公开(公告)号：US10373926B2

公开(公告)日：2019-08-06

申请号：US15926210

申请日：2018-03-20

Applicant: DEXERIALS CORPORATION

Inventor： Kouichi Sato ,  Yasushi Akutsu

IPC: G02F1/1345 ,  H01L23/00 ,  C09J9/02 ,  B32B7/12 ,  C09J7/00 ,  C09J7/10 ,  B29C35/08 ,  B29C59/02 ,  B29C71/04 ,  B32B3/30 ,  B32B33/00 ,  B32B27/08 ,  B32B27/20 ,  B32B27/30 ,  B32B27/36 ,  B32B27/38 ,  B32B3/08 ,  C08K3/08 ,  B29K63/00 ,  B29L9/00 ,  B29L31/34

Abstract: To reduce substrate warp occurring after connection an anisotropic conductive film is used. An anisotropic conductive film has: a first insulating adhesive layer; a second insulating adhesive layer; and a conductive particle-containing layer sandwiched by the first insulating adhesive layer and the second insulating adhesive layer and having conductive particles contained in an insulating adhesive, wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and, the conductive particle-containing layer, a portion thereof below the conductive particles and in contact with the second insulating adhesive layer has a lower degree of cure than other portions thereof.

公开(公告)号：US09960139B2

公开(公告)日：2018-05-01

申请号：US14428582

申请日：2013-09-17

Applicant: DEXERIALS CORPORATION

Inventor： Kouichi Sato ,  Yasushi Akutsu

IPC: H01L23/00 ,  B29C71/04 ,  G02F1/1345 ,  B23B3/30 ,  C09J9/02 ,  B29C59/02 ,  B32B33/00 ,  C09J7/00 ,  B32B3/30 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/30 ,  B32B27/36 ,  B32B27/38 ,  B32B3/08 ,  C08K3/08 ,  B29K63/00 ,  B29L9/00 ,  B29L31/34 ,  B29C35/08

CPC classification number: H01L24/28 ,  B29C59/02 ,  B29C71/04 ,  B29C2035/0827 ,  B29C2059/028 ,  B29K2063/00 ,  B29L2009/003 ,  B29L2031/34 ,  B32B3/08 ,  B32B3/30 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/308 ,  B32B27/36 ,  B32B27/38 ,  B32B33/00 ,  B32B2255/205 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/706 ,  B32B2457/00 ,  B32B2457/202 ,  C08K3/08 ,  C08K2201/001 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  G02F1/13452 ,  G02F1/13454 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2711 ,  H01L2224/2712 ,  H01L2224/27334 ,  H01L2224/29076 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/29195 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29391 ,  H01L2224/29393 ,  H01L2224/29394 ,  H01L2224/29395 ,  H01L2224/294 ,  H01L2224/29486 ,  H01L2224/29494 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75301 ,  H01L2224/81488 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83488 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/83907 ,  H01L2924/01006 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0543 ,  H01L2924/0544 ,  H01L2924/0549 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/381 ,  Y10T156/1039 ,  Y10T428/24562 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/069 ,  H01L2924/07025 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/00014 ,  H01L2924/0615

Abstract: To reduce substrate warp occurring after connection an anisotropic conductive film is used. An anisotropic conductive film has: a first insulating adhesive layer; a second insulating adhesive layer; and a conductive particle-containing layer sandwiched by the first insulating adhesive layer and the second insulating adhesive layer and having conductive particles contained in an insulating adhesive, wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and, the conductive particle-containing layer, a portion thereof below the conductive particles and in contact with the second insulating adhesive layer has a lower degree of cure than other portions thereof.

公开(公告)号：US10412837B2

公开(公告)日：2019-09-10

申请号：US14420982

申请日：2013-08-28

Applicant: DEXERIALS CORPORATION

Inventor： Kouichi Sato

IPC: H05K1/16 ,  H05K3/32 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40 ,  C09D123/08 ,  C09J123/08

Abstract: An anisotropic conductive film including conductive particles arranged uniformly in a single layer and capable of supporting fine-pitch connection is produced by: drying a coating film of a particle dispersion in which conductive particles are dispersed in a dilute solution of a thermoplastic resin that forms a coating after drying, whereby a conductive particle-containing layer is formed in which the coated conductive particles coated with the dried coating of the dilute solution of the thermoplastic resin and arranged in a single layer stick to the dried coating film; and laminating an insulating resin layer onto the conductive particle-containing layer.

公开(公告)号：US10368449B2

公开(公告)日：2019-07-30

申请号：US14420982

申请日：2013-08-28

Applicant: DEXERIALS CORPORATION

Inventor： Kouichi Sato

IPC: H05K1/16 ,  H05K3/32 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40 ,  C09D123/08 ,  C09J123/08

Abstract: An anisotropic conductive film including conductive particles arranged uniformly in a single layer and capable of supporting fine-pitch connection is produced by: drying a coating film of a particle dispersion in which conductive particles are dispersed in a dilute solution of a thermoplastic resin that forms a coating after drying, whereby a conductive particle-containing layer is formed in which the coated conductive particles coated with the dried coating of the dilute solution of the thermoplastic resin and arranged in a single layer stick to the dried coating film; and laminating an insulating resin layer onto the conductive particle-containing layer.

公开(公告)号：US10306771B2

公开(公告)日：2019-05-28

申请号：US14420982

申请日：2013-08-28

Applicant: DEXERIALS CORPORATION

Inventor： Kouichi Sato

IPC: H05K1/16 ,  H05K3/32 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40 ,  C09D123/08 ,  C09J123/08

Abstract: An anisotropic conductive film including conductive particles arranged uniformly in a single layer and capable of supporting fine-pitch connection is produced by: drying a coating film of a particle dispersion in which conductive particles are dispersed in a dilute solution of a thermoplastic resin that forms a coating after drying, whereby a conductive particle-containing layer is formed in which the coated conductive particles coated with the dried coating of the dilute solution of the thermoplastic resin and arranged in a single layer stick to the dried coating film; and laminating an insulating resin layer onto the conductive particle-containing layer.

公开(公告)号：US20150243626A1

公开(公告)日：2015-08-27

申请号：US14428582

申请日：2013-09-17

Applicant: DEXERIALS CORPORATION

Inventor： Kouichi Sato ,  Yasushi Akutsu

IPC: H01L23/00 ,  B29C71/04 ,  G02F1/1345 ,  B32B33/00 ,  C09J9/02 ,  B29C59/02 ,  B32B3/30

CPC classification number: H01L24/28 ,  B29C59/02 ,  B29C71/04 ,  B29C2035/0827 ,  B29C2059/028 ,  B29K2063/00 ,  B29L2009/003 ,  B29L2031/34 ,  B32B3/08 ,  B32B3/30 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/308 ,  B32B27/36 ,  B32B27/38 ,  B32B33/00 ,  B32B2255/205 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/706 ,  B32B2457/00 ,  B32B2457/202 ,  C08K3/08 ,  C08K2201/001 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  G02F1/13452 ,  G02F1/13454 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2711 ,  H01L2224/2712 ,  H01L2224/27334 ,  H01L2224/29076 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/29195 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29391 ,  H01L2224/29393 ,  H01L2224/29394 ,  H01L2224/29395 ,  H01L2224/294 ,  H01L2224/29486 ,  H01L2224/29494 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75301 ,  H01L2224/81488 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83488 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/83907 ,  H01L2924/01006 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0543 ,  H01L2924/0544 ,  H01L2924/0549 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/381 ,  Y10T156/1039 ,  Y10T428/24562 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/069 ,  H01L2924/07025 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/00014 ,  H01L2924/0615

Abstract: To reduce substrate warp occurring after connection an anisotropic conductive film is used. An anisotropic conductive film has: a first insulating adhesive layer; a second insulating adhesive layer; and a conductive particle-containing layer sandwiched by the first insulating adhesive layer and the second insulating adhesive layer and having conductive particles contained in an insulating adhesive, wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and, the conductive particle-containing layer, a portion thereof below the conductive particles and in contact with the second insulating adhesive layer has a lower degree of cure than other portions thereof.

Abstract translation: 为了减少连接后发生的基板翘曲，使用各向异性导电膜。 各向异性导电膜具有：第一绝缘粘合剂层; 第二绝缘粘合剂层; 以及由所述第一绝缘粘合剂层和所述第二绝缘粘合剂层夹持的导电性粒子层，并且在所述导电性粒子含有层和所述第一绝缘性粘合剂层之间含有气泡， ，导电性粒子含有层的导电性粒子以下的部分与第二绝缘性粘合剂层的接触度比其它部分的固化度低。