公开(公告)号：US09576710B2

公开(公告)日：2017-02-21

申请号：US14820558

申请日：2015-08-07

Applicant: Roger Hsieh ,  Cheng-Chang Lee ,  Chun-Tiao Liu ,  Yi-Min Huang ,  Chih-Siang Chuang

Inventor： Roger Hsieh ,  Cheng-Chang Lee ,  Chun-Tiao Liu ,  Yi-Min Huang ,  Chih-Siang Chuang

IPC: H01F7/06 ,  H01F5/00 ,  H01F41/10 ,  H01F41/02 ,  H01F27/00 ,  H01F17/04 ,  H01F27/02 ,  H01F27/29 ,  H05K3/30

CPC classification number: H01F27/29 ,  H01F5/00 ,  H01F5/003 ,  H01F7/06 ,  H01F17/04 ,  H01F27/00 ,  H01F27/022 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/292 ,  H01F41/0206 ,  H01F41/10 ,  H05K3/301 ,  Y10T29/302 ,  Y10T29/49073 ,  Y10T29/49075

Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.

Abstract translation: 磁性装置包括引线框架，第一芯体和线圈。 引线框架具有与第一部分间隔开的第一部分和第二部分。 第一芯体设置在引线框架上，其中第一芯体包括第一通孔和第二通孔。 线圈设置在第一芯体上，其中线圈具有第一端子和第二端子，其中第一部分经由第一通孔与第一端子电连接，并且第二部分与第二端子电连接 分别通过第二通孔。

公开(公告)号：US09271398B2

公开(公告)日：2016-02-23

申请号：US13481887

申请日：2012-05-28

Applicant: Da-Jung Chen ,  Chun-Tiao Liu

Inventor： Da-Jung Chen ,  Chun-Tiao Liu

IPC: H05K7/18 ,  H05K1/18 ,  H01L23/64 ,  H01L25/16 ,  H01F27/02 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01F27/027 ,  H01L23/645 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/4902 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A power-supply module includes at least one power-supply component, an inductor and a package. The inductor is disposed over the at least one power-supply components, and the at least a power-supply component and the inductor are disposed within the package. Besides, the power-supply module further comprises a printed circuit board, and the at least one power-supply component and the inductor are mounted to the printed circuit board. Moreover, the inductor comprises a plurality of leads that support the inductor over the at least one power-supply component.

Abstract translation: 电源模块包括至少一个电源组件，电感器和封装。 电感器设置在至少一个电源部件上，并且至少一个电源部件和电感器设置在封装内。 此外，电源模块还包括印刷电路板，并且至少一个电源部件和电感器安装到印刷电路板。 此外，电感器包括多个引线，其在至少一个电源部件上支撑电感器。

公开(公告)号：US09001527B2

公开(公告)日：2015-04-07

申请号：US13485954

申请日：2012-06-01

Applicant: Da-Jung Chen ,  Chun-Tiao Liu ,  Bau-Ru Lu

Inventor： Da-Jung Chen ,  Chun-Tiao Liu ,  Bau-Ru Lu

IPC: H05K5/02 ,  H05K1/18 ,  H01L23/64 ,  H01L25/16 ,  H01F27/02 ,  H05K3/34 ,  H01L23/24 ,  H01L23/31 ,  H01L23/552

CPC classification number: H05K1/181 ,  H01F27/022 ,  H01F27/027 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

Abstract translation: 本发明公开了一种电子封装结构。 本体具有其上具有空腔的顶表面，第一导电元件设置在空腔中，并且第二导电元件设置在主体中。 电连接到第一导电元件的第一外部电极和与第二导电元件电连接的第二外部电极都设置在主体的顶表面上或由封装化合物的顶表面形成的第一表面和暴露部分 的未被封装化合物覆盖的身体的顶表面。

公开(公告)号：US20120236519A1

公开(公告)日：2012-09-20

申请号：US13485954

申请日：2012-06-01

Applicant: Da-Jung Chen ,  Chun-Tiao Liu ,  BAU-RU LU

Inventor： Da-Jung Chen ,  Chun-Tiao Liu ,  BAU-RU LU

IPC: H05K5/00 ,  H05K3/30

CPC classification number: H05K1/181 ,  H01F27/022 ,  H01F27/027 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

Abstract translation: 本发明公开了一种电子封装结构。 本体具有其上具有空腔的顶表面，第一导电元件设置在空腔中，并且第二导电元件设置在主体中。 电连接到第一导电元件的第一外部电极和与第二导电元件电连接的第二外部电极都设置在主体的顶表面上或由封装化合物的顶表面形成的第一表面和暴露部分 的未被封装化合物覆盖的身体的顶表面。

公开(公告)号：US20110057761A1

公开(公告)日：2011-03-10

申请号：US12875771

申请日：2010-09-03

Applicant: Chung-Hsiung Wang ,  Hung-Ming Lin ,  Wen-Shiang Luo ,  Chun-Tiao Liu ,  Kuo-Shu Chen

Inventor： Chung-Hsiung Wang ,  Hung-Ming Lin ,  Wen-Shiang Luo ,  Chun-Tiao Liu ,  Kuo-Shu Chen

IPC: H01H85/48

CPC classification number: H01H85/48 ,  H01H69/022 ,  H01H85/0047 ,  H01H85/0241 ,  H01H85/0411 ,  H01H85/046 ,  H01H85/048 ,  H01H85/11 ,  H01H2085/0283 ,  H01H2085/466

Abstract: A protective device including a substrate, a conductive section and a bridge element is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The bridge element spans across the metal element in a direction across direction of current flow in the metal element, wherein the bridge element facilitates breaking of the metal element upon melting.

Abstract translation: 提供了包括基板，导电部分和桥接元件的保护装置。 导电部分由衬底支撑，其中导电部分包括电连接在第一和第二电极之间的金属元件。 金属元件用作熔点低于第一和第二电极的熔点的牺牲结构。 桥接元件跨过金属元件横跨金属元件中的电流流动方向穿过金属元件，其中桥接元件有助于熔化时金属元件的断裂。

公开(公告)号：US20100102917A1

公开(公告)日：2010-04-29

申请号：US12683448

申请日：2010-01-07

Applicant: Chun-Tiao Liu ,  Gwo-Tswin Wu ,  Roger Hsieh ,  Wen-Hsiung Liao

Inventor： Chun-Tiao Liu ,  Gwo-Tswin Wu ,  Roger Hsieh ,  Wen-Hsiung Liao

IPC: H01F17/04

CPC classification number: H01F17/04 ,  H01F27/027 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/292 ,  H01F2017/046 ,  H01F2017/048

Abstract: An inductor includes a first core, a second core, a protruding structure, at least two gaps and a conducting wire. The first core has a protruding portion. The second core is disposed opposite to the first core. The protruding structure protrudes from the protruding portion of the first core and toward the second core. The at least two gaps are between the protruding portion of the first core and the second core. The conducting wire winds around at least one of the first and second cores. The conducting wire has a specific resistance value of 1.42 μΩm or lower.

Abstract translation: 电感器包括第一芯，第二芯，突出结构，至少两个间隙和导线。 第一芯具有突出部分。 第二芯与第一芯相对设置。 突出结构从第一芯的突出部分朝向第二芯突出。 所述至少两个间隙位于所述第一芯和所述第二芯的突出部分之间。 导线缠绕在第一和第二芯中的至少一个上。 导线的电阻值为1.42μ＆OHgr，m以下。

公开(公告)号：US07667565B2

公开(公告)日：2010-02-23

申请号：US11156361

申请日：2005-06-20

Applicant: Chun-Tiao Liu

Inventor： Chun-Tiao Liu

IPC: H01F5/00

CPC classification number: H01F17/04 ,  H01F27/027 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/292 ,  H01F2017/046 ,  H01F2017/048

Abstract: This invention discloses an inductor that includes a conducting wire composed of an alloy having temperature coefficients of resistance (TCR) 700 ppm/° C. or lower. The inductive coil has a winding configuration provided for enclosure in a substantially rectangular box with a mid-plane extended along an elongated direction of the rectangular box wherein the conducting wire intersecting at least twice near said mid-plane.

Abstract translation: 本发明公开了一种电感器，其包括由耐温系数（TCR）为700ppm /℃以下的合金构成的导线。 感应线圈具有绕组配置，其被设置为围绕在基本矩形的盒子中，其具有沿矩形盒的细长方向延伸的中间平面，其中导线在所述中间平面附近至少两次相交。

公开(公告)号：US20080303125A1

公开(公告)日：2008-12-11

申请号：US11847351

申请日：2007-08-30

Applicant: DA-JUNG CHEN ,  Chun-Tiao Liu ,  Chau-Chun Wen

Inventor： DA-JUNG CHEN ,  Chun-Tiao Liu ,  Chau-Chun Wen

IPC: H01L23/495

CPC classification number: H01L23/495 ,  H01L23/49555 ,  H01L23/49575 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The shielding layer is disposed between the control component and at least part of the magnetic body to inhibit or reduce EMI (Electro-Magnetic Interference) from the energy storage element and to get a tiny package structure. The three-dimensional package structure is applicable to a POL (Point of Load) converter.

Abstract translation: 三维封装结构包括能量存储元件，半导体封装体和屏蔽层。 半导体封装主体具有多个第二导电元件和至少一个控制装置。 储能元件设置在半导体封装主体上。 包括磁性体的能量存储元件电连接到第二导电元件。 半导体封装体或能量存储元件具有多个第一导电元件以与外部器件电连接。 屏蔽层设置在控制部件和磁体的至少一部分之间以抑制或减少来自能量存储元件的EMI（电磁干扰）并获得微小的封装结构。 三维封装结构适用于POL（负载点）转换器。

公开(公告)号：US20060049907A1

公开(公告)日：2006-03-09

申请号：US11156361

申请日：2005-06-20

Applicant: Chun-Tiao Liu

Inventor： Chun-Tiao Liu

IPC: H01F5/00

CPC classification number: H01F17/04 ,  H01F27/027 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/292 ,  H01F2017/046 ,  H01F2017/048

Abstract: This invention discloses an inductor that includes a conducting wire composed of an alloy having temperature coefficients of resistance (TCR) approximately 0.0002 milliohm per Celsius degree or is lower. The inductive coil has a winding configuration provided for enclosure in a substantially rectangular box with a mid-plane extended along an elongated direction of the rectangular box wherein the conducting wire interesting at least twice near said mid-plane.

Abstract translation: 本发明公开了一种电感器，其包括由耐温度系数（TCR）约0.0002毫欧/摄氏度的合金构成的导线，或者更低。 感应线圈具有绕组配置，其被设置为围绕在矩形盒中的中间平面的大致矩形盒中，所述中间平面沿矩形盒的细长方向延伸，其中导线在所述中间平面附近有趣至少两次。

公开(公告)号：US09601412B2

公开(公告)日：2017-03-21

申请号：US13612852

申请日：2012-09-13

Applicant: Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

Inventor： Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

IPC: H01L23/495 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10

CPC classification number: H01L25/162 ,  H01L23/04 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49811 ,  H01L23/49861 ,  H01L23/552 ,  H01L23/645 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention discloses a three-dimensional package structure. The first conductive element comprises a top surface, a bottom surface and a lateral surface. The conductive pattern disposed on the top surface of the first conductive element. A second conductive element is disposed on the conductive pattern. The first conductive element is electrically connected to the conductive pattern, and the second conductive element is electrically connected to the conductive pattern. In one embodiment, the shielding layer is a portion of the patterned conductive layer.