公开(公告)号：US20220169905A1

公开(公告)日：2022-06-02

申请号：US17493247

申请日：2021-10-04

Applicant: Alpha Assembly Solutions Inc.

Inventor： Shamik Ghosal ,  Ranjit Pandher ,  Oscar Khaselev ,  Ravi Bhatkal ,  Rahul Raut ,  Bawa Singh ,  Morgana de Avila Ribas ,  Siuli Sarkar ,  Sutapa Mukherjee ,  Sathish Kumar ,  Remya Chandran ,  Pavan Vishwanath ,  Ashok Pachamuthu ,  Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Nirmalya Kumar Chaki

IPC: C09K5/14 ,  C01G5/00 ,  C09C1/62 ,  C09C3/08 ,  B82Y30/00 ,  B22F1/05 ,  B22F1/16 ,  B22F1/052 ,  B22F1/102

Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

公开(公告)号：US20190194517A1

公开(公告)日：2019-06-27

申请号：US16289789

申请日：2019-03-01

Applicant: Alpha Assembly Solutions Inc.

Inventor： Shamik Ghosal ,  Ranjit Pandher ,  Oscar Khaselev ,  Ravi Bhatkal ,  Rahul Raut ,  Bawa Singh ,  Morgana de Avila Ribas ,  Siuli Sarkar ,  Sutapa Mukherjee ,  Sathish Kumar ,  Remya Chandran ,  Pavan Vishwanath ,  Ashok Pachamuthu ,  Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Nirmalya Kumar Chaki

IPC: C09K5/14 ,  B22F1/02 ,  B22F1/00 ,  C09C3/08 ,  B82Y30/00 ,  C01G5/00 ,  C09C1/62

CPC classification number: C09K5/14 ,  B22F1/0011 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/0074 ,  B22F1/02 ,  B22F2001/0066 ,  B82Y30/00 ,  C01G5/00 ,  C01P2002/72 ,  C01P2002/88 ,  C01P2004/04 ,  C01P2004/53 ,  C01P2004/61 ,  C01P2004/64 ,  C01P2006/22 ,  C01P2006/32 ,  C01P2006/40 ,  C09C1/62 ,  C09C3/08 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

公开(公告)号：US20230330788A1

公开(公告)日：2023-10-19

申请号：US18205590

申请日：2023-06-05

Applicant: Alpha Assembly Solutions Inc.

Inventor： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Anil Kumar ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravi Bhatkal ,  Bawa Singh

IPC: B23K35/02 ,  B23K1/012 ,  B23K1/005 ,  B23K35/26 ,  B23K1/08 ,  B23K1/00 ,  H05K3/34 ,  C22C13/02 ,  B23K1/20 ,  B23K1/002 ,  B23K1/19 ,  C22C13/00

CPC classification number: B23K35/262 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0056 ,  B23K1/012 ,  B23K1/085 ,  B23K1/19 ,  B23K1/203 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3457 ,  H05K3/3463 ,  B23K2103/12 ,  Y10T403/479

Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt.% of silver, 2.5 to 4 wt.% of bismuth, 0.3 to 0.8 wt.% of copper, 0.03 to 1 wt.% nickel, 0.005 to 1 wt.% germanium, and a balance of tin, together with any unavoidable impurities.

公开(公告)号：US11162007B2

公开(公告)日：2021-11-02

申请号：US16289789

申请日：2019-03-01

Applicant: Alpha Assembly Solutions Inc.

Inventor： Shamik Ghosal ,  Ranjit Pandher ,  Oscar Khaselev ,  Ravi Bhatkal ,  Rahul Raut ,  Bawa Singh ,  Morgana de Avila Ribas ,  Siuli Sarkar ,  Sutapa Mukherjee ,  Sathish Kumar ,  Remya Chandran ,  Pavan Vishwanath ,  Ashok Pachamuthu ,  Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Nirmalya Kumar Chaki

IPC: C09K5/14 ,  B22F1/00 ,  B22F1/02 ,  C01G5/00 ,  C09C1/62 ,  C09C3/08 ,  B82Y30/00

Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

公开(公告)号：US11139089B2

公开(公告)日：2021-10-05

申请号：US16887455

申请日：2020-05-29

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Bawa Singh ,  Ravi Bhatkal ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/00 ,  B22F1/02 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12 ,  H05K1/18

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US11830640B2

公开(公告)日：2023-11-28

申请号：US17382980

申请日：2021-07-22

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Bawa Singh ,  Ravi Bhatkal ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/17 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12 ,  H05K1/18

CPC classification number: H01B1/22 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B22F1/17 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/362 ,  B23K35/3613 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/1241 ,  B22F2301/255 ,  B22F2302/45 ,  B22F2304/10 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/0203 ,  H05K2201/0245 ,  H05K2201/10106

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US10672531B2

公开(公告)日：2020-06-02

申请号：US15326224

申请日：2015-07-14

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Bawa Singh ,  Ravi Bhatkal ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/00 ,  B22F1/02 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12 ,  H05K1/18

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US12278022B2

公开(公告)日：2025-04-15

申请号：US18376896

申请日：2023-10-05

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Bawa Singh ,  Ravi Bhatkal ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01B1/22 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B22F1/17 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K1/09 ,  H05K1/18 ,  H05K3/12

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US11090768B2

公开(公告)日：2021-08-17

申请号：US14698450

申请日：2015-04-28

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Anil Kumar ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravi Bhatkal ,  Bawa Singh

IPC: B23K1/00 ,  B23K1/19 ,  C22C13/00 ,  C22C13/02 ,  B23K35/26 ,  H05K3/34 ,  B23K35/02 ,  B23K1/012 ,  B23K1/08 ,  B23K1/002 ,  B23K1/005 ,  B23K1/20 ,  B23K103/12

Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.

公开(公告)号：US10259980B2

公开(公告)日：2019-04-16

申请号：US14438888

申请日：2013-10-29

Applicant: Alpha Assembly Solutions Inc.

Inventor： Shamik Ghosal ,  Ranjit Pandher ,  Oscar Khaselev ,  Ravi Bhatkal ,  Rahul Raut ,  Bawa Singh ,  Morgana Ribas ,  Siuli Sarkar ,  Sutapa Mukherjee ,  Sathish Kumar ,  Remya Chandran ,  Pavan Vishwanath ,  Ashok Pachamuthu ,  Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Nirmalya Kumar Chaki

IPC: B22F1/00 ,  B22F1/02 ,  C01G5/00 ,  C09C1/62 ,  C09C3/08 ,  C09K5/14 ,  B82Y30/00

Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.