公开(公告)号：US20240329322A1

公开(公告)日：2024-10-03

申请号：US18625979

申请日：2024-04-03

Applicant: Applied Materials, Inc.

Inventor： Jinyu LU ,  Ludovic Godet ,  Jinxin FU ,  Kenichi OHNO ,  Shangyi Chen ,  Takashi KURATOMI ,  Erica CHEN ,  Rami HURARNI ,  Yangyang SUN

IPC: G02B6/34 ,  C23C16/40 ,  C23C16/455

CPC classification number: G02B6/34 ,  C23C16/403 ,  C23C16/45553

Abstract: Embodiments described herein relate to improved waveguides with materials layers improving the optical properties of one or more surface regions of waveguides and methods of forming the same. In one embodiment, a waveguide is provided. The waveguide including a substrate, a grating disposed in or on the substrate, the grating comprising a plurality of structures defined by a plurality of trenches, a layer of silicon oxide or aluminum oxide disposed over the structures on the substrate. The layer is disposed over sidewalls and top surfaces of the structures, and a bottom surface of the trenches. The waveguide further includes a high index layer disposed over the layer. The high index layer is disposed over the sidewalls and the top surfaces of the structures, and the bottom surface of the trenches with the layer disposed in between the structures and the high index layer.

公开(公告)号：US12085475B2

公开(公告)日：2024-09-10

申请号：US17771557

申请日：2020-12-14

Applicant: Applied Materials, Inc.

Inventor： Yongan Xu ,  Chan Juan Xing ,  Jinxin Fu ,  Ludovic Godet

IPC: G01M11/00

CPC classification number: G01M11/30

Abstract: A method and apparatus for determining a line angle and a line angle rotation of a grating or line feature is disclosed. An aspect of the present disclosure involves, measuring coordinate points of a first line feature using a measurement tool, determining a first slope of the first line feature from the coordinate points, and determining a first line angle from the slope of the first line feature. This process can be repeated to find a second slope of a second line feature that is adjacent to the first line feature. The slope of the first and second line features can be compared to find a line angle rotation. The line angle rotation is compared to a design specification and a stitch quality is determined.

公开(公告)号：US12060297B2

公开(公告)日：2024-08-13

申请号：US17466803

申请日：2021-09-03

Applicant: Applied Materials, Inc.

Inventor： Yongan Xu ,  Chien-An Chen ,  Ludovic Godet

IPC: B32B15/04 ,  B32B17/06 ,  C03C17/36 ,  C03C17/38

CPC classification number: C03C17/3639 ,  C03C17/3626 ,  C03C17/3636 ,  C03C17/3655 ,  C03C17/38 ,  C03C2217/213 ,  C03C2218/365

Abstract: Aspects of the present disclosure relate generally to methods and apparatus of processing transparent substrates, such as glass substrates. In one implementation, a film stack for optical devices includes a glass substrate including a first surface and a second surface. The film stack includes a device function layer formed on the first surface, a hard mask layer formed on the device function layer, and a substrate recognition layer formed on the hard mask layer. The hard mask layer includes one or more of chromium, ruthenium, or titanium nitride. The film stack includes a backside layer formed on the second surface. The backside layer formed on the second surface includes one or more of a conductive layer or an oxide layer.

公开(公告)号：US12021102B2

公开(公告)日：2024-06-25

申请号：US18185863

申请日：2023-03-17

Applicant: Applied Materials, Inc.

Inventor： Jinxin Fu ,  Yongan Xu ,  Ludovic Godet ,  Naamah Argaman ,  Robert Jan Visser

IPC: H01L27/146 ,  G02B1/00 ,  G02B27/00 ,  H04N5/265 ,  H04N23/16 ,  H04N25/13 ,  H04N25/611 ,  H04N25/76

CPC classification number: H01L27/14627 ,  G02B1/002 ,  G02B27/005 ,  H01L27/14621 ,  H04N5/265 ,  H04N23/16 ,  H04N25/134 ,  H04N25/611 ,  H04N25/76

Abstract: An imaging system and a method of creating composite images are provided. The imaging system includes one or more lens assemblies coupled to a sensor. When reflected light from an object enters the imaging system, incident light on the metalens filter systems creates filtered light, which is turned into composite images by the corresponding sensors. Each metalens filter system focuses the light into a specific wavelength, creating the metalens images. The metalens images are sent to the processor, wherein the processor combines the metalens images into one or more composite images. The metalens images are combined into a composite image, and the composite image has reduced chromatic aberrations.

公开(公告)号：US11977246B2

公开(公告)日：2024-05-07

申请号：US18120520

申请日：2023-03-13

Applicant: Applied Materials, Inc.

Inventor： Yongan Xu ,  Rutger Meyer Timmerman Thijssen ,  Jinrui Guo ,  Ludovic Godet

IPC: G02B5/18 ,  G03F1/42 ,  G03F7/00 ,  G03F7/20

CPC classification number: G02B5/1857 ,  G03F1/42 ,  G03F7/201 ,  G03F7/70775 ,  G03F7/2002

Abstract: A method of forming patterned features on a substrate is provided. The method includes positioning a plurality of masks arranged in a mask layout over a substrate. The substrate is positioned in a first plane and the plurality of masks are positioned in a second plane, the plurality of masks in the mask layout have edges that each extend parallel to the first plane and parallel or perpendicular to an alignment feature on the substrate, the substrate includes a plurality of areas configured to be patterned by energy directed through the masks arranged in the mask layout. The method further includes directing energy towards the plurality of areas through the plurality of masks arranged in the mask layout over the substrate to form a plurality of patterned features in each of the plurality of areas.

公开(公告)号：US11892676B2

公开(公告)日：2024-02-06

申请号：US17647535

申请日：2022-01-10

Applicant: Applied Materials, Inc.

Inventor： Rutger Meyer Timmerman Thijssen ,  Ludovic Godet

IPC: G02B5/18 ,  F21V8/00 ,  B29D11/00

CPC classification number: G02B6/0065 ,  B29D11/00317 ,  G02B5/1857

Abstract: Embodiments described herein provide for methods of forming angled optical device structures. The methods described herein utilize etching a mandrel material with an etch chemistry that is selective to the hardmask, i.e., the mandrel material is etched at a higher rate than the hardmask. Therefore, mandrel trenches are formed in the mandrel material. Device material of the angled optical device structures to be formed is deposited on the plurality of angled mandrels. An angled etch process is performed on portions of the device material such that the angled optical device structures are formed.

公开(公告)号：US11626321B2

公开(公告)日：2023-04-11

申请号：US16882177

申请日：2020-05-22

Applicant: Applied Materials, Inc.

Inventor： Ludovic Godet ,  Wayne McMillan ,  Rutger Meyer Timmerman Thijssen ,  Naamah Argaman ,  Tapashree Roy ,  Sage Toko Garrett Doshay

IPC: H01L21/768 ,  H01L21/3213 ,  H01L21/311 ,  H01L25/04 ,  H01L25/16

Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.

公开(公告)号：US11614685B2

公开(公告)日：2023-03-28

申请号：US17545554

申请日：2021-12-08

Applicant: Applied Materials, Inc.

Inventor： Ludovic Godet ,  Chien-An Chen ,  Brian Alexander Cohen ,  Wayne McMillan ,  Ian Matthew McMackin

IPC: G03F7/00 ,  H01L21/311 ,  G02B6/34

Abstract: Methods for patterning of multi-depth layers for the fabrication of optical devices are provided. In one embodiment, a method is provided that includes disposing a resist layer over a device layer disposed over a top surface of a substrate, the device layer having a first portion and a second portion, patterning the resist layer to form a first resist layer pattern having a plurality of first openings and a second resist layer pattern having a plurality of second openings, and etching exposed portions of the device layer defined by the plurality of first openings and the plurality of second openings, wherein the plurality of first openings are configured to form at least a portion of a plurality of first structures within the optical device, and the plurality of second openings are configured to form at least a portion of a plurality of second structures within the optical device.

公开(公告)号：US11610925B2

公开(公告)日：2023-03-21

申请号：US16859708

申请日：2020-04-27

Applicant: Applied Materials, Inc.

Inventor： Jinxin Fu ,  Yongan Xu ,  Ludovic Godet ,  Naamah Argaman ,  Robert Jan Visser

IPC: H01L27/146 ,  G02B1/00 ,  G02B27/00 ,  H04N5/374

Abstract: An imaging system and a method of creating composite images are provided. The imaging system includes one or more lens assemblies coupled to a sensor. When reflected light from an object enters the imaging system, incident light on the metalens filter systems creates filtered light, which is turned into composite images by the corresponding sensors. Each metalens filter system focuses the light into a specific wavelength, creating the metalens images. The metalens images are sent to the processor, wherein the processor combines the metalens images into one or more composite images. The metalens images are combined into a composite image, and the composite image has reduced chromatic aberrations.

公开(公告)号：US11473191B2

公开(公告)日：2022-10-18

申请号：US16395005

申请日：2019-04-25

Applicant: Applied Materials, Inc.

Inventor： Tapashree Roy ,  Rutger Meyer Timmerman Thijssen ,  Ludovic Godet ,  Jinxin Fu

IPC: C23C16/02 ,  C23C16/40 ,  C23C16/04

Abstract: A method for creating a flat optical structure is disclosed, having steps of providing a substrate, etching at least one nanotrench in the substrate, placing a dielectric material in the at least one nanotrench in the substrate and encapsulating a top of the substrate with a film.