque layer. The electronic component includes a plurality of pixels. Each of the light conducting pillars is disposed over a corresponding pixel of the plurality of pixels of the electronic component. The opaque layer covers a lateral surface of each of the light conducting pillars.

公开(公告)号：US10689249B2

公开(公告)日：2020-06-23

申请号：US14855684

申请日：2015-09-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ching-Han Huang ,  Hsun-Wei Chan ,  Lu-Ming Lai

IPC: B81B7/00

Abstract: A semiconductor device package includes a carrier, a wall disposed on a top surface of the carrier, a cover, and a sensor element. The cover includes a portion protruding from a bottom surface of the cover, where the protruding portion of the cover contacts a top surface of the wall to define a space. The sensor element is positioned in the space.

公开(公告)号：US09977147B2

公开(公告)日：2018-05-22

申请号：US14975036

申请日：2015-12-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ruei-Bin Ma ,  Ying-Chung Chen ,  Lu-Ming Lai

IPC: H01L31/16 ,  H01L25/16 ,  G01V8/12 ,  H01L31/167

CPC classification number: G01V8/12 ,  H01L25/167 ,  H01L31/167 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An optical module includes a carrier, a light-emitting component disposed over the carrier, an optical sensor disposed over the carrier, a housing, and a lens. The housing is disposed over the carrier and encircles the light-emitting component and the optical sensor. The housing defines a first accommodation space including a first aperture and a second aperture below the first aperture. The housing includes a first sidewall surrounding the first aperture, a second sidewall surrounding the second aperture, and a first support portion where a bottom end of the first sidewall and a top end of the second sidewall meet. The lens is located in the first aperture and is supported by the first support portion. One of the light-emitting component or the optical sensor is located in the first accommodation space.

公开(公告)号：US12184266B2

公开(公告)日：2024-12-31

申请号：US18112464

申请日：2023-02-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng Tseng ,  Lu-Ming Lai ,  Ching-Han Huang ,  Kuo-Hua Lai ,  Hui-Chung Liu

IPC: H03L1/04 ,  H03H3/007 ,  H03H9/05 ,  H03H9/08 ,  H03H9/10 ,  H03H9/24 ,  H03L1/02

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

公开(公告)号：US12168605B2

公开(公告)日：2024-12-17

申请号：US17330245

申请日：2021-05-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Liang Hsiao ,  Lu-Ming Lai ,  Ching-Han Huang ,  Chia-Hung Shen

IPC: B81C3/00 ,  B81C1/00

Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.