-
1.发明申请MAGNETIC SHEET COMPOSITION, MAGNETIC SHEET, AND METHOD FOR PRODUCING MAGNETIC SHEET 审中-公开磁性片组合物，磁性片及其制造方法公开(公告)号：US20140212578A1
公开(公告)日：2014-07-31
申请号：US14227533
申请日：2014-03-27
Applicant: Dexerials Corporation
Inventor： Keisuke ARAMAKI , Yoshihisa Shinya , Katsuhiko Komuro
IPC: H05K9/00
CPC classification number: H05K9/0081 , C08G59/687 , C08K5/20 , C08K5/34924 , C08K5/372 , C08K5/50 , C08L63/00 , H01F1/26 , H01F1/37 , H05K9/0075 , Y10T156/10 , Y10T156/1048
Abstract: To provide a magnetic sheet composition, which contains: a binder; magnetic powder; and a curing agent, wherein the binder contains a thermosetting organic resin, and the curing agent contains a sulfonium borate complex expressed by General Formula 1: where R1 is an aralkyl group, R2 is a lower alkyl group, X is a halogen atom, and n is an integer of 0 to 3.
Abstract translation: 提供一种磁性片组合物，其包含：粘合剂; 磁粉; 和固化剂，其中所述粘合剂含有热固性有机树脂，并且所述固化剂含有由通式1表示的硼酸锍络合物：其中R 1是芳烷基，R 2是低级烷基，X是卤素原子，和 n为0〜3的整数。
-
公开(公告)号：US20230348679A1
公开(公告)日：2023-11-02
申请号：US18025687
申请日：2021-08-06
Applicant: DEXERIALS CORPORATION
Inventor： Keisuke ARAMAKI , Yuma SATO , Yusuke KUBO
CPC classification number: C08J5/18 , C08K7/18 , C08K9/02 , C08J2383/04 , C08K2201/001 , C08K2201/013
Abstract: A thermally conductive sheet includes: a binder resin; and a first thermally conductive filler oriented in a thickness direction of the thermally conductive sheet. The thermally conductive sheet has a contact thermal resistance with regard to an adherend of 0.46° C.·cm2/W or less. The first thermally conductive filler is preferably a fibrous thermally conductive filler and/or a flaky thermally conductive filler. The thermally conductive sheet preferably further includes a second thermally conductive filler which is at least one selected from a group consisting of alumina, aluminum, zinc oxide, boron nitride, aluminum nitride, graphite, and a magnetic powder.
-
公开(公告)号：US20170309542A1
公开(公告)日：2017-10-26
申请号：US15521426
申请日：2015-10-27
Applicant: Dexerials Corporation
Inventor： Keisuke ARAMAKI , Hiroki KANAYA , Masahide DAIMON
IPC: H01L23/373 , B81B3/00
CPC classification number: H01L23/373 , B81B3/0081 , H01L23/3737 , H01L23/433 , H01L2224/16225 , H01L2224/73253 , H01L2924/16152
Abstract: A thermally conductive sheet including a sheet body that is a cured product of a thermally conductive resin composition including a binder resin and carbon fibers covered with insulating coating films, wherein the carbon fibers exposed on a surface of the sheet body are not covered with the insulating coating films and are covered with a component of the binder resin.
-
公开(公告)号：US20240120254A1
公开(公告)日：2024-04-11
申请号：US18276509
申请日：2022-02-09
Applicant: DEXERIALS CORPORATION
Inventor： Keisuke ARAMAKI , Yuma SATO , Yusuke KUBO
IPC: H01L23/373 , H01L23/00 , H01L23/367
CPC classification number: H01L23/3737 , H01L23/3672 , H01L24/32 , H01L2224/29291 , H01L2224/29318 , H01L2224/29324 , H01L2224/29386 , H01L2224/29393 , H01L2224/29399 , H01L2224/32245 , H01L2924/05032 , H01L2924/05432
Abstract: A thermally-conductive sheet includes: a binder; and an anisotropic thermally-conductive filler. The anisotropic thermally-conductive filler is oriented in a thickness direction of the thermally-conductive sheet An arithmetical mean height Sa is 5 μm or less and a maximum height Sz is 50 μm or less on either surface of the thermally-conductive sheet. A dielectric breakdown voltage of the thermally-conductive sheet is 0.5 kV/mm or higher.
-
公开(公告)号：US20240010898A1
公开(公告)日：2024-01-11
申请号：US18021595
申请日：2021-08-03
Applicant: DEXERIALS CORPORATION
Inventor： Yuma SATO , Keisuke ARAMAKI , Yusuke KUBO
CPC classification number: C09K5/14 , C08K7/00 , C08L83/04 , C08K2201/001
Abstract: Provided is a thermally conductive sheet which is highly flexible and of which the thermal resistance value has small load dependency. A thermally conductive sheet 1 contains a curable resin composition 2, a flaky thermally conductive filler 3, and a non-flaky thermally conductive filler 4, wherein the amount of change between the thermal resistance value at load of 1 kgf/cm2 and the thermal resistance value at load in a range greater than 1 kgf/cm2 and not greater than 3 kgf/cm2 is not greater than 0.4° C.·cm2/W, and the amount of change between the compression rate at load of 3 kgf/cm2 and the compression rate at load of 1 kgf/cm2 is not less than 20%.
-
Patent Agency Ranking
公开(公告)号：US20220173494A1
公开(公告)日：2022-06-02
申请号：US17593631
申请日：2020-02-27
Applicant: Dexerials Corporation
Inventor： Sergey BOLOTOV , Hiroyuki RYOSON , Keisuke ARAMAKI , Yusuke KUBO
Abstract: The disclosure aims at providing an antenna array for 5G communications that has superior thermal dissipation and crosstalk suppression effect. To achieve the above-described object, an antenna array 1 for 5G communications according to the disclosure includes a substrate 10; at least one high-frequency semiconductor device 20, a noise-suppressing thermally conductive sheet 20, and a first thermal dissipation member 41 sequentially formed on one surface 10a of the substrate 10; and at least one antenna 50 and a second thermal dissipation member 42 sequentially formed on the other surface 10b of the substrate 10.
-
7.发明申请公开(公告)号：US20160104657A1
公开(公告)日：2016-04-14
申请号：US14892724
申请日：2014-06-18
Applicant: DEXERIALS CORPORATION
Inventor： Keisuke ARAMAKI , Atsuya YOSHINARI , Takuhiro ISHII , Shin-ichi UCHIDA , Masahiko ITO , Syunsuke UCHIDA
IPC: H01L23/373
CPC classification number: H01L23/3737 , B29C47/0004 , B29C47/0019 , B29C47/0021 , B29C47/0066 , B29C47/8805 , B29C2035/0822 , B29K2995/0013 , C09K5/14 , H01L21/4871 , H01L23/373 , H01L23/3733 , H01L2924/0002 , H01L2924/00
Abstract: A thermally conductive sheet, which contains: a binder; carbon fibers; and an inorganic filler, wherein the thermally conductive sheet is to be sandwiched between a heat source and a heat dissipation member of a semiconductor device, wherein the carbon fibers have an average fiber length of 50 μm to 250 μm, wherein thermal resistance of the thermally conductive sheet is less than 0.17 K·cm2/W, as measured in accordance with ASTM-D5470 with a load of 7.5 kgf/cm2, and wherein the thermally conductive sheet has an average thickness of 500 μm or less.
Abstract translation: 导热片，其包含：粘合剂; 碳纤维; 和无机填料，其中导热片被夹在半导体器件的热源和散热构件之间，其中碳纤维的平均纤维长度为50μm至250μm，其中热的热阻 导电片的负荷为7.5kgf / cm 2时，根据ASTM-D5470测定，小于0.17K·cm 2 / W，导热片的平均厚度为500μm以下。
-
8.发明公开公开(公告)号：US20240124758A1
公开(公告)日：2024-04-18
申请号：US18277122
申请日：2022-01-27
Applicant: DEXERIALS CORPORATION
Inventor： Marina TOBATA , Keisuke ARAMAKI
CPC classification number: C09K5/14 , C08J3/203 , C08J5/18 , C08K3/22 , C08K7/06 , H05K7/2039 , B29K2105/12 , C08J2383/04 , C08K2003/2227 , C08K2201/001
Abstract: A heat-conductive sheet includes a binder resin and a fibrous filler having a major axis and dispersed in the binder resin. The major axis of the fibrous filler is arranged at an angle of 70 to 90 degrees with respect to a surface direction of the heat-conductive sheet when viewed in a cross-section along a thickness direction of the heat-conductive sheet. If the heat-conductive sheet is processed to a shape having a thickness of 2 mm and a diameter of 29 mm, and subject to a compression such that the thickness is decreased by 40% of the thickness before the compression, at room temperature for 24 hours, a difference of an angle of the major axis of the fibrous filler after release of the compression and an angle of the major axis of the fibrous filler before the compression is in a range within 10 degrees.
-
公开(公告)号：US20240117148A1
公开(公告)日：2024-04-11
申请号：US18275450
申请日：2022-01-28
Applicant: DEXERIALS CORPORATION
Inventor： Keisuke ARAMAKI , Yuma SATO , Yusuke KUBO
IPC: C08K3/38 , C08L101/00
CPC classification number: C08K3/38 , C08L101/00 , C08K2003/385 , C08K2201/001 , C08L2203/20
Abstract: A thermally conductive sheet includes a binder resin and boron nitride flakes. The boron nitride flakes are oriented in a thickness direction of the thermally conductive sheet, and both surfaces of the thermally conductive sheet are tacky. A method for manufacturing a thermally conductive sheet includes preparing a thermally conductive composition containing a binder resin and boron nitride flakes. A molded block is formed from the thermally conductive composition. The molded block is sliced into a sheet shape to obtain a thermally conductive sheet precursor. The thermally conductive sheet precursor is pressed to obtain a thermally conductive sheet.
-
10.发明申请公开(公告)号：US20160141223A1
公开(公告)日：2016-05-19
申请号：US14899221
申请日：2014-06-27
Applicant: DEXERIALS CORPORATION
Inventor： Keisuke ARAMAKI , Atsuya YOSHINARI , Takuhiro ISHII , Shinichi UCHIDA , Masahiko ITO
IPC: H01L23/373 , F28F21/02 , H01L21/48
CPC classification number: H01L23/3737 , F28F21/02 , H01L21/4871 , H01L23/3675 , H01L2224/16225 , H01L2224/73253 , H01L2924/0002 , H01L2924/16152 , H01L2924/00
Abstract: Provided is a method of manufacturing a heat conductive sheet that itself is imparted with stickiness and has reduced heat resistance due to improved adhesion to a heat generator and a heat dissipater and that may be fixed provisionally without the need for using an adhesive agent or the like. The method includes the steps of molding a heat conductive resin composition, which includes heat conductive fillers and a binder resin, into a predetermined shape and curing the heat conductive resin composition to obtain a molded product of the heat conductive resin composition, cutting the molded product into sheets to obtain a molded product sheet, and coating an entire surface of a sheet main body (7) with an uncured component (8) of the binder resin oozing from the sheet main body (7).
Abstract translation: 提供一种制造导热片的方法，其本身具有粘性并且由于对发热体和散热器的粘附性的改善而具有降低的耐热性，并且可以暂时固定而不需要使用粘合剂等 。 该方法包括将包含导热填料和粘合剂树脂的导热性树脂组合物成型为规定形状，使导热性树脂组合物固化，得到导热性树脂组合物的成型体，切断成型体 制成片状物，用片材主体（7）渗出的粘合剂树脂的未固化成分（8）涂布片主体（7）的整个表面。
-
-
-
-
-
-
-
-
-
Search Results
21
records
(took 0.02 seconds)
