公开(公告)号：US11837585B2

公开(公告)日：2023-12-05

申请号：US17103509

申请日：2020-11-24

Applicant: CREELED, INC.

Inventor： Michael John Bergmann ,  David Todd Emerson ,  Joseph G. Clark ,  Christopher P. Hussell

IPC: H01L23/00 ,  H01L33/62 ,  H01L33/00 ,  H01L33/38 ,  H01L33/48 ,  H01L33/50 ,  H01L33/22 ,  H01L25/075

CPC classification number: H01L25/0756 ,  H01L24/14 ,  H01L24/94 ,  H01L33/0095 ,  H01L33/38 ,  H01L33/486 ,  H01L33/507 ,  H01L33/62 ,  H01L24/81 ,  H01L33/0093 ,  H01L33/22 ,  H01L33/50 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/1403 ,  H01L2224/1411 ,  H01L2224/14051 ,  H01L2224/14131 ,  H01L2224/14155 ,  H01L2224/14177 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81805 ,  H01L2224/81895 ,  H01L2224/94 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2224/13639 ,  H01L2924/00014 ,  H01L2224/13014 ,  H01L2924/00014 ,  H01L2224/81203 ,  H01L2924/00014 ,  H01L2224/81805 ,  H01L2924/00014 ,  H01L2224/81895 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00

Abstract: An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.

公开(公告)号：US20230361249A1

公开(公告)日：2023-11-09

申请号：US18308323

申请日：2023-04-27

Applicant: CreeLED, Inc.

Inventor： Michael Check ,  Michael John Bergmann ,  David Suich ,  Kevin Haberern

IPC: H01L33/38 ,  H01L33/20

CPC classification number: H01L33/385 ,  H01L33/20

Abstract: Light-emitting diode (LED) chips and, more particularly, structures of LED chips with electrically insulating substrates and related methods are disclosed. LED chips include at least one opening that extends through a substrate to provide an electrical pathway to an active LED structure. Another electrical connection may be provided on the active LED structure in a position that forms a vertical contact arrangement. The at least one opening may extend through the substrate and into a portion of the active LED structure to provide increased surface area for the electrical connection. Additional LED chip structures include another opening on the active LED structure that is registered with the opening in the substrate, and electrical connections to a same layer of the active LED structure may be provided within each opening. Related methods include laser drilling the at least one opening in the substrate.

公开(公告)号：US20230411562A1

公开(公告)日：2023-12-21

申请号：US17807885

申请日：2022-06-21

Applicant: CreeLED, Inc.

Inventor： Michael Check ,  Michael John Bergmann ,  Alan Wellford Dillon ,  Kevin Haberern

IPC: H01L33/42 ,  H01L33/58 ,  H01L33/46 ,  H01L33/22 ,  H01L33/00 ,  H01L33/62 ,  H01L33/38

CPC classification number: H01L33/42 ,  H01L33/58 ,  H01L33/46 ,  H01L2933/0025 ,  H01L33/005 ,  H01L33/62 ,  H01L33/382 ,  H01L33/22

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly light-extraction features for LED chips and related methods are disclosed. Light-extraction features include structures formed in or on light-emitting surfaces of substrates. Light-extraction features may include repeating patterns of features with dimensions that, along with reduced substrate thicknesses, provide targeted emission profiles for flip-chip structures, such as Lambertian emission profiles. Dimensions include certain height to width ratios for various substrate thicknesses. Additional light-extraction features with smaller dimensions may be formed along portions or side surfaces of larger light-extraction features.

公开(公告)号：US20210367112A1

公开(公告)日：2021-11-25

申请号：US17325970

申请日：2021-05-20

Applicant: CreeLED, Inc.

Inventor： Michael John Bergmann ,  Kevin Haberern ,  Alan Wellford Dillon

IPC: H01L33/50 ,  H01L23/00 ,  H01L33/22 ,  H01L33/00 ,  H01L33/62 ,  H01L33/48 ,  H01L33/60

Abstract: An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide multiple LED dies that are joined to a single carrier die. The multiple LED dies on the single carrier die are connected in series and/or in parallel by interconnection in the LED dies and/or in the single carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area. Related devices and fabrication methods are described.

公开(公告)号：US11916165B2

公开(公告)日：2024-02-27

申请号：US17062119

申请日：2020-10-02

Applicant: CREELED, INC.

Inventor： Kevin W. Haberern ,  Matthew Donofrio ,  Bennett Langsdorf ,  Thomas Place ,  Michael John Bergmann

IPC: H01L33/08 ,  H01L33/40 ,  H01L25/075 ,  H01L33/46

CPC classification number: H01L33/08 ,  H01L25/0753 ,  H01L33/405 ,  H01L33/46 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: Monolithic LED chips are disclosed comprising a plurality of active regions on a submount, wherein the submount comprises integral electrically conductive interconnect elements in electrical contact with the active regions and electrically connecting at least some of the active regions in series. The submount also comprises an integral insulator element electrically insulating at least some of the interconnect elements and active regions from other elements of the submount. The active regions are mounted in close proximity to one another with at least some of the active regions having a space between adjacent ones of the active regions that is 10 percent or less of the width of one or more of the active regions. The space is substantially not visible when the LED chip is emitting, such that the LED chips emits light similar to a filament.