公开(公告)号：US20180012751A1

公开(公告)日：2018-01-11

申请号：US15712595

申请日：2017-09-22

Applicant: FUJIFILM Corporation

Inventor： Yoshitaka KAMOCHI ,  Yu IWAI ,  Ichiro KOYAMA ,  Atsushi NAKAMURA

IPC: H01L21/02 ,  H01L21/304 ,  C09J125/04 ,  C09J5/06 ,  C09J153/00 ,  C09J121/00 ,  C09J201/00

CPC classification number: H01L21/022 ,  C09J5/06 ,  C09J121/00 ,  C09J125/04 ,  C09J153/00 ,  C09J201/00 ,  H01L21/02057 ,  H01L21/02304 ,  H01L21/304 ,  H01L21/31133 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386

Abstract: Provided are a kit and a laminate which are capable of suppressing residues derived from a temporary adhesive in manufacture of a semiconductor. The kit for manufacturing a semiconductor device includes a composition which contains a solvent A; a composition which contains a solvent B; and a composition which contains a solvent C, in which the kit is used when a temporary adhesive layer is formed on a first substrate using a temporary adhesive composition containing a temporary adhesive and the solvent A, at least some of an excessive amount of the temporary adhesive on the first substrate is washed using the composition containing the solvent B, a laminate is manufactured by bonding the first substrate and a second substrate through the temporary adhesive layer, one of the first substrate and the second substrate is peeled off from the laminate at a temperature of lower than 40° C., and then the temporary adhesive remaining on at least one of the first substrate or the second substrate is washed using the composition containing the solvent C, and the solvent A, the solvent B, and the solvent C respectively satisfy a predetermined vapor pressure and a predetermined saturated solubility.

公开(公告)号：US20150093879A1

公开(公告)日：2015-04-02

申请号：US14567471

申请日：2014-12-11

Applicant: FUJIFILM Corporation

Inventor： Kazuhiro FUJIMAKI ,  Ichiro KOYAMA ,  Atsushi NAKAMURA ,  Yu IWAI ,  Shiro TAN

IPC: C09J7/02 ,  H01L21/302 ,  H01L21/683

CPC classification number: H01L21/302 ,  C09J7/20 ,  C09J7/38 ,  C09J133/02 ,  C09J133/12 ,  C09J161/06 ,  C09J175/14 ,  C09J175/16 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2475/00 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/13 ,  Y10T428/2852

Abstract: The invention is directed to a temporary adhesive for production of semiconductor device, containing (A) a polymer compound having an acid group, (B) a diluent, and (C) a solvent, an adhesive support including a substrate and an adhesive layer formed from the temporary adhesive for production of semiconductor device, and a production method of semiconductor device having a member processed including: adhering a first surface of a member to be processed to a substrate through an adhesive layer formed from the temporary adhesive for production of semiconductor device as claimed; conducting a mechanical or chemical processing on a second surface which is different from the first surface of the member to be processed to obtain the member processed; and releasing the first surface of the member processed from the adhesive layer.

Abstract translation: 本发明涉及一种用于生产半导体器件的临时粘合剂，其包含（A）具有酸基的聚合物化合物，（B）稀释剂，和（C）溶剂，包含基底的粘合剂载体和形成的粘合剂层 从半导体装置的制造用临时粘合剂和具有加工部件的半导体装置的制造方法，其特征在于，包括：通过由用于制造半导体装置的临时粘合剂形成的粘合剂层将待加工的部件的第一表面粘附到基板上 如所要求的; 在不同于待加工构件的第一表面的第二表面上进行机械或化学处理以获得处理的构件; 并释放从粘合剂层加工的构件的第一表面。

公开(公告)号：US20230350305A1

公开(公告)日：2023-11-02

申请号：US18337442

申请日：2023-06-20

Applicant: FUJIFILM Corporation

Inventor： Atsuyasu NOZAKI ,  Misaki TAKASHIMA ,  Naoki SATO ,  Atsushi NAKAMURA

IPC: G03F7/30 ,  G03F7/20 ,  H01L21/027 ,  G03F7/40 ,  G03F7/038 ,  G03F7/32

CPC classification number: G03F7/3057 ,  G03F7/2051 ,  H01L21/0275 ,  G03F7/40 ,  G03F7/0387 ,  G03F7/327

Abstract: There is provided a manufacturing method for a cured substance, which makes it possible to obtain a cured substance having excellent breaking elongation, a manufacturing method for a laminate, including the manufacturing method for a cured substance, a manufacturing method for a semiconductor device, including the manufacturing method for a cured substance or the manufacturing method for a laminate, and there is provided a treatment liquid that is used in the manufacturing method for a cured substance.
The manufacturing method for a cured substance includes a film forming step of applying a resin composition containing a precursor of a cyclization resin onto a base material to form a film, a treatment step of bringing a treatment liquid into contact with the film, and a heating step of heating the film after the treatment step, in which the treatment liquid contains at least one compound selected from the group consisting of a basic compound having an amide group and a base generator having an amide group.

公开(公告)号：US20220075265A1

公开(公告)日：2022-03-10

申请号：US17479439

申请日：2021-09-20

Applicant: FUJIFILM Corporation

Inventor： Atsushi NAKAMURA

IPC: G03F7/09 ,  G03F7/038 ,  C08L51/00 ,  G03F7/32 ,  C08F216/06 ,  C08F226/10

Abstract: Provided is a laminate that includes a base, an organic layer, a protective layer and a photo-sensitive layer in this order, the protective layer containing a resin, the resin having a branched part and a molecular chain bonded to the branched part, the molecular chain has at least one repeating unit from among repeating units represented by any of Formula (1-1) to Formula (5-1) below, the photo-sensitive layer being intended for development with use of a developing solution, and the protective layer being intended for stripping with use of a stripping solution; a composition intended for use in forming the protective layer or the photo-sensitive layer contained in the laminate; and, a laminate forming kit intended for use in forming the laminate, in the formula, R11 represents a hydrogen atom or a methyl group, R21 represents a hydrogen atom or a methyl group, each of R31 to R33 independently represents a substituent or a hydrogen atom, each of R41 to R49 independently represents a substituent or a hydrogen atom, and each of R51 to R54 independently represents a hydrogen atom or a substituent.

公开(公告)号：US20170198176A1

公开(公告)日：2017-07-13

申请号：US15468288

申请日：2017-03-24

Applicant: FUJIFILM Corporation

Inventor： Yoshitaka KAMOCHI ,  Ichiro KOYAMA ,  Yu IWAI ,  Atsushi NAKAMURA ,  Mitsuru SAWANO

IPC: C09J11/06 ,  H01L21/683 ,  C09J153/02 ,  C09J7/00 ,  B32B25/04 ,  B32B7/12

CPC classification number: C09J11/06 ,  B32B3/08 ,  B32B7/04 ,  B32B7/06 ,  B32B7/12 ,  B32B9/043 ,  B32B15/06 ,  B32B25/04 ,  B32B25/08 ,  B32B25/12 ,  B32B25/14 ,  B32B25/16 ,  B32B25/18 ,  B32B25/20 ,  B32B27/06 ,  B32B27/08 ,  B32B27/20 ,  B32B27/26 ,  B32B27/28 ,  B32B27/285 ,  B32B27/286 ,  B32B27/304 ,  B32B27/306 ,  B32B27/325 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B27/42 ,  B32B2250/03 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/51 ,  B32B2307/58 ,  B32B2307/584 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2457/14 ,  C08J3/092 ,  C08J5/18 ,  C08J2309/06 ,  C08J2353/02 ,  C09J7/00 ,  C09J7/10 ,  C09J121/00 ,  C09J153/025 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2453/00 ,  H01L21/02 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386

Abstract: Provided are a composition which has good elastomer solubility, is thus capable of increasing a concentration of solid contents, and is capable of forming a film having excellent drying properties, surface morphology, and heat resistance, a process for producing a sheet, a sheet, a laminate, and a laminate with a device wafer.This composition includes an elastomer having a 5% thermal mass reduction temperature of 375° C. or higher when heated at an elevation rate of 20° C./min from 25° C., a solvent represented by the following General Formula (1) and having a boiling point of 160° C. or higher, and a solvent having a boiling point of lower than 120° C. In General Formula (1), R1 to R6 each independently represent a hydrogen atom or an aliphatic hydrocarbon group.

公开(公告)号：US20160075922A1

公开(公告)日：2016-03-17

申请号：US14953697

申请日：2015-11-30

Applicant: FUJIFILM Corporation

Inventor： Yu IWAI ,  Kazuhiro FUJIMAKI ,  Ichiro KOYAMA ,  Atsushi NAKAMURA

IPC: C09J151/00 ,  H01L21/683

CPC classification number: C09J151/003 ,  C09J4/00 ,  C09J5/04 ,  C09J5/06 ,  C09J125/14 ,  C09J133/12 ,  C09J133/16 ,  C09J183/06 ,  H01L21/304 ,  H01L21/306 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: By a temporary adhesive for production of semiconductor device containing (A) a radical polymerizable monomer or oligomer containing a fluorine atom or a silicon atom, (B) a polymer compound, and (C) a radical polymerization initiator, a temporary adhesive for production of semiconductor device, which is excellent in coating property, which reduces a problem of generation of gas therefrom in the temporary support even under high temperature condition when the member to be processed (for example, a semiconductor wafer) is subjected to a mechanical or chemical processing, and further which can easily release the temporary support for the member processed without imparting damage to the member processed even after being subjected to a process at a high temperature, and an adhesive support and a production method of semiconductor device using the same are provided.

公开(公告)号：US20150221881A1

公开(公告)日：2015-08-06

申请号：US14689216

申请日：2015-04-17

Applicant: FUJIFILM CORPORATION

Inventor： Yu IWAI ,  Atsushi NAKAMURA ,  Yoshitaka KAMOCHI ,  Masafumi YOSHIDA

IPC: H01L51/00 ,  C09D101/00 ,  G03F7/20 ,  C09D105/00

CPC classification number: H01L51/0093 ,  C09D101/00 ,  C09D105/00 ,  G03F7/027 ,  G03F7/0388 ,  G03F7/0392 ,  G03F7/11 ,  G03F7/20 ,  G03F7/325 ,  H01L21/02118 ,  H01L21/3065 ,  H01L51/004 ,  H01L51/107 ,  H01L51/448 ,  H01L51/5253 ,  H01L51/56

Abstract: There is provided a resin composition for use in formation of a protective film to protect a substrate or a film formed on the substrate, from a developer containing an organic solvent to be used for development in pattern formation, and which contains two or more kinds of resins in which their main chain structures having a hydroxyl group are different, and contains water, a pattern forming method using the resin composition, and layered products comprising a substrate, an organic semiconductor film on the substrate, and a protective film comprising two or more kinds of resins in which their main chain structures having a hydroxyl group are different, on the organic semiconductor film.

Abstract translation: 提供一种用于形成保护膜的树脂组合物，用于保护基板或形成在基板上的膜与图案形成中用于显影的有机溶剂的显影剂，并且其包含两种或更多种 具有羟基的主链结构不同且含有水的树脂，使用该树脂组合物的图案形成方法，以及包含基板，基板上的有机半导体膜以及包含两个以上的保护膜的层叠体 在有机半导体膜上具有羟基的主链结构不同的树脂种类。

公开(公告)号：US20140318697A1

公开(公告)日：2014-10-30

申请号：US14328191

申请日：2014-07-10

Applicant: FUJIFILM Corporation

Inventor： Shiro TAN ,  Kazuhiro FUJIMAKI ,  Atsushi NAKAMURA ,  Yu IWAI ,  Ichiro KOYAMA

IPC: H01L21/673

CPC classification number: H01L21/673 ,  C09J5/04 ,  C09J7/22 ,  C09J7/35 ,  C09J2205/302 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/13 ,  H01L2221/68331 ,  H01L2221/6834 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A method for manufacturing a semiconductor device with a treated member, includes: subjecting an adhesive support having a substrate and an adhesive layer capable of increasing or decreasing in adhesiveness upon irradiation with an actinic ray or radiation to pattern exposure of the adhesive layer to provide a high adhesive region and a low adhesive region in the adhesive layer, adhering a first surface of a to-be-treated member to the adhesive layer of the adhesive support, applying a mechanical or chemical treatment to a second surface different from the first surface of the to-be-treated member to obtain a treated member, and detaching the first surface of the treated member from the adhesive layer of the adhesive support.

Abstract translation: 一种用于制造具有处理部件的半导体器件的方法，包括：对具有基底的粘合剂支撑体和能够增加或降低粘附性的粘合剂层进行照射时，用光化射线或辐射照射粘合剂层以图案曝光， 高粘合剂区域和粘合剂层中的低粘合剂区域，将被处理构件的第一表面粘附到粘合剂支撑体的粘合剂层上，对不同于第一表面的第二表面施加机械或化学处理 待处理的构件以获得处理的构件，并且将所处理的构件的第一表面从粘合剂支撑体的粘合剂层分离。

公开(公告)号：US20140234761A1

公开(公告)日：2014-08-21

申请号：US14261896

申请日：2014-04-25

Applicant: FUJIFILM Corporation

Inventor： Michihiro SHIRAKAWA ,  Keita KATO ,  Tadahiro ODANI ,  Atsushi NAKAMURA ,  Hidenori TAKAHASHI ,  Kaoru IWATO

IPC: G03F7/095 ,  G03F7/30

CPC classification number: G03F7/095 ,  G03F7/038 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/0757 ,  G03F7/091 ,  G03F7/094 ,  G03F7/11 ,  G03F7/2041 ,  G03F7/30 ,  G03F7/325 ,  H01L21/0271

Abstract: A pattern forming method contains: (i) a step of forming a first film on a substrate by using a first resin composition (I), (ii) a step of forming a second film on the first film by using a second resin composition (II) different from the resin composition (I), (iii) a step of exposing a multi-layered film having the first film and the second film, and (iv) a step of developing the first film and the second film in the exposed multi-layered film by using an organic solvent-containing developer to form a negative pattern.

Abstract translation: 图案形成方法包括：（i）通过使用第一树脂组合物（I）在基材上形成第一膜的步骤，（ii）通过使用第二树脂组合物在第一膜上形成第二膜的步骤 II），（iii）暴露具有第一膜和第二膜的多层膜的步骤，和（iv）在暴露的第一膜和第二膜中显影第一膜和第二膜的步骤 通过使用含有机溶剂的显影剂形成负图案的多层膜。

公开(公告)号：US20180016471A1

公开(公告)日：2018-01-18

申请号：US15711226

申请日：2017-09-21

Applicant: FUJIFILM Corporation

Inventor： Yoshitaka KAMOCHI ,  Yu IWAI ,  Mitsuru SAWANO ,  Ichiro KOYAMA ,  Atsushi NAKAMURA

IPC: C09J7/00 ,  H01L21/683 ,  B32B38/00 ,  B32B37/10 ,  C09J5/04 ,  B32B37/12

CPC classification number: C09J7/00 ,  B32B7/12 ,  B32B27/00 ,  B32B37/10 ,  B32B37/12 ,  B32B38/0012 ,  B32B2307/54 ,  C09J5/04 ,  C09J201/00 ,  C09J2205/30 ,  H01L21/6836 ,  H01L2221/6834 ,  H01L2221/68386

Abstract: To provide a laminate, a temporary adhesion composition, and a temporary adhesion film which are capable of making warpage less likely to occur even when a wafer is thin.Provided is a laminate including, sequentially being adjacent to each other: a first base material; a temporary adhesion film; and a second base material, in which a tensile elastic modulus E of the temporary adhesion film at 25° C. in conformity with JIS K 7161:1994 is in a range of 25 to 2000 MPa, a base material is peeled off by fixing any one of a first base material and a second base material of the laminate at 25° C. and pulling an end portion of the other base material up in a direction perpendicular to the surface of the other base material from an interface with the temporary adhesion film at a speed of 50 mm/min, and the force applied during the pulling is measured using a force gauge and the value is 0.33 N/mm or less.