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    SEMICONDUCTOR PACKAGE AND WIRING BOARD UNIT
    3.
    发明申请
    SEMICONDUCTOR PACKAGE AND WIRING BOARD UNIT 审中-公开
    半导体封装和接线板单元

    公开(公告)号：US20130314877A1

    公开(公告)日：2013-11-28

    申请号：US13849792

    申请日：2013-03-25

    Applicant: FUJITSU LIMITED

    Inventor： Manabu WATANABE ,  Kenji FUKUZONO

    IPC: H01L23/34 ,  H05K1/02

    CPC classification number: H01L23/34 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/4006 ,  H01L23/42 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K1/0271 ,  H05K2201/10734

    Abstract: A semiconductor package includes: a package substrate; a semiconductor chip mounted on the package substrate; a heat conductor that has a body section joined to the semiconductor chip via a metal joining material and a leg section that surrounds the semiconductor chip, the leg section extending from the body section to the package substrate and having an end bonded to the package substrate; and stress reducing members configured to reduce stress exerted on the metal joining material located on the semiconductor chip, the stress reducing members being disposed on the package substrate at positions corresponding to corners of the semiconductor chip inside the leg section and joined to the package substrate and the body section.

    Abstract translation: 半导体封装包括：封装衬底; 安装在所述封装基板上的半导体芯片; 热导体，其具有通过金属接合材料接合到所述半导体芯片的主体部分和围绕所述半导体芯片的所述腿部部分，所述腿部部分从所述主体部分延伸到所述封装基板，并且端部接合到所述封装基板; 以及应力消除部件，其被配置为减小施加在位于所述半导体芯片上的金属接合材料的应力，所述应力减小部件在与所述腿部中的所述半导体芯片的角部对应的位置处配置在所述封装基板上，并且与所述封装基板接合， 身体部位。

    PRINTED WIRING BOARD ASSEMBLY, ELECTRICAL DEVICE, AND METHOD FOR ASSEMBLING PRINTED WIRING BOARD ASSEMBLY
    4.
    发明申请
    PRINTED WIRING BOARD ASSEMBLY, ELECTRICAL DEVICE, AND METHOD FOR ASSEMBLING PRINTED WIRING BOARD ASSEMBLY 有权
    印刷线路板组件，电气设备和组装印刷线路板组件的方法

    公开(公告)号：US20170053850A1

    公开(公告)日：2017-02-23

    申请号：US15238062

    申请日：2016-08-16

    Applicant: FUJITSU LIMITED

    Inventor： Manabu WATANABE

    IPC: H01L23/367 ,  H01L23/31 ,  H05K1/11 ,  H01L21/48 ,  H05K3/36 ,  H05K3/40 ,  H05K3/00 ,  H05K1/18 ,  H01L23/498

    CPC classification number: H01L23/3675 ,  H01L21/4853 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3737 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2924/15159 ,  H01L2924/15311 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/066 ,  H05K2201/09036 ,  H05K2203/041 ,  H05K2203/0415

    Abstract: A printed wiring board assembly includes a first board including a first surface; a second board including a second surface and facing the first surface; a plurality of first electrodes formed on a bottom surface of a recess formed in one of the first and the second surfaces; a plurality of second electrodes formed on the one of the first surface and the second surface and positioned outside the recess; a plurality of first solders each coupled to a respective one of the plurality of first electrodes; and a plurality of second solders each coupled to a respective one of the plurality of second electrodes, wherein the plurality of first electrodes are formed at a larger pitch than a pitch at which the plurality of second electrodes are formed, and a size of each the plurality of first solders is larger than a size of the plurality of second solders.

    Abstract translation: 一种印刷线路板组件，包括：第一板，包括第一表面; 第二板，包括第二表面并面向第一表面; 形成在形成在所述第一表面和所述第二表面中的一个中的凹部的底表面上的多个第一电极; 多个第二电极，形成在所述第一表面和所述第二表面中的一个上并且位于所述凹部的外部; 多个第一焊料，各自耦合到所述多个第一电极中的相应一个; 以及多个第二焊料，各自耦合到所述多个第二电极中的相应一个，其中所述多个第一电极以比形成所述多个第二电极的间距更大的间距形成，并且每个 多个第一焊料大于多个第二焊料的尺寸。

    SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF
    5.
    发明申请
    SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF 有权
    半导体器件及其制造方法

    公开(公告)号：US20140319667A1

    公开(公告)日：2014-10-30

    申请号：US14225721

    申请日：2014-03-26

    Applicant: FUJITSU LIMITED

    Inventor： Manabu WATANABE ,  Kenji FUKUZONO ,  Shunji BABA

    IPC: H01L23/00 ,  H01L23/13

    CPC classification number: H01L24/90 ,  H01L23/13 ,  H01L23/32 ,  H01L23/562 ,  H01L24/81 ,  H01L2924/0002 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/10121 ,  H05K2201/2036 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/0001

    Abstract: A semiconductor apparatus includes: a package substrate on which a semiconductor device is disposed; a mounting board over which the package substrate is mounted; a first restraint that penetrates through the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are separated from each other; and a second restraint that is disposed between the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are closer to each other.

    Abstract translation: 一种半导体装置，具备：配置有半导体装置的封装基板; 安装基板，其上安装有封装基板; 穿过安装板和封装基板的第一限制，并且使安装基板和封装基板在安装基板和封装基板分离的方向上受到限制; 以及设置在安装板和封装基板之间的第二约束，并且在安装基板和封装基板彼此靠近的方向上抑制安装基板和封装基板的变形。

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE MOUNTING STRUCTURE
    6.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE MOUNTING STRUCTURE 有权
    制造半导体器件安装结构的方法

    公开(公告)号：US20140193953A1

    公开(公告)日：2014-07-10

    申请号：US14203912

    申请日：2014-03-11

    Applicant: FUJITSU LIMITED

    Inventor： Manabu WATANABE ,  Masateru KOIDE ,  Kenji FUKUZONO ,  Takashi KANDA

    IPC: H01L21/50

    CPC classification number: H01L21/50 ,  H01L21/82 ,  H01L29/06 ,  H01L2924/15311 ,  H01L2924/19106 ,  H05K1/141 ,  H05K3/323 ,  H05K3/368 ,  H05K2201/2018

    Abstract: A semiconductor device mounting structure includes: a substrate with an opening provided therein; a frame member with a frame body and a protruding portion that protrudes from the frame body, the frame body being formed and accommodated in a groove around the opening; a coreless substrate provided above the substrate and supported by the protruding portion of the frame member; and semiconductor elements provided on the coreless substrate.

    Abstract translation: 半导体器件安装结构包括：其中设置有开口的基板; 框架构件，其具有框架体和从框架体突出的突出部分，框体形成并容纳在围绕开口的凹槽中; 无芯基板，设置在所述基板的上方并由所述框架部件的突出部支撑; 以及设置在无芯基板上的半导体元件。

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