公开(公告)号：US11837585B2

公开(公告)日：2023-12-05

申请号：US17103509

申请日：2020-11-24

Applicant: CREELED, INC.

Inventor： Michael John Bergmann ,  David Todd Emerson ,  Joseph G. Clark ,  Christopher P. Hussell

IPC: H01L23/00 ,  H01L33/62 ,  H01L33/00 ,  H01L33/38 ,  H01L33/48 ,  H01L33/50 ,  H01L33/22 ,  H01L25/075

CPC classification number: H01L25/0756 ,  H01L24/14 ,  H01L24/94 ,  H01L33/0095 ,  H01L33/38 ,  H01L33/486 ,  H01L33/507 ,  H01L33/62 ,  H01L24/81 ,  H01L33/0093 ,  H01L33/22 ,  H01L33/50 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/1403 ,  H01L2224/1411 ,  H01L2224/14051 ,  H01L2224/14131 ,  H01L2224/14155 ,  H01L2224/14177 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81805 ,  H01L2224/81895 ,  H01L2224/94 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2224/13639 ,  H01L2924/00014 ,  H01L2224/13014 ,  H01L2924/00014 ,  H01L2224/81203 ,  H01L2924/00014 ,  H01L2224/81805 ,  H01L2924/00014 ,  H01L2224/81895 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00

Abstract: An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.

公开(公告)号：US11776938B2

公开(公告)日：2023-10-03

申请号：US17740982

申请日：2022-05-10

Applicant: CreeLED, Inc.

Inventor： John Edmond ,  Matthew Donofrio ,  Jesse Reiherzer ,  Peter Scott Andrews ,  Joseph G. Clark ,  Kevin Haberern

IPC: H01L25/075 ,  H01L25/00 ,  H01L27/15 ,  H01L33/46 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/38 ,  H01L33/44 ,  H01L33/00

CPC classification number: H01L25/0753 ,  H01L25/50 ,  H01L27/156 ,  H01L33/46 ,  H01L33/50 ,  H01L33/502 ,  H01L33/504 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/0093 ,  H01L33/382 ,  H01L33/44 ,  H01L33/508 ,  H01L2933/0033 ,  H01L2933/0058

Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.

公开(公告)号：US11430769B2

公开(公告)日：2022-08-30

申请号：US17092939

申请日：2020-11-09

Applicant: CreeLED, Inc.

Inventor： Troy Gould ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Joseph G. Clark

IPC: H01L33/54 ,  H01L25/075 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62 ,  H01L33/60 ,  H01L33/46

Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.

公开(公告)号：US20220271017A1

公开(公告)日：2022-08-25

申请号：US17740982

申请日：2022-05-10

Applicant: CreeLED, Inc.

Inventor： John Edmond ,  Matthew Donofrio ,  Jesse Reiherzer ,  Peter Scott Andrews ,  Joseph G. Clark ,  Kevin Haberern

IPC: H01L25/075 ,  H01L33/46 ,  H01L33/50 ,  H01L27/15 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L25/00

Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.